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Class Information
Number: 257/E23.119
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by material, e.g., carbon (epo) > Organic, e.g., plastic, epoxy (epo)
Description: This subclass is indented under subclass E23.117. This subclass is substantially the same in scope as ECLA classification H01L23/29P.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.121 Containing filler (epo) 199
257/E23.12 Organo-silicon compounds, e.g., silicone (epo) 131

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13

Patent Number Title Of Patent Date Issued
8710682 Materials and methods for stress reduction in semiconductor wafer passivation layers Apr. 29, 2014
8653650 Semiconductor device with acene heat spreader Feb. 18, 2014
8643199 Thermoset polyimides for microelectronic applications Feb. 4, 2014
8592999 Semiconductor chip and method for fabricating the same Nov. 26, 2013
8580605 Reduction of the effects of cap-like projections, due to laser ablation of a metal level by using a non-crosslinked light or heat-crosslinkable polymer layer Nov. 12, 2013
8535989 Embedded semiconductive chips in reconstituted wafers, and systems containing same Sep. 17, 2013
8531044 Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with an encapsulant prepared from the composition Sep. 10, 2013
8482117 Semiconductor device with electronic component incorporation substrate Jul. 9, 2013
8461699 Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device Jun. 11, 2013
8436449 Chip package and method for fabricating the same May. 7, 2013
8415812 Materials and methods for stress reduction in semiconductor wafer passivation layers Apr. 9, 2013
8410619 Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device Apr. 2, 2013
8310069 Semiconductor package having marking layer Nov. 13, 2012
8274125 Semiconductor device and semiconductor device manufacturing method Sep. 25, 2012
8269358 Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and disp Sep. 18, 2012
8269213 Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same Sep. 18, 2012
8268673 Stacked electronic component and manufacturing method thereof Sep. 18, 2012
8222752 Organopolysiloxane composition and semiconductor apparatus Jul. 17, 2012
8193627 IC chip mounting package provided with IC chip located in device hole formed within a package base member Jun. 5, 2012
8169090 Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same May. 1, 2012
8148818 Semiconductor device and method for manufacturing the same Apr. 3, 2012
8110840 Light emitting apparatus and method for the same Feb. 7, 2012
8106523 Liquid resin composition, semi-conductor device, and process of fabricating the same Jan. 31, 2012
8093699 Circuit device with circuit board and semiconductor chip mounted thereon Jan. 10, 2012
8013456 Molded beam for optoelectronic sensor chip substrate Sep. 6, 2011
8008124 Adhesive film for semiconductor and semiconductor device using the adhesive film Aug. 30, 2011
8008410 Epoxy resin composition for encapsulating semiconductor and semiconductor device Aug. 30, 2011
7994647 Method of reducing memory card edge roughness by edge coating Aug. 9, 2011
7960825 Chip package and method for fabricating the same Jun. 14, 2011
7906847 Semiconductor device Mar. 15, 2011
7875975 Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag Jan. 25, 2011
7829390 Packaging structure of SIP and a manufacturing method thereof Nov. 9, 2010
7795717 Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel Sep. 14, 2010
7768139 Power semiconductor module Aug. 3, 2010
7749815 Methods for depositing tungsten after surface treatment Jul. 6, 2010
7750452 Same size die stacked package having through-hole vias formed in organic material Jul. 6, 2010
7719097 Semiconductor device having transparent member May. 18, 2010
7663218 Integrated circuit component with a surface-mount housing Feb. 16, 2010
7649272 Arrangement of an electrical component placed on a substrate, and method for producing the same Jan. 19, 2010
7642641 Integrated circuit component with passivation layer Jan. 5, 2010
7629695 Stacked electronic component and manufacturing method thereof Dec. 8, 2009
7605474 Structure of polymer-matrix conductive film and method for fabricating the same Oct. 20, 2009
7579215 Method for fabricating a low cost integrated circuit (IC) package Aug. 25, 2009
7527991 Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same May. 5, 2009
7485964 Dielectric material Feb. 3, 2009
7382041 Organic-inorganic composite insulating material for electronic element, method of producing same and field-effect transistor comprising same Jun. 3, 2008
7365414 Component packaging apparatus, systems, and methods Apr. 29, 2008
7332822 Flip chip system with organic/inorganic hybrid underfill composition Feb. 19, 2008
7319276 Substrate for pre-soldering material and fabrication method thereof Jan. 15, 2008
7312536 Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same Dec. 25, 2007

1 2 3 4 5 6 7 8 9 10 11 12 13

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