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Class Information
Number: 257/E23.124
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by arrangement or shape (epo) > Device being completely enclosed (epo)
Description: This subclass is indented under subclass E23.123. This subclass is substantially the same in scope as ECLA classification H01L23/31H.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.126 Double encapsulation or coating and encapsulation (epo) 332
257/E23.128 Encapsulation having cavity (epo) 164
257/E23.127 Sealing arrangements between parts, e.g., adhesion promoters (epo) 132
257/E23.125 Substrate forming part of encapsulation (epo) 749

Patents under this class:

Patent Number Title Of Patent Date Issued
8703537 System and method to manufacture an implantable electrode Apr. 22, 2014
8686550 Method and apparatus for high pressure sensor device Apr. 1, 2014
8680692 Carrier, semiconductor package and fabrication method thereof Mar. 25, 2014
8680688 Stack package having flexible conductors Mar. 25, 2014
8658465 System and method to manufacture an implantable electrode Feb. 25, 2014
8637976 Semiconductor device with lead terminals having portions thereof extending obliquely Jan. 28, 2014
8637966 Semiconductor device Jan. 28, 2014
8629537 Padless die support integrated circuit package system Jan. 14, 2014
8598696 Multi-surface IC packaging structures Dec. 3, 2013
8558367 Semiconductor module Oct. 15, 2013
8558364 Inductive getter activation for high vacuum packaging Oct. 15, 2013
8552543 Semiconductor package Oct. 8, 2013
8519519 Semiconductor device having die pads isolated from interconnect portion and method of assembling same Aug. 27, 2013
8518752 Integrated circuit packaging system with stackable package and method of manufacture thereof Aug. 27, 2013
8492887 Integrated circuit packaging system with leadframe and method of manufacture thereof Jul. 23, 2013
8486744 Multiple bonding in wafer level packaging Jul. 16, 2013
8482109 Integrated circuit packaging system with dual connection and method of manufacture thereof Jul. 9, 2013
8461677 Magnetic field sensors and methods for fabricating the magnetic field sensors Jun. 11, 2013
8436457 Stub minimization for multi-die wirebond assemblies with parallel windows May. 7, 2013
8421209 Semiconductor device with lead terminals having portions thereof extending obliquely Apr. 16, 2013
8410601 RF package Apr. 2, 2013
8399977 Resin-sealed package and method of producing the same Mar. 19, 2013
8304923 Chip packaging structure Nov. 6, 2012
8304891 Semiconductor package device, semiconductor package structure, and fabrication methods thereof Nov. 6, 2012
8304268 Fabrication method of semiconductor package structure Nov. 6, 2012
8293588 Method of providing an electronic device including dies, a dielectric layer, and an encapsulating layer Oct. 23, 2012
8288873 Stack package having flexible conductors Oct. 16, 2012
8288858 Semiconductor device Oct. 16, 2012
8288211 Wafer level hermetic bond using metal alloy with keeper layer Oct. 16, 2012
8273607 Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof Sep. 25, 2012
8269332 Semiconductor element mounting board Sep. 18, 2012
8241950 System and method to manufacture an implantable electrode Aug. 14, 2012
8217499 Structure to reduce etching residue Jul. 10, 2012
8198740 Semiconductor package structure and encapsulating module for molding the same Jun. 12, 2012
8193622 Thermally enhanced thin semiconductor package Jun. 5, 2012
8169089 Semiconductor device including semiconductor chip and sealing material May. 1, 2012
8115290 Storage medium and semiconductor package Feb. 14, 2012
8115285 Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof Feb. 14, 2012
8110930 Die backside metallization and surface activated bonding for stacked die packages Feb. 7, 2012
8093700 Packaging millimeter wave modules Jan. 10, 2012
8093617 Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure Jan. 10, 2012
8084297 Method of implementing a capacitor in an integrated circuit Dec. 27, 2011
8063470 Method and apparatus for no lead semiconductor package Nov. 22, 2011
8035222 Semiconductor device Oct. 11, 2011
8026591 Semiconductor device with lead terminals having portions thereof extending obliquely Sep. 27, 2011
8022514 Integrated circuit package system with leadfinger support Sep. 20, 2011
8018075 Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package Sep. 13, 2011
8004052 Three-dimensional analog input control device Aug. 23, 2011
7993979 Leadless package system having external contacts Aug. 9, 2011
7982298 Package in package semiconductor device Jul. 19, 2011

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