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Class Information
Number: 257/E23.125
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by arrangement or shape (epo) > Device being completely enclosed (epo) > Substrate forming part of encapsulation (epo)
Description: This subclass is indented under subclass E23.124. This subclass is substantially the same in scope as ECLA classification H01L23/31H2.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8680665 Encapsulation, MEMS and encapsulation method Mar. 25, 2014
8680692 Carrier, semiconductor package and fabrication method thereof Mar. 25, 2014
8610261 Power semiconductor device Dec. 17, 2013
8575646 Creating an LED package with optical elements by using controlled wetting Nov. 5, 2013
8546922 Wiring board Oct. 1, 2013
8546929 Embedded integrated circuit package-on-package system Oct. 1, 2013
8513796 Package structure, fabricating method thereof, and package-on-package device thereby Aug. 20, 2013
8486744 Multiple bonding in wafer level packaging Jul. 16, 2013
8482116 Semiconductor device having stacked components Jul. 9, 2013
8441111 Stub minimization for multi-die wirebond assemblies with parallel windows May. 14, 2013
8426930 Sensor module Apr. 23, 2013
8399966 Inserts for directing molding compound flow and semiconductor die assemblies Mar. 19, 2013
8318549 Molded semiconductor package having a filler material Nov. 27, 2012
8269332 Semiconductor element mounting board Sep. 18, 2012
8207599 Method and apparatus for directing molding compound flow and resulting semiconductor device packages Jun. 26, 2012
8154047 Solid element device and method for manufacturing the same Apr. 10, 2012
8148790 Thin-film lid MEMS devices and methods Apr. 3, 2012
8134242 Integrated circuit package system with concave terminal Mar. 13, 2012
8076775 Semiconductor package and method for making the same Dec. 13, 2011
7939921 Leadframe May. 10, 2011
7927923 Method and apparatus for directing molding compound flow and resulting semiconductor device packages Apr. 19, 2011
7919841 Mounting structures for integrated circuit modules Apr. 5, 2011
7915084 Method for making a stacked package semiconductor module having packages stacked in a cavity in the module substrate Mar. 29, 2011
7884453 Semiconductor device and manufacturing method thereof Feb. 8, 2011
7847387 Electrical device and method Dec. 7, 2010
7808088 Semiconductor device with improved high current performance Oct. 5, 2010
7750465 Packaged integrated circuit Jul. 6, 2010
7709942 Semiconductor package, including connected upper and lower interconnections May. 4, 2010
7692299 Semiconductor apparatus having improved thermal fatigue life Apr. 6, 2010
7663211 Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture Feb. 16, 2010
7646105 Integrated circuit package system with package substrate having corner contacts Jan. 12, 2010
7608486 Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier Oct. 27, 2009
7605462 Universal substrate for a semiconductor device having selectively activated fuses Oct. 20, 2009
7602055 Semiconductor device and method for fabricating the same Oct. 13, 2009
7598605 Semiconductor device having capacitive insulation means and communication terminal using the device Oct. 6, 2009
7579684 Methods for packing microfeature devices and microfeature devices formed by such methods Aug. 25, 2009
7557438 Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same Jul. 7, 2009
7550830 Stacked semiconductor package having fan-out structure through wire bonding Jun. 23, 2009
7538417 Semiconductor device with signal line having decreased characteristic impedance May. 26, 2009
7514796 Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips Apr. 7, 2009
7511365 Thermal enhanced low profile package structure Mar. 31, 2009
7498656 Electromagnetic shielding structure Mar. 3, 2009
7489027 Accessible electronic storage apparatus Feb. 10, 2009
7482700 Semiconductor device having projection on surface thereof, and method of identifying semiconductor package Jan. 27, 2009
7435993 High temperature, high voltage SiC void-less electronic package Oct. 14, 2008
7425469 Method for encapsulating an electronic component using a foil layer Sep. 16, 2008
7411284 Accessible electronic storage apparatus Aug. 12, 2008
7407832 Method for manufacturing semiconductor package Aug. 5, 2008
7405470 Adaptable electronic storage apparatus Jul. 29, 2008
7378301 Method for molding a small form factor digital memory card May. 27, 2008

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