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Class Information
Number: 257/E23.12
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by material, e.g., carbon (epo) > Organic, e.g., plastic, epoxy (epo) > Organo-silicon compounds, e.g., silicone (epo)
Description: This subclass is indented under subclass E23.119. This subclass is substantially the same in scope as ECLA classification H01L23/29P6.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8643200 Resin composition and transparent encapsulant formed using the same, and electronic device including the encapsulant Feb. 4, 2014
8609472 Process for fabricating electronic components using liquid injection molding Dec. 17, 2013
8558361 Power semiconductor module Oct. 15, 2013
8535989 Embedded semiconductive chips in reconstituted wafers, and systems containing same Sep. 17, 2013
8461685 Substrate comprising a plurality of integrated circuitry die, and a substrate Jun. 11, 2013
8455909 Semiconductor light emitting devices including flexible unitary film on aluminum nitride substrate Jun. 4, 2013
8373286 Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor device Feb. 12, 2013
8319242 Light-emitting semiconductor device, mounted substrate, and fabrication method thereof Nov. 27, 2012
8035236 Semiconductor device comprising high performance encapsulation resins Oct. 11, 2011
8017449 Process for fabricating electronic components using liquid injection molding Sep. 13, 2011
7666715 Radiation-emitting and/or radiation-receiving semiconductor component and method for the production thereof Feb. 23, 2010
7646081 Low-K dielectric material Jan. 12, 2010
7476970 Composition for forming insulating film and method for fabricating semiconductor device Jan. 13, 2009
7319276 Substrate for pre-soldering material and fabrication method thereof Jan. 15, 2008
7090482 Semiconductor device package manufacturing method and semiconductor device package manufactured by the method Aug. 15, 2006
7064088 Method for forming low-k hard film Jun. 20, 2006
7041766 Colorless and transparent polyimidesilicone resin having thermosetting functional groups May. 9, 2006
7042096 Single semiconductor element in a flip chip construction May. 9, 2006
6946198 Solvent-free thermosetting resin composition, process for producing the same, and product therefrom Sep. 20, 2005
6943059 Flip chip mounting method of forming a solder bump on a chip pad that is exposed through an opening formed in a polyimide film that includes utilizing underfill to bond the chip to a substrate Sep. 13, 2005
6921860 Microelectronic component assemblies having exposed contacts Jul. 26, 2005
6881683 Insulation film on semiconductor substrate and method for forming same Apr. 19, 2005
6852650 Insulation film on semiconductor substrate and method for forming same Feb. 8, 2005
6821657 Solvent-free thermosetting resin composition, process for producing the same, and product therefrom Nov. 23, 2004
6800547 Integrated circuit dielectric and method Oct. 5, 2004
6794761 No-flow underfill material Sep. 21, 2004
6784123 Insulation film on semiconductor substrate and method for forming same Aug. 31, 2004
6783692 Heat softening thermally conductive compositions and methods for their preparation Aug. 31, 2004
6724086 Hydrogenated oxidized silicon carbon material Apr. 20, 2004
6706409 Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board Mar. 16, 2004
6653719 Silicone polymer insulation film on semiconductor substrate Nov. 25, 2003
6645643 Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom Nov. 11, 2003
6621173 Semiconductor device having an adhesive and a sealant Sep. 16, 2003
6559520 Siloxan polymer film on semiconductor substrate May. 6, 2003
6531344 High frequency gallium arsenide MMIC die coating method Mar. 11, 2003
6514880 Siloxan polymer film on semiconductor substrate and method for forming same Feb. 4, 2003
6497963 Hydrogenated oxidized silicon carbon material Dec. 24, 2002
6476106 Polyarylene sulfide resin composition for electronic parts encapsulation Nov. 5, 2002
6455445 Silicone polymer insulation film on semiconductor substrate and method for forming the film Sep. 24, 2002
6410463 Method for forming film with low dielectric constant on semiconductor substrate Jun. 25, 2002
6383955 Silicone polymer insulation film on semiconductor substrate and method for forming the film May. 7, 2002
6376923 Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device Apr. 23, 2002
6352945 Silicone polymer insulation film on semiconductor substrate and method for forming the film Mar. 5, 2002
6315936 Encapsulation method using non-homogeneous molding compound pellets Nov. 13, 2001
6265303 Integrated circuit dielectric and method Jul. 24, 2001
6147009 Hydrogenated oxidized silicon carbon material Nov. 14, 2000
6144106 Electronic coatings Nov. 7, 2000
6124407 Silicone composition, method for the preparation thereof, and silicone elastomer Sep. 26, 2000
6091157 Method to improve internal package delamination and wire bond reliability using non-homogeneous molding compound pellets Jul. 18, 2000
6063889 Liquid organopolysiloxane resins, a process for their preparation, low viscosity polydiorganosiloxane compositions containing liquid organopolysiloxane resins and their use May. 16, 2000

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