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Class Information
Number: 257/E23.116
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/28.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7629696 |
Plastic semiconductor package having improved control of dimensions |
Dec. 8, 2009 |
| 7622311 |
Inspection of underfill in integrated circuit package |
Nov. 24, 2009 |
| 7622792 |
Semiconductor device and method of manufacturing the same |
Nov. 24, 2009 |
| 7622805 |
Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof |
Nov. 24, 2009 |
| 7602054 |
Method of forming a molded array package device having an exposed tab and structure |
Oct. 13, 2009 |
| 7598123 |
Semiconductor component and method of manufacture |
Oct. 6, 2009 |
| 7579672 |
Semiconductor package with electromagnetic shielding capabilities |
Aug. 25, 2009 |
| 7573061 |
Low-k SiC copper diffusion barrier films |
Aug. 11, 2009 |
| 7564142 |
Electronic device and method of manufacturing the same, circuit board, and electronic instrument |
Jul. 21, 2009 |
| 7564100 |
Silicon on sapphire wafer |
Jul. 21, 2009 |
| 7554205 |
Flip-chip type semiconductor device |
Jun. 30, 2009 |
| 7528077 |
Semiconductor device and method for manufacturing the same |
May. 5, 2009 |
| 7528477 |
Castellation wafer level packaging of integrated circuit chips |
May. 5, 2009 |
| 7514299 |
Chip package structure and manufacturing method thereof |
Apr. 7, 2009 |
| 7504671 |
Semiconductor device |
Mar. 17, 2009 |
| 7495344 |
Semiconductor apparatus |
Feb. 24, 2009 |
| 7495328 |
Micromechanical component |
Feb. 24, 2009 |
| 7482683 |
Integrated circuit encapsulation system with vent |
Jan. 27, 2009 |
| 7479407 |
Digital and RF system and method therefor |
Jan. 20, 2009 |
| 7473994 |
Method of producing insulator thin film, insulator thin film, method of manufacturing semiconductor device, and semiconductor device |
Jan. 6, 2009 |
| 7474008 |
Semiconductor device with reduced electromigration |
Jan. 6, 2009 |
| 7466027 |
Interconnect structures with surfaces roughness improving liner and methods for fabricating the same |
Dec. 16, 2008 |
| 7456049 |
Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same |
Nov. 25, 2008 |
| 7432130 |
Method of packaging semiconductor die without lead frame or substrate |
Oct. 7, 2008 |
| 7432604 |
Semiconductor component and system having thinned, encapsulated dice |
Oct. 7, 2008 |
| 7429799 |
Land patterns for a semiconductor stacking structure and method therefor |
Sep. 30, 2008 |
| 7425469 |
Method for encapsulating an electronic component using a foil layer |
Sep. 16, 2008 |
| 7416913 |
Methods of manufacturing microelectronic imaging units with discrete standoffs |
Aug. 26, 2008 |
| 7417325 |
Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts |
Aug. 26, 2008 |
| 7417330 |
Semiconductor device packaged into chip size and manufacturing method thereof |
Aug. 26, 2008 |
| 7407836 |
High-voltage module and method for producing same |
Aug. 5, 2008 |
| 7402457 |
Method for making contact with electrical contact with electrical contact surfaces of substrate and device with substrate having electrical contact surfaces |
Jul. 22, 2008 |
| 7397140 |
Chip module |
Jul. 8, 2008 |
| 7387914 |
Semiconductor device and process for fabrication thereof |
Jun. 17, 2008 |
| 7384822 |
Package for semiconductor components and method for producing the same |
Jun. 10, 2008 |
| 7382059 |
Semiconductor package structure and method of manufacture |
Jun. 3, 2008 |
| 7378300 |
Integrated circuit package system |
May. 27, 2008 |
| 7378301 |
Method for molding a small form factor digital memory card |
May. 27, 2008 |
| 7352070 |
Polymer encapsulated electrical devices |
Apr. 1, 2008 |
| 7332375 |
Method of making an integrated circuit package |
Feb. 19, 2008 |
| 7327044 |
Integrated circuit package encapsulating a hermetically sealed device |
Feb. 5, 2008 |
| 7312106 |
Method for encapsulating a chip having a sensitive surface |
Dec. 25, 2007 |
| 7282438 |
Low-k SiC copper diffusion barrier films |
Oct. 16, 2007 |
| 7265009 |
HDP-CVD methodology for forming PMD layer |
Sep. 4, 2007 |
| 7256071 |
Underfilling efficiency by modifying the substrate design of flip chips |
Aug. 14, 2007 |
| 7245008 |
Ball grid array package, stacked semiconductor package and method for manufacturing the same |
Jul. 17, 2007 |
| 7224061 |
Package structure |
May. 29, 2007 |
| 7224075 |
Methods and systems for attaching die in stacked-die packages |
May. 29, 2007 |
| 7214997 |
Integrated optical device |
May. 8, 2007 |
| 7211451 |
Process for producing a component module |
May. 1, 2007 |
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