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Class Information
Number: 257/E23.126
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by arrangement or shape (epo) > Device being completely enclosed (epo) > Double encapsulation or coating and encapsulation (epo)
Description: This subclass is indented under subclass E23.124. This subclass is substantially the same in scope as ECLA classification H01L23/31H4.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7417330 |
Semiconductor device packaged into chip size and manufacturing method thereof |
Aug. 26, 2008 |
| 7387948 |
Structure and method of forming a semiconductor material wafer |
Jun. 17, 2008 |
| 7372139 |
Semiconductor chip package |
May. 13, 2008 |
| 7294529 |
Method for embedding a component in a base |
Nov. 13, 2007 |
| 7273770 |
Compliant passivated edge seal for low-k interconnect structures |
Sep. 25, 2007 |
| 7274110 |
Semiconductor component having a CSP housing |
Sep. 25, 2007 |
| 7227252 |
Semiconductor component having stacked, encapsulated dice and method of fabrication |
Jun. 5, 2007 |
| 7170188 |
Package stress management |
Jan. 30, 2007 |
| 7161252 |
Module component |
Jan. 9, 2007 |
| 7098544 |
Edge seal for integrated circuit chips |
Aug. 29, 2006 |
| 7071034 |
Method of making semiconductor device |
Jul. 4, 2006 |
| 7067905 |
Packaged microelectronic devices including first and second casings |
Jun. 27, 2006 |
| 7008826 |
Lead-frame-based semiconductor package and fabrication method thereof |
Mar. 7, 2006 |
| 7008822 |
Method for fabricating semiconductor component having stacked, encapsulated dice |
Mar. 7, 2006 |
| 6998701 |
Resin sealing-type semiconductor device and method for manufacturing the same |
Feb. 14, 2006 |
| 6992400 |
Encapsulated electronics device with improved heat dissipation |
Jan. 31, 2006 |
| 6982482 |
Packaging of solid state devices |
Jan. 3, 2006 |
| 6981585 |
Surface package type semiconductor package and method of producing semiconductor memory |
Jan. 3, 2006 |
| 6974727 |
Method of manufacturing a hybrid integrated circuit device |
Dec. 13, 2005 |
| 6975026 |
Package for mounting semiconductor device |
Dec. 13, 2005 |
| 6967401 |
Semiconductor device, semiconductor module and hard disk |
Nov. 22, 2005 |
| 6963133 |
Semiconductor device and method for manufacturing semiconductor device |
Nov. 8, 2005 |
| 6963125 |
Electronic device packaging |
Nov. 8, 2005 |
| 6958259 |
Method of stacking semiconductor element in a semiconductor device |
Oct. 25, 2005 |
| 6956297 |
Electronic circuit unit that is easy to manufacture and method of manufacturing the same |
Oct. 18, 2005 |
| 6953708 |
Method of producing a semiconductor component having a compliant buffer layer |
Oct. 11, 2005 |
| 6946730 |
Semiconductor device having heat conducting plate |
Sep. 20, 2005 |
| 6943457 |
Semiconductor package having polymer members configured to provide selected package characteristics |
Sep. 13, 2005 |
| 6940184 |
Semiconductor device with coated semiconductor chip |
Sep. 6, 2005 |
| 6919507 |
Electrical assembly and method for manufacturing the electrical assembly |
Jul. 19, 2005 |
| 6914333 |
Wafer level package incorporating dual compliant layers and method for fabrication |
Jul. 5, 2005 |
| 6911718 |
Double downset double dambar suspended leadframe |
Jun. 28, 2005 |
| 6897094 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
May. 24, 2005 |
| 6884662 |
Enhanced adhesion strength between mold resin and polyimide |
Apr. 26, 2005 |
| 6882050 |
Semiconductor device and method of manufacturing same |
Apr. 19, 2005 |
| 6879030 |
Strengthened window-type semiconductor package |
Apr. 12, 2005 |
| 6875681 |
Wafer passivation structure and method of fabrication |
Apr. 5, 2005 |
| 6875639 |
Semiconductor device and method of manufacturing the same |
Apr. 5, 2005 |
| 6867480 |
Electromagnetic interference package protection |
Mar. 15, 2005 |
| 6855574 |
Stress balanced semiconductor packages, method of fabrication and modified mold segment |
Feb. 15, 2005 |
| 6853064 |
Semiconductor component having stacked, encapsulated dice |
Feb. 8, 2005 |
| 6841866 |
Power semiconductor device |
Jan. 11, 2005 |
| 6835576 |
Magnetic thin film, a magnetic component that uses this magnetic thin film, manufacturing methods for the same, and a power conversion device |
Dec. 28, 2004 |
| 6835592 |
Methods for molding a semiconductor die package with enhanced thermal conductivity |
Dec. 28, 2004 |
| 6833619 |
Thin profile semiconductor package which reduces warpage and damage during laser markings |
Dec. 21, 2004 |
| 6833290 |
Structure and method of forming a multiple leadframe semiconductor device |
Dec. 21, 2004 |
| 6822337 |
Window-type ball grid array semiconductor package |
Nov. 23, 2004 |
| 6818968 |
Integrated circuit package and process for forming the same |
Nov. 16, 2004 |
| 6806565 |
Lead-frame-based semiconductor package and fabrication method thereof |
Oct. 19, 2004 |
| 6803646 |
Semiconductor device having first chip secured within resin layer and second chip secured on resin layer |
Oct. 12, 2004 |
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