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Class Information
Number: 257/E23.123
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by arrangement or shape (epo)
Description: This subclass is indented under subclass E23.116. This subclass is substantially the same in scope as ECLA classification H01L23/31.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.124 Device being completely enclosed (epo) 1,221
257/E23.129 Partial encapsulation or coating (epo) 194


Patents under this class:
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Patent Number Title Of Patent Date Issued
8703537 System and method to manufacture an implantable electrode Apr. 22, 2014
8680692 Carrier, semiconductor package and fabrication method thereof Mar. 25, 2014
8658465 System and method to manufacture an implantable electrode Feb. 25, 2014
8633578 Integrated circuit package system with laminate base Jan. 21, 2014
8618637 Semiconductor package using through-electrodes having voids Dec. 31, 2013
8574960 Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill material Nov. 5, 2013
8575646 Creating an LED package with optical elements by using controlled wetting Nov. 5, 2013
8541260 Exposed die overmolded flip chip package and fabrication method Sep. 24, 2013
8530282 Semiconductor device and programming method Sep. 10, 2013
8476748 Exposed die overmolded flip chip package and fabrication method Jul. 2, 2013
8368194 Exposed die overmolded flip chip package Feb. 5, 2013
8324012 Tandem solar cell and fabricating method thereof Dec. 4, 2012
8304891 Semiconductor package device, semiconductor package structure, and fabrication methods thereof Nov. 6, 2012
8288844 Integrated circuit packaging system with package stacking and method of manufacture thereof Oct. 16, 2012
8241950 System and method to manufacture an implantable electrode Aug. 14, 2012
8227913 Power semiconductor module comprising elastic housing for accommodating movement of individual substrate regions on a heat sink Jul. 24, 2012
8217504 Article and panel comprising semiconductor chips, casting mold and methods of producing the same Jul. 10, 2012
8207022 Exposed die overmolded flip chip package method Jun. 26, 2012
8183675 Integrated circuit package-on-package system with anti-mold flash feature May. 22, 2012
8169083 Semiconductor device May. 1, 2012
8106502 Integrated circuit packaging system with plated pad and method of manufacture thereof Jan. 31, 2012
8097477 Method for forming a light-emitting case and related light-emitting module Jan. 17, 2012
8080885 Integrated circuit packaging system with multi level contact and method of manufacture thereof Dec. 20, 2011
8039975 Device comprising a semiconductor component, and a manufacturing method Oct. 18, 2011
8035235 Integrated circuit packaging system with package-on-package and method of manufacture thereof Oct. 11, 2011
8022538 Base package system for integrated circuit package stacking and method of manufacture thereof Sep. 20, 2011
8004052 Three-dimensional analog input control device Aug. 23, 2011
7982298 Package in package semiconductor device Jul. 19, 2011
7960847 Packaging structure of SIP and a manufacturing method thereof Jun. 14, 2011
7919853 Semiconductor package and fabrication method thereof Apr. 5, 2011
7898093 Exposed die overmolded flip chip package and fabrication method Mar. 1, 2011
7893547 Semiconductor package with a support structure and fabrication method thereof Feb. 22, 2011
7880247 Semiconductor input control device Feb. 1, 2011
7880293 Wafer integrated with permanent carrier and method therefor Feb. 1, 2011
7875967 Integrated circuit with step molded inner stacking module package in package system Jan. 25, 2011
7847395 Package and package assembly of power device Dec. 7, 2010
7847414 Chip package structure Dec. 7, 2010
7834470 Semiconductor device and programming method Nov. 16, 2010
7829390 Packaging structure of SIP and a manufacturing method thereof Nov. 9, 2010
7807504 Semiconductor module Oct. 5, 2010
7804166 Integrated circuit package system with stacking module Sep. 28, 2010
7795632 Light emitting diode with direct view optic Sep. 14, 2010
7794127 Light emitting diode having grooves to modulate light emission thereof Sep. 14, 2010
7772657 Three-dimensional force input control device and fabrication Aug. 10, 2010
7759135 Method of forming a sensor node module Jul. 20, 2010
7728389 Semiconductor device and fabrication method for the semiconductor device Jun. 1, 2010
7714453 Interconnect structure and formation for package stacking of molded plastic area array package May. 11, 2010
7652384 Fabricating tall micro structures Jan. 26, 2010
7649235 Electronic component package Jan. 19, 2010
7622311 Inspection of underfill in integrated circuit package Nov. 24, 2009

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