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Class Information
Number: 257/E23.127
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by arrangement or shape (epo) > Device being completely enclosed (epo) > Sealing arrangements between parts, e.g., adhesion promoters (epo)
Description: This subclass is indented under subclass E23.124. This subclass is substantially the same in scope as ECLA classification H01L23/31H6.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8686553 Semiconductor device and a method of manufacturing the same Apr. 1, 2014
8680686 Method and system for thin multi chip stack package with film on wire and copper wire Mar. 25, 2014
8674498 MEMS package and method for the production thereof Mar. 18, 2014
8659157 Adhesive composition for producing semiconductor device and adhesive sheet for producing semiconductor device Feb. 25, 2014
8642391 Self-assembly of chips on a substrate Feb. 4, 2014
8644125 Seek scan probe (SSP) cantilever to mover wafer bond stop Feb. 4, 2014
8575748 Wafer-level packaging with compression-controlled seal ring bonding Nov. 5, 2013
8450861 Integrated circuit device with semiconductor device components embedded in plastic housing composition May. 28, 2013
8368233 Semiconductor device with improved resin configuration Feb. 5, 2013
8334582 Protective seal ring for preventing die-saw induced stress Dec. 18, 2012
8294260 Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus Oct. 23, 2012
8268673 Stacked electronic component and manufacturing method thereof Sep. 18, 2012
8232658 Stackable integrated circuit package system with multiple interconnect interface Jul. 31, 2012
8058110 Plating method, semiconductor device fabrication method and circuit board fabrication method Nov. 15, 2011
8018030 Semiconductor chip with seal ring and sacrificial corner pattern Sep. 13, 2011
7999366 Micro-component packaging process and set of micro-components resulting from this process Aug. 16, 2011
7993984 Electronic device and manufacturing method Aug. 9, 2011
7982319 Semiconductor device with improved resin configuration Jul. 19, 2011
7943412 Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters May. 17, 2011
7927998 Plating method, semiconductor device fabrication method and circuit board fabrication method Apr. 19, 2011
7910405 Semiconductor device having adhesion increasing film to prevent peeling Mar. 22, 2011
7897436 Process for packaging micro-components using a matrix Mar. 1, 2011
7880275 Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device Feb. 1, 2011
7880316 Dicing die-bonding film and process for producing semiconductor device Feb. 1, 2011
7863726 Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof Jan. 4, 2011
7834460 Method for manufacturing an electronic component and corresponding electronic component Nov. 16, 2010
7768119 Carrier structure embedded with semiconductor chip Aug. 3, 2010
7763959 Heat slug for package structure Jul. 27, 2010
7728425 Seal of fluid port Jun. 1, 2010
7727819 Process for producing a functional device-mounted module Jun. 1, 2010
7723846 Power semiconductor module and method of manufacturing the same May. 25, 2010
7714403 Image sensor using back-illuminated photodiode and method of manufacturing the same May. 11, 2010
7700958 Light emitting device having pixel portion surrounded by first sealing material and covered with second sealing material Apr. 20, 2010
7675186 IC package with a protective encapsulant and a stiffening encapsulant Mar. 9, 2010
7670940 Plating method, semiconductor device fabrication method and circuit board fabrication method Mar. 2, 2010
7667279 Semiconductor device Feb. 23, 2010
7656044 Semiconductor device with improved resin configuration Feb. 2, 2010
7649235 Electronic component package Jan. 19, 2010
7645636 Semiconductor device and method for producing it, and use of an electrospinning method Jan. 12, 2010
7638880 Chip package Dec. 29, 2009
7638887 Package structure and fabrication method thereof Dec. 29, 2009
7633169 Chip package structure Dec. 15, 2009
7629695 Stacked electronic component and manufacturing method thereof Dec. 8, 2009
7608911 Semiconductor device package having a semiconductor element with a roughened surface Oct. 27, 2009
7605448 Semiconductor device with seal ring Oct. 20, 2009
7528001 Method of manufacturing a CMOS image sensor May. 5, 2009
7488661 Device and method for improving interface adhesion in thin film structures Feb. 10, 2009
7468293 Method for the production of window elements which can be soldered into a housing in a hermetically tight manner and of a window element sealing a housing Dec. 23, 2008
7466018 MEMS device wafer-level package Dec. 16, 2008
7443024 Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same Oct. 28, 2008

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