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Class Information
Number: 257/E23.117
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo) > Characterized by material, e.g., carbon (epo)
Description: This subclass is indented under subclass E23.116. This subclass is substantially the same in scope as ECLA classification H01L23/29.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.119 Organic, e.g., plastic, epoxy (epo) 629
257/E23.118 Oxides or nitrides or carbides, e.g., ceramics, glass (epo) 227
257/E23.122 Semiconductor material, e.g., amorphous silicon (epo) 42

Patents under this class:
1 2

Patent Number Title Of Patent Date Issued
8704361 Sealing glass for semiconductor device, sealing material, sealing material paste, and semiconductor device and its production process Apr. 22, 2014
8659125 Chipset package structure Feb. 25, 2014
8648479 Epoxy resin composition for semiconductor encapsulant and semiconductor device using the same Feb. 11, 2014
8604599 Semiconductor housing and method for the production of a semiconductor housing Dec. 10, 2013
8502401 Polymeric compositions comprising per(phenylethynyl) arene derivatives Aug. 6, 2013
8481656 Silicone resin composition and optical semiconductor device using the composition Jul. 9, 2013
8421242 Semiconductor package Apr. 16, 2013
8405233 Flexible barrier film, method of forming same, and organic electronic device including same Mar. 26, 2013
8399366 Method of depositing highly conformal amorphous carbon films over raised features Mar. 19, 2013
8377753 Method of fabricating a semiconductor device having a resin with warpage compensated structures Feb. 19, 2013
8373287 Polymeric compositions comprising per(phenylethynyl) arene derivatives Feb. 12, 2013
8310064 Semiconductor devices including voltage switchable materials for over-voltage protection Nov. 13, 2012
8288851 Method and system for hermetically sealing packages for optics Oct. 16, 2012
8187795 Patterning methods for stretchable structures May. 29, 2012
8178983 Water repellant composition for substrate to be exposed, method for forming resist pattern, electronic device produced by the formation method, treatment method for imparting water repellency May. 15, 2012
8067841 Semiconductor devices having a resin with warpage compensated surfaces Nov. 29, 2011
8043899 Photosensitive resin composition Oct. 25, 2011
7989269 Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof Aug. 2, 2011
7939916 Wafer level CSP packaging concept May. 10, 2011
7923844 Semiconductor devices including voltage switchable materials for over-voltage protection Apr. 12, 2011
7906859 Semiconductor device Mar. 15, 2011
7768141 Dicing die attachment film and method for packaging semiconductor using same Aug. 3, 2010
7691682 Build-up-package for integrated circuit devices, and methods of making same Apr. 6, 2010
7675182 Die warpage control Mar. 9, 2010
7646077 Methods and structure for forming copper barrier layers integral with semiconductor substrates structures Jan. 12, 2010
7473994 Method of producing insulator thin film, insulator thin film, method of manufacturing semiconductor device, and semiconductor device Jan. 6, 2009
7420220 Semiconductor light emitting device Sep. 2, 2008
7372138 Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods May. 13, 2008
7323781 Semiconductor device and manufacturing method thereof Jan. 29, 2008
7314826 Semiconductor device and method of fabricating the same Jan. 1, 2008
7288834 Semiconductor device, carrier, card reader, methods of initializing and checking authenticity Oct. 30, 2007
7238547 Packaging integrated circuits for accelerated detection of transient particle induced soft error rates Jul. 3, 2007
7238605 Circuit structures and methods of forming circuit structures with minimal dielectric constant layers Jul. 3, 2007
7115524 Methods of processing a semiconductor substrate Oct. 3, 2006
7015576 Semiconductor device which prevents light from entering therein Mar. 21, 2006
6849932 Double-sided thermally enhanced IC chip package Feb. 1, 2005
6831360 Semiconductor device having an elastic resin with a low modulus of elasticity Dec. 14, 2004
6756670 Electronic device and its manufacturing method Jun. 29, 2004
6703128 Thermally-capacitive phase change encapsulant for electronic devices Mar. 9, 2004
6544879 Insitu radiation protection of integrated circuits Apr. 8, 2003
6504256 Insitu radiation protection of integrated circuits Jan. 7, 2003
6312975 Semiconductor package and method of manufacturing the same Nov. 6, 2001
6166433 Resin molded semiconductor device and method of manufacturing semiconductor package Dec. 26, 2000
5959021 Protection of devices Sep. 28, 1999
5877037 Process for reducing bond resistance in semiconductor devices and circuits Mar. 2, 1999
5767578 Surface mount and flip chip technology with diamond film passivation for total integated circuit isolation Jun. 16, 1998
5760462 Metal, passivating layer, semiconductor, field-effect transistor Jun. 2, 1998
5756007 Composition for protection of devices May. 26, 1998
5737191 Structure and process for mounting semiconductor chip Apr. 7, 1998
5631496 Semiconductor component having a passivation layer and method for manufacturing same May. 20, 1997

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