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Class Information
Number: 257/E23.119
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by material, e.g., carbon (epo) > Organic, e.g., plastic, epoxy (epo)
Description: This subclass is indented under subclass E23.117. This subclass is substantially the same in scope as ECLA classification H01L23/29P.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7605474 |
Structure of polymer-matrix conductive film and method for fabricating the same |
Oct. 20, 2009 |
| 7579215 |
Method for fabricating a low cost integrated circuit (IC) package |
Aug. 25, 2009 |
| 7527991 |
Light emitting apparatus provided with fluorescent substance and semiconductor light emitting device, and method of manufacturing the same |
May. 5, 2009 |
| 7485964 |
Dielectric material |
Feb. 3, 2009 |
| 7382041 |
Organic-inorganic composite insulating material for electronic element, method of producing same and field-effect transistor comprising same |
Jun. 3, 2008 |
| 7365414 |
Component packaging apparatus, systems, and methods |
Apr. 29, 2008 |
| 7332822 |
Flip chip system with organic/inorganic hybrid underfill composition |
Feb. 19, 2008 |
| 7319276 |
Substrate for pre-soldering material and fabrication method thereof |
Jan. 15, 2008 |
| 7312536 |
Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same |
Dec. 25, 2007 |
| 7288435 |
Method for producing a cover, method for producing a packaged device |
Oct. 30, 2007 |
| 7238552 |
Method and apparatus for depositing tungsten after surface treatment to improve film characteristics |
Jul. 3, 2007 |
| 7230337 |
Semiconductor device including ladder-shaped siloxane hydride and method for manufacturing same |
Jun. 12, 2007 |
| 7226812 |
Wafer support and release in wafer processing |
Jun. 5, 2007 |
| 7211888 |
Encapsulation of pin solder for maintaining accuracy in pin position |
May. 1, 2007 |
| 7170188 |
Package stress management |
Jan. 30, 2007 |
| 7119449 |
Enhancement of underfill physical properties by the addition of thermotropic cellulose |
Oct. 10, 2006 |
| 7074738 |
Curing accelerator, epoxy resin composition, and semiconductor device |
Jul. 11, 2006 |
| 7067930 |
Liquid epoxy resin composition and semiconductor device |
Jun. 27, 2006 |
| 7064368 |
Resin-encapsulated semiconductor apparatus and process for its fabrication |
Jun. 20, 2006 |
| 7060786 |
Heat resistant resin composition and adhesive film |
Jun. 13, 2006 |
| 7056978 |
Toughened epoxy-anhydride no-flow underfill encapsulant |
Jun. 6, 2006 |
| 7057283 |
Semiconductor device and method for producing the same |
Jun. 6, 2006 |
| 7045562 |
Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls |
May. 16, 2006 |
| 7041331 |
Electronic device manufacture |
May. 9, 2006 |
| 7041736 |
Anhydride polymers for use as curing agents in epoxy resin-based underfill material |
May. 9, 2006 |
| 7038307 |
Semiconductor chip with FIB protection |
May. 2, 2006 |
| 7037761 |
Method of producing an electronic component |
May. 2, 2006 |
| 7037399 |
Underfill encapsulant for wafer packaging and method for its application |
May. 2, 2006 |
| 7034404 |
Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device |
Apr. 25, 2006 |
| 7026376 |
Fluxing agent for underfill materials |
Apr. 11, 2006 |
| 7025905 |
Black composite particles for semiconductor sealing material, and semiconductor sealing material using the same |
Apr. 11, 2006 |
| 7023098 |
Resin composition for encapsulating semiconductor chip and semiconductor device therewith |
Apr. 4, 2006 |
| 7022410 |
Combinations of resin compositions and methods of use thereof |
Apr. 4, 2006 |
| 7018718 |
Adhesive film for underfill and semiconductor device using the same |
Mar. 28, 2006 |
| 7009008 |
Transparent liquid resin material for SMT-enabled led-applications at higher temperatures and higher luminosities |
Mar. 7, 2006 |
| 7004375 |
Pre-applied fluxing underfill composition having pressure sensitive adhesive properties |
Feb. 28, 2006 |
| 6963125 |
Electronic device packaging |
Nov. 8, 2005 |
| 6951981 |
Asymmetric transfer molding method and an asymmetric encapsulation made therefrom |
Oct. 4, 2005 |
| 6946513 |
Polymer composition containing clean filler incorporated therein |
Sep. 20, 2005 |
| 6946421 |
Latent catalyst |
Sep. 20, 2005 |
| 6943058 |
No-flow underfill process and material therefor |
Sep. 13, 2005 |
| 6927099 |
Process for producing semiconductor device and semiconductor device |
Aug. 9, 2005 |
| 6919420 |
Acid-cleavable acetal and ketal based epoxy oligomers |
Jul. 19, 2005 |
| 6918984 |
Photocurable adhesive compositions, reaction products of which have low halide ion content |
Jul. 19, 2005 |
| 6916538 |
Thermosetting resin composition and semiconductor device obtained with the same |
Jul. 12, 2005 |
| 6914328 |
Electronic component with an insulating layer formed from fluorinated norbornene polymer and method for manufacturing the insulating layers |
Jul. 5, 2005 |
| 6911503 |
Curing agent composition for epoxy resins, epoxy resin composition and use thereof |
Jun. 28, 2005 |
| 6905768 |
Epoxy resin composition and electronic part |
Jun. 14, 2005 |
| 6906425 |
Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive |
Jun. 14, 2005 |
| 6902811 |
Epoxy resin composition excellent in weather resistance and fiber-reinforced composite materials |
Jun. 7, 2005 |
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