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Class Information
Number: 257/E23.118
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by material, e.g., carbon (epo) > Oxides or nitrides or carbides, e.g., ceramics, glass (epo)
Description: This subclass is indented under subclass E23.117. This subclass is substantially the same in scope as ECLA classification H01L23/29C.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8581354 Semiconductor device carrying micro electro mechanical system Nov. 12, 2013
8546815 SiC semiconductor element and manufacturing method for same Oct. 1, 2013
8492908 Atomic layer deposition encapsulation for power amplifiers in RF circuits Jul. 23, 2013
8313985 Atomic layer deposition encapsulation for power amplifiers in RF circuits Nov. 20, 2012
8179225 Ceramic electronic component, manufacturing method of ceramic electronic component, and packaging method of ceramic electronic components May. 15, 2012
8154047 Solid element device and method for manufacturing the same Apr. 10, 2012
8120124 Ultra thin TCS (SiCl.sub.4) cell nitride for DRAM capacitor with DCS (SiH.sub.2Cl.sub.2) interface seeding layer Feb. 21, 2012
8058185 Method of fabricating semiconductor integrated circuit device Nov. 15, 2011
7999398 Solid state device Aug. 16, 2011
7994646 Semiconductor device Aug. 9, 2011
7884030 Gap-filling with uniform properties Feb. 8, 2011
7633158 Electronic component comprising a cooling surface Dec. 15, 2009
7615506 Durable tungsten-doped tin-fluorophosphate glasses Nov. 10, 2009
7601986 Epitaxial semiconductor structures having reduced stacking fault nucleation sites Oct. 13, 2009
7550851 Adhesion of tungsten nitride films to a silicon surface Jun. 23, 2009
7492019 Micromachined assembly with a multi-layer cap defining a cavity Feb. 17, 2009
7470999 Glass for semiconductor encapsulation and outer tube for semiconductor encapsulation, and semiconductor electronic parts Dec. 30, 2008
7408227 Apparatus and method of manufacture for integrated circuit and CMOS device including epitaxially grown dielectric on silicon carbide Aug. 5, 2008
7402458 Stress relieved flat frame for DMD window Jul. 22, 2008
7294909 Electronic package repair process Nov. 13, 2007
7220686 Process for contact opening definition for active element electrical connections May. 22, 2007
7208351 Electronic device and method of manufacture the same Apr. 24, 2007
7163838 Method and apparatus for forming a DMD window frame with molded glass Jan. 16, 2007
7160802 Adhesion of tungsten nitride films to a silicon surface Jan. 9, 2007
7056763 Composite structure for electronic microsystems and method for production of said composite structure Jun. 6, 2006
7012332 Semiconductor device having sealing structure for wide gap type semiconductor chip Mar. 14, 2006
6953995 Hermetic chip in wafer form Oct. 11, 2005
6930401 Electronic device and method of manufacture the same Aug. 16, 2005
6911714 Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates Jun. 28, 2005
6909169 Grounded embedded flip chip RF integrated circuit Jun. 21, 2005
6894334 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same May. 17, 2005
6881606 Method for forming a protective layer for use in packaging a semiconductor die Apr. 19, 2005
6867466 Memory device and method for forming a passivation layer thereon Mar. 15, 2005
6815314 Hermetic chip and method of manufacture Nov. 9, 2004
6787397 Semiconductor device protective overcoat with enhanced adhesion to polymeric materials and method of fabrication Sep. 7, 2004
6740603 Control of Vmin transient voltage drift by maintaining a temperature less than or equal to 350.degree. C. after the protective overcoat level May. 25, 2004
6724086 Hydrogenated oxidized silicon carbon material Apr. 20, 2004
6670705 Protective layer for a semiconductor device Dec. 30, 2003
6657542 Electronic device and method of manufacture the same Dec. 2, 2003
6597066 Hermetic chip and method of manufacture Jul. 22, 2003
6548847 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING A FIRST WIRING STRIP EXPOSED THROUGH A CONNECTING HOLE, A TRANSITION-METAL FILM IN THE CONNECTING HOLE AND AN ALUMINUM WIRING STRIP THEREOVER, AN Apr. 15, 2003
6497963 Hydrogenated oxidized silicon carbon material Dec. 24, 2002
6472122 Method of applying insulation for coating implantable components and other microminiature devices Oct. 29, 2002
6465281 Method of manufacturing a semiconductor wafer level package Oct. 15, 2002
6388310 Semiconductor device with a passivation film May. 14, 2002
6342412 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same Jan. 29, 2002
6319757 Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates Nov. 20, 2001
6287942 Hermetic chip and method of manufacture Sep. 11, 2001
6198155 Semiconductor device comprising an integrated circuit provided with a ceramic security coating and method of manufacturing such a device Mar. 6, 2001
6171703 Hermetic substrate coatings in an inert gas atmosphere Jan. 9, 2001

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