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Browse by Category: Main > Physics
Class Information
Number: 257/E23.115
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Protection against radiation, e.g., light, electromagnetic waves (epo) > Against alpha rays (epo)
Description: This subclass is indented under subclass E23.114. This subclass is substantially the same in scope as ECLA classification H01L23/556.










Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8653644 Packaged semiconductor chips with array Feb. 18, 2014
8614120 Semiconductor chip package and method of making same Dec. 24, 2013
8569876 Packaged semiconductor chips with array Oct. 29, 2013
8362600 Method and structure to reduce soft error rate susceptibility in semiconductor structures Jan. 29, 2013
8288177 SER testing for an IC chip using hot underfill Oct. 16, 2012
8212339 Semiconductor device packages with electromagnetic interference shielding Jul. 3, 2012
8198718 Semiconductor device with stacked semiconductor chips Jun. 12, 2012
8183593 Semiconductor die with integrated electro-static discharge device May. 22, 2012
8120175 Soft error rate mitigation by interconnect structure Feb. 21, 2012
8008723 Semiconductor device including a plurality of diffusion layers and diffusion resistance layer Aug. 30, 2011
7994602 Titanium dioxide thin film systems Aug. 9, 2011
7915742 Determining the placement of semiconductor components on an integrated circuit Mar. 29, 2011
7745910 Semiconductor device having RF shielding and method therefor Jun. 29, 2010
7626247 Electronic package with integral electromagnetic radiation shield and methods related thereto Dec. 1, 2009
7615850 Method and device including reworkable alpha particle barrier and corrosion barrier Nov. 10, 2009
7436055 Packaging method of a plurality of chips stacked on each other and package structure thereof Oct. 14, 2008
7301188 CMOS image sensor and method of manufacturing the same Nov. 27, 2007
7180114 Semiconductor device Feb. 20, 2007
7170147 Dissipative isolation frames for active microelectronic devices, and methods of making such dissipative isolation frames Jan. 30, 2007
7148084 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages Dec. 12, 2006
6894390 Soft error resistant semiconductor device May. 17, 2005
6833581 Structure and method for preventing process-induced UV radiation damage in a memory cell Dec. 21, 2004
6747339 Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate Jun. 8, 2004
6730948 Semiconductor device including acrylic resin layer May. 4, 2004
6548392 Methods of a high density flip chip memory arrays Apr. 15, 2003
6538334 High density flip chip memory arrays Mar. 25, 2003
6531759 Alpha particle shield for integrated circuit Mar. 11, 2003
6459125 SOI based transistor inside an insulation layer with conductive bump on the insulation layer Oct. 1, 2002
6436737 Method for reducing soft error rates in semiconductor devices Aug. 20, 2002
6429386 Imbedded die-scale interconnect for ultra-high speed digital communications Aug. 6, 2002
6365042 Apparatus for removing noble metal contamination from liquids Apr. 2, 2002
6362437 Mounting structure of integrated circuit device having high effect of buffering stress and high reliability of connection by solder, and method of mounting the same Mar. 26, 2002
6329712 High density flip chip memory arrays Dec. 11, 2001
6274406 Semiconductor device and a method of manufacturing the same Aug. 14, 2001
6274473 Flip chip packages Aug. 14, 2001
6255719 Semiconductor device including thermal neutron absorption material Jul. 3, 2001
6239479 Thermal neutron shielded integrated circuits May. 29, 2001
6144103 Graded PB for C4 bump technology Nov. 7, 2000
6043429 Method of making flip chip packages Mar. 28, 2000
5990564 Flip chip packaging of memory chips Nov. 23, 1999
5965945 Graded PB for C4 pump technology Oct. 12, 1999
5897336 Direct chip attach for low alpha emission interconnect system Apr. 27, 1999
5804870 Hermetically sealed integrated circuit lead-on package configuration Sep. 8, 1998
5702985 Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method Dec. 30, 1997
5691211 Method for gettering noble metals from mineral acid solution Nov. 25, 1997
5572065 Hermetically sealed ceramic integrated circuit heat dissipating package Nov. 5, 1996
5552623 Short channel mosfet with buried anti-punch through region Sep. 3, 1996
5523597 Electronic device achieving a reduction in alpha particle emissions from boron-based compounds essentially free of boron-10 Jun. 4, 1996
5514475 Heat-resistant electrical insulating layer May. 7, 1996
5501767 Method for gettering noble metals from mineral acid solution Mar. 26, 1996

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