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Class Information
Number: 257/E23.121
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by material, e.g., carbon (epo) > Organic, e.g., plastic, epoxy (epo) > Containing filler (epo)
Description: This subclass is indented under subclass E23.119. This subclass is substantially the same in scope as ECLA classification H01L23/29P4.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8680669 Electronic component, electronic module, and method for manufacturing the same Mar. 25, 2014
8659125 Chipset package structure Feb. 25, 2014
8648479 Epoxy resin composition for semiconductor encapsulant and semiconductor device using the same Feb. 11, 2014
8575749 Semiconductor device and method for fabricating the same Nov. 5, 2013
8575767 Reflow of thermoplastic sheet for passivation of power integrated circuits Nov. 5, 2013
8502399 Resin composition for encapsulating semiconductor and semiconductor device Aug. 6, 2013
8492909 Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof Jul. 23, 2013
8378472 Mounting structure for semiconductor element with underfill resin Feb. 19, 2013
8344485 Anticounterfeiting system and method for integrated circuits Jan. 1, 2013
8318549 Molded semiconductor package having a filler material Nov. 27, 2012
8212369 Semiconductor wafer coated with a filled, spin-coatable material Jul. 3, 2012
8203222 Semiconductor device and method of manufacturing the same Jun. 19, 2012
8148818 Semiconductor device and method for manufacturing the same Apr. 3, 2012
7906847 Semiconductor device Mar. 15, 2011
7851260 Method for manufacturing a semiconductor device Dec. 14, 2010
7839005 Light emitting diode with sealant having filling particles Nov. 23, 2010
7763985 Flip-chip type semiconductor device Jul. 27, 2010
7683412 Semiconductor device having a ferroelectric capacitator Mar. 23, 2010
7642641 Integrated circuit component with passivation layer Jan. 5, 2010
7554197 High frequency IC package and method for fabricating the same Jun. 30, 2009
7498197 Silica nanoparticles thermoset resin compositions Mar. 3, 2009
7432603 Semiconductor encapsulating epoxy resin composition and semiconductor device Oct. 7, 2008
7397139 Epoxy resin molding material for sealing use and semiconductor device Jul. 8, 2008
7382059 Semiconductor package structure and method of manufacture Jun. 3, 2008
7352070 Polymer encapsulated electrical devices Apr. 1, 2008
7332822 Flip chip system with organic/inorganic hybrid underfill composition Feb. 19, 2008
7319276 Substrate for pre-soldering material and fabrication method thereof Jan. 15, 2008
7312536 Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same Dec. 25, 2007
7190082 Low stress flip-chip package for low-K silicon technology Mar. 13, 2007
7071577 Semiconductor device and resin binder for assembling semiconductor device Jul. 4, 2006
7057283 Semiconductor device and method for producing the same Jun. 6, 2006
7034405 Resin component for encapsulating semiconductor and semiconductor device using it Apr. 25, 2006
7009288 Semiconductor component with electromagnetic shielding device Mar. 7, 2006
6998701 Resin sealing-type semiconductor device and method for manufacturing the same Feb. 14, 2006
6982492 No-flow underfill composition and method Jan. 3, 2006
6949822 Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance Sep. 27, 2005
6931725 Circuit component built-in module, radio device having the same, and method for producing the same Aug. 23, 2005
6924171 Bilayer wafer-level underfill Aug. 2, 2005
6913827 Nanocoated primary particles and method for their manufacture Jul. 5, 2005
6902811 Epoxy resin composition excellent in weather resistance and fiber-reinforced composite materials Jun. 7, 2005
6878448 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same Apr. 12, 2005
6867480 Electromagnetic interference package protection Mar. 15, 2005
6847122 System and method for preventing and alleviating short circuiting in a semiconductor device Jan. 25, 2005
6844633 Sealing resin, resin-sealed semiconductor and system-in-package Jan. 18, 2005
6822317 Semiconductor apparatus including insulating layer having a protrusive portion Nov. 23, 2004
6815258 Flip-chip package with underfill having low density filler Nov. 9, 2004
6798072 Flip chip assembly structure for semiconductor device and method of assembling therefor Sep. 28, 2004
6780353 Method for making micromolds Aug. 24, 2004
6770547 Method for producing a semiconductor device Aug. 3, 2004
6770957 Adhesives, adhesive films and electric devices Aug. 3, 2004

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