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Class Information
Number: 257/E23.124
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by arrangement or shape (epo) > Device being completely enclosed (epo)
Description: This subclass is indented under subclass E23.123. This subclass is substantially the same in scope as ECLA classification H01L23/31H.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7618903 |
Soft mold, method of manufacturing the same, and patterning method using the same |
Nov. 17, 2009 |
| 7598605 |
Semiconductor device having capacitive insulation means and communication terminal using the device |
Oct. 6, 2009 |
| 7582951 |
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages |
Sep. 1, 2009 |
| 7569920 |
Electronic component having at least one vertical semiconductor power transistor |
Aug. 4, 2009 |
| 7564142 |
Electronic device and method of manufacturing the same, circuit board, and electronic instrument |
Jul. 21, 2009 |
| 7554179 |
Multi-leadframe semiconductor package and method of manufacture |
Jun. 30, 2009 |
| 7554167 |
Three-dimensional analog input control device |
Jun. 30, 2009 |
| 7550830 |
Stacked semiconductor package having fan-out structure through wire bonding |
Jun. 23, 2009 |
| 7535087 |
Semiconductor device with lead frames |
May. 19, 2009 |
| 7535085 |
Semiconductor package having improved adhesiveness and ground bonding |
May. 19, 2009 |
| 7511365 |
Thermal enhanced low profile package structure |
Mar. 31, 2009 |
| 7489027 |
Accessible electronic storage apparatus |
Feb. 10, 2009 |
| 7476952 |
Semiconductor input control device |
Jan. 13, 2009 |
| 7466018 |
MEMS device wafer-level package |
Dec. 16, 2008 |
| 7449726 |
Power semiconductor apparatus |
Nov. 11, 2008 |
| 7445958 |
Semiconductor device having a leading wiring layer |
Nov. 4, 2008 |
| 7435993 |
High temperature, high voltage SiC void-less electronic package |
Oct. 14, 2008 |
| 7402458 |
Stress relieved flat frame for DMD window |
Jul. 22, 2008 |
| 7371618 |
Method of manufacturing wafer-level chip-size package and molding apparatus used in the method |
May. 13, 2008 |
| 7368391 |
Methods for designing carrier substrates with raised terminals |
May. 6, 2008 |
| 7352070 |
Polymer encapsulated electrical devices |
Apr. 1, 2008 |
| 7332806 |
Thin, thermally enhanced molded package with leadframe having protruding region |
Feb. 19, 2008 |
| 7329620 |
System and method for providing an integrated circuit having increased radiation hardness and reliability |
Feb. 12, 2008 |
| 7327032 |
Semiconductor package accomplishing fan-out structure through wire bonding |
Feb. 5, 2008 |
| 7323769 |
High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package |
Jan. 29, 2008 |
| 7319042 |
Method and apparatus for manufacture and inspection of semiconductor device |
Jan. 15, 2008 |
| 7300824 |
Method of packaging and interconnection of integrated circuits |
Nov. 27, 2007 |
| 7298046 |
Semiconductor package having non-ceramic based window frame |
Nov. 20, 2007 |
| 7276398 |
System and method for hermetically sealing a package |
Oct. 2, 2007 |
| 7247951 |
Chip carrier with oxidation protection layer |
Jul. 24, 2007 |
| 7242085 |
Semiconductor device including a semiconductor chip mounted on a metal base |
Jul. 10, 2007 |
| 7233030 |
Device transfer method and panel |
Jun. 19, 2007 |
| 7230331 |
Chip package structure and process for fabricating the same |
Jun. 12, 2007 |
| 7224053 |
Semiconductor device responsive to different levels of input and output signals and signal processing system using the same |
May. 29, 2007 |
| 7196410 |
Wafer packaging and singulation method |
Mar. 27, 2007 |
| 7190060 |
Three-dimensional stacked semiconductor package device with bent and flat leads and method of making same |
Mar. 13, 2007 |
| 7163838 |
Method and apparatus for forming a DMD window frame with molded glass |
Jan. 16, 2007 |
| 7138707 |
Semiconductor package including leads and conductive posts for providing increased functionality |
Nov. 21, 2006 |
| 7135754 |
Chip type solid electrolytic capacitor having a small size and a simple structure |
Nov. 14, 2006 |
| 7132733 |
Semiconductor device |
Nov. 7, 2006 |
| 7119449 |
Enhancement of underfill physical properties by the addition of thermotropic cellulose |
Oct. 10, 2006 |
| 7074647 |
Semiconductor component comprising leadframe, semiconductor chip and integrated passive component in vertical relationship to each other |
Jul. 11, 2006 |
| 7075816 |
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same |
Jul. 11, 2006 |
| 7067357 |
Semiconductor package and method of fabricating same |
Jun. 27, 2006 |
| 7067904 |
Flip-chip type quad flat package and leadframe |
Jun. 27, 2006 |
| 7067915 |
Electronic device with external contact elements and method for producing a plurality of the devices |
Jun. 27, 2006 |
| 7064001 |
Method of production of semiconductor module with external connection terminal |
Jun. 20, 2006 |
| 7064002 |
Method for fabricating interposers including upwardly protruding dams, semiconductor device assemblies including the interposers |
Jun. 20, 2006 |
| 7064011 |
Semiconductor device fabricating apparatus and semiconductor device fabricating method |
Jun. 20, 2006 |
| 7064428 |
Wafer-level package structure |
Jun. 20, 2006 |
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