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Class Information
Number: 257/E23.126
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by arrangement or shape (epo) > Device being completely enclosed (epo) > Double encapsulation or coating and encapsulation (epo)
Description: This subclass is indented under subclass E23.124. This subclass is substantially the same in scope as ECLA classification H01L23/31H4.










Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8659129 Semiconductor device and method of manufacturing same Feb. 25, 2014
8653652 Semiconductor device, power semiconductor module and power conversion device equipped with power semiconductor module Feb. 18, 2014
8643151 Passivation layer for semiconductor devices Feb. 4, 2014
8618645 Package process and package structure Dec. 31, 2013
8599539 Ceramic chip assembly Dec. 3, 2013
8575646 Creating an LED package with optical elements by using controlled wetting Nov. 5, 2013
8575763 Semiconductor device and method of manufacturing the same Nov. 5, 2013
8476776 Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus Jul. 2, 2013
8461677 Magnetic field sensors and methods for fabricating the magnetic field sensors Jun. 11, 2013
8446000 Package structure and package process May. 21, 2013
8409926 Semiconductor device and method of forming insulating layer around semiconductor die Apr. 2, 2013
8405228 Integrated circuit packaging system with package underfill and method of manufacture thereof Mar. 26, 2013
8405233 Flexible barrier film, method of forming same, and organic electronic device including same Mar. 26, 2013
8399992 Package-on-package type semiconductor package Mar. 19, 2013
8310069 Semiconductor package having marking layer Nov. 13, 2012
8304891 Semiconductor package device, semiconductor package structure, and fabrication methods thereof Nov. 6, 2012
8247253 MEMS package structure and method for fabricating the same Aug. 21, 2012
8247809 Organic light emitting diode display Aug. 21, 2012
8129845 Semiconductor device and method of forming interconnect structure in non-active area of wafer Mar. 6, 2012
8110930 Die backside metallization and surface activated bonding for stacked die packages Feb. 7, 2012
8102040 Integrated circuit package system with die and package combination Jan. 24, 2012
8058109 Method for manufacturing a semiconductor structure Nov. 15, 2011
8053852 Light sensor receiving light from backside Nov. 8, 2011
8008787 Integrated circuit package system with delamination prevention structure Aug. 30, 2011
7999276 Chip-type LED package and light emitting apparatus having the same Aug. 16, 2011
7982298 Package in package semiconductor device Jul. 19, 2011
7906855 Stacked semiconductor package and method of making same Mar. 15, 2011
7875967 Integrated circuit with step molded inner stacking module package in package system Jan. 25, 2011
7867826 Semiconductor device packaged into chip size and manufacturing method thereof Jan. 11, 2011
7868443 Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability Jan. 11, 2011
7868471 Integrated circuit package-in-package system with leads Jan. 11, 2011
7863109 Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof Jan. 4, 2011
7859119 Stacked flip chip die assembly Dec. 28, 2010
7847382 Integrated circuit packaging system with package stacking and method of manufacture thereof Dec. 7, 2010
7812463 Packaging integrated circuits for high stress environments Oct. 12, 2010
7807510 Method of manufacturing chip integrated substrate Oct. 5, 2010
7759774 Shielded structures to protect semiconductor devices Jul. 20, 2010
7741135 Method of manufacturing light emitting display Jun. 22, 2010
7700958 Light emitting device having pixel portion surrounded by first sealing material and covered with second sealing material Apr. 20, 2010
7696082 Semiconductor device manufacturing method, semiconductor device, and wiring board Apr. 13, 2010
7692278 Stacked-die packages with silicon vias and surface activated bonding Apr. 6, 2010
7652385 Semiconductor device and method of manufacturing the same Jan. 26, 2010
7648857 Process for precision placement of integrated circuit overcoat material Jan. 19, 2010
7633157 Microelectronic devices having a curved surface and methods for manufacturing the same Dec. 15, 2009
7633169 Chip package structure Dec. 15, 2009
7598606 Integrated circuit package system with die and package combination Oct. 6, 2009
7564130 Power micro surface-mount device package Jul. 21, 2009
7479705 Semiconductor device Jan. 20, 2009
7456049 Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same Nov. 25, 2008
7435625 Semiconductor device with reduced package cross-talk and loss Oct. 14, 2008

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