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Class Information
Number: 257/E23.116
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Encapsulations, e.g., encapsulating layers, coatings, e.g., for protection (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/28.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.123 Characterized by arrangement or shape (epo) 94
257/E23.117 Characterized by material, e.g., carbon (epo) 69


Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8659129 Semiconductor device and method of manufacturing same Feb. 25, 2014
8648479 Epoxy resin composition for semiconductor encapsulant and semiconductor device using the same Feb. 11, 2014
8643199 Thermoset polyimides for microelectronic applications Feb. 4, 2014
8637980 Adhesive applications using alkali silicate glass for electronics Jan. 28, 2014
8618645 Package process and package structure Dec. 31, 2013
8610266 Semiconductor device for radio frequency applications and method for making the same Dec. 17, 2013
8599539 Ceramic chip assembly Dec. 3, 2013
8592256 Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device Nov. 26, 2013
8592997 Molded underfill flip chip package preventing warpage and void Nov. 26, 2013
8592998 Thin film wafer level package Nov. 26, 2013
8586456 Use of CL2 and/or HCL during silicon epitaxial film formation Nov. 19, 2013
8581395 Hybrid integrated circuit device and electronic device Nov. 12, 2013
8574528 Methods of growing a silicon carbide epitaxial layer on a substrate to increase and control carrier lifetime Nov. 5, 2013
8575646 Creating an LED package with optical elements by using controlled wetting Nov. 5, 2013
8575763 Semiconductor device and method of manufacturing the same Nov. 5, 2013
8569885 Stacked semiconductor packages and related methods Oct. 29, 2013
8558399 Dual molded multi-chip package system Oct. 15, 2013
8558368 Bi-directional, reverse blocking battery switch Oct. 15, 2013
8552556 Wafer level fan out package Oct. 8, 2013
8546959 Resin composition for encapsulating semiconductor, method for producing semiconductor device and semiconductor device Oct. 1, 2013
8541260 Exposed die overmolded flip chip package and fabrication method Sep. 24, 2013
8541801 Light-emitting-device package and a method for producing the same Sep. 24, 2013
8535989 Embedded semiconductive chips in reconstituted wafers, and systems containing same Sep. 17, 2013
8531018 Component comprising a chip in a cavity and a stress-reduced attachment Sep. 10, 2013
8524542 Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same Sep. 3, 2013
8497166 Electronic device and method of manufacturing electronic device Jul. 30, 2013
8492910 Underfill method and chip package Jul. 23, 2013
8476748 Exposed die overmolded flip chip package and fabrication method Jul. 2, 2013
8471373 Resin-sealed semiconductor device and method for fabricating the same Jun. 25, 2013
8471394 Integrated circuit packaging system with package-on-package and method of manufacture thereof Jun. 25, 2013
8461698 PCB external ground plane via conductive coating Jun. 11, 2013
8461699 Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device Jun. 11, 2013
8450153 Package manufacturing method and semiconductor device May. 28, 2013
8450840 Ultra ruggedized ball grid array electronic components May. 28, 2013
8445382 Side wall pore sealing for low-k dielectrics May. 21, 2013
8436462 Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structure May. 7, 2013
8436481 Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheet May. 7, 2013
8426985 Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component Apr. 23, 2013
8426965 Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool Apr. 23, 2013
8426955 Integrated circuit packaging system with a stack package and method of manufacture thereof Apr. 23, 2013
8421203 Integrated circuit packaging system with foldable substrate and method of manufacture thereof Apr. 16, 2013
8420450 Method of molding semiconductor package Apr. 16, 2013
8410619 Granular epoxy resin composition for encapsulating semiconductor, semiconductor device using the same and method for producing semiconductor device Apr. 2, 2013
8368194 Exposed die overmolded flip chip package Feb. 5, 2013
8361830 Image sensor module and method of manufacturing the same Jan. 29, 2013
8357987 Chip package and fabrication method thereof Jan. 22, 2013
8354742 Method and apparatus for a package having multiple stacked die Jan. 15, 2013
8350368 Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure Jan. 8, 2013
8350392 Semiconductor device having recess with varying width and method of manufacturing the same Jan. 8, 2013
8338283 Method and apparatus for applying thin liquid coatings Dec. 25, 2012

1 2 3 4 5










 
 
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