| |
 |
|
Class Information
Number: 257/E23.121
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by material, e.g., carbon (epo) > Organic, e.g., plastic, epoxy (epo) > Containing filler (epo)
Description: This subclass is indented under subclass E23.119. This subclass is substantially the same in scope as ECLA classification H01L23/29P4.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7554197 |
High frequency IC package and method for fabricating the same |
Jun. 30, 2009 |
| 7498197 |
Silica nanoparticles thermoset resin compositions |
Mar. 3, 2009 |
| 7432603 |
Semiconductor encapsulating epoxy resin composition and semiconductor device |
Oct. 7, 2008 |
| 7397139 |
Epoxy resin molding material for sealing use and semiconductor device |
Jul. 8, 2008 |
| 7382059 |
Semiconductor package structure and method of manufacture |
Jun. 3, 2008 |
| 7352070 |
Polymer encapsulated electrical devices |
Apr. 1, 2008 |
| 7332822 |
Flip chip system with organic/inorganic hybrid underfill composition |
Feb. 19, 2008 |
| 7319276 |
Substrate for pre-soldering material and fabrication method thereof |
Jan. 15, 2008 |
| 7312536 |
Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same |
Dec. 25, 2007 |
| 7190082 |
Low stress flip-chip package for low-K silicon technology |
Mar. 13, 2007 |
| 7071577 |
Semiconductor device and resin binder for assembling semiconductor device |
Jul. 4, 2006 |
| 7057283 |
Semiconductor device and method for producing the same |
Jun. 6, 2006 |
| 7034405 |
Resin component for encapsulating semiconductor and semiconductor device using it |
Apr. 25, 2006 |
| 7009288 |
Semiconductor component with electromagnetic shielding device |
Mar. 7, 2006 |
| 6998701 |
Resin sealing-type semiconductor device and method for manufacturing the same |
Feb. 14, 2006 |
| 6982492 |
No-flow underfill composition and method |
Jan. 3, 2006 |
| 6949822 |
Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance |
Sep. 27, 2005 |
| 6931725 |
Circuit component built-in module, radio device having the same, and method for producing the same |
Aug. 23, 2005 |
| 6924171 |
Bilayer wafer-level underfill |
Aug. 2, 2005 |
| 6913827 |
Nanocoated primary particles and method for their manufacture |
Jul. 5, 2005 |
| 6902811 |
Epoxy resin composition excellent in weather resistance and fiber-reinforced composite materials |
Jun. 7, 2005 |
| 6878448 |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
Apr. 12, 2005 |
| 6867480 |
Electromagnetic interference package protection |
Mar. 15, 2005 |
| 6847122 |
System and method for preventing and alleviating short circuiting in a semiconductor device |
Jan. 25, 2005 |
| 6844633 |
Sealing resin, resin-sealed semiconductor and system-in-package |
Jan. 18, 2005 |
| 6822317 |
Semiconductor apparatus including insulating layer having a protrusive portion |
Nov. 23, 2004 |
| 6815258 |
Flip-chip package with underfill having low density filler |
Nov. 9, 2004 |
| 6798072 |
Flip chip assembly structure for semiconductor device and method of assembling therefor |
Sep. 28, 2004 |
| 6780353 |
Method for making micromolds |
Aug. 24, 2004 |
| 6770547 |
Method for producing a semiconductor device |
Aug. 3, 2004 |
| 6770957 |
Adhesives, adhesive films and electric devices |
Aug. 3, 2004 |
| 6768209 |
UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, MICROELECTRONIC DEVICES HAVING UNDERFILL COMPOUNDS INCLUDING ELECTRICALLY CHARGED FILLER ELEMENTS, AND METHODS OF UNDERFILLI |
Jul. 27, 2004 |
| 6750553 |
Semiconductor device which minimizes package-shift effects in integrated circuits by using a thick metallic overcoat |
Jun. 15, 2004 |
| 6733703 |
Method for controlling the dimensions of bodies made from sinterable materials |
May. 11, 2004 |
| 6720493 |
Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages |
Apr. 13, 2004 |
| 6713867 |
Package for microwave components |
Mar. 30, 2004 |
| 6713177 |
Insulating and functionalizing fine metal-containing particles with conformal ultra-thin films |
Mar. 30, 2004 |
| 6703128 |
Thermally-capacitive phase change encapsulant for electronic devices |
Mar. 9, 2004 |
| 6700073 |
Semiconductor device |
Mar. 2, 2004 |
| 6674172 |
Flip-chip package with underfill having low density filler |
Jan. 6, 2004 |
| 6674178 |
Semiconductor device having dispersed filler between electrodes |
Jan. 6, 2004 |
| 6624504 |
Semiconductor device and method for manufacturing the same |
Sep. 23, 2003 |
| 6611065 |
Connection material |
Aug. 26, 2003 |
| 6599775 |
Method for forming a flip chip semiconductor package, a semiconductor package formed thereby, and a substrate therefor |
Jul. 29, 2003 |
| 6583432 |
Methods and compositions for ionizing radiation shielding |
Jun. 24, 2003 |
| 6569532 |
Epoxy resin compositions and premolded semiconductor packages |
May. 27, 2003 |
| 6538210 |
Circuit component built-in module, radio device having the same, and method for producing the same |
Mar. 25, 2003 |
| 6500685 |
Method for evaluating molding material with dams formed on a semiconductor substrate to define slits for capturing fillers contained in the molding material |
Dec. 31, 2002 |
| 6486006 |
Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection |
Nov. 26, 2002 |
| 6482521 |
Structure with blended polymer conformal coating of controlled electrical resistivity |
Nov. 19, 2002 |
|
|
|
