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Class Information
Number: 257/E23.114
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Protection against radiation, e.g., light, electromagnetic waves (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/552.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.115 Against alpha rays (epo) 105


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

Patent Number Title Of Patent Date Issued
8710635 Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die Apr. 29, 2014
8669646 Apparatus and method for grounding an IC package lid for EMI reduction Mar. 11, 2014
8659125 Chipset package structure Feb. 25, 2014
8659126 Integrated circuit ground shielding structure Feb. 25, 2014
8659127 Wiring substrate, semiconductor device and manufacturing method thereof Feb. 25, 2014
8653633 Semiconductor device packages with electromagnetic interference shielding Feb. 18, 2014
8648448 Semiconductor device and method of shielding semiconductor die from inter-device interference Feb. 11, 2014
8627566 Method for packaging a microelectromechanical system (MEMS) device Jan. 14, 2014
8624362 IC wafer having electromagnetic shielding effects and method for making the same Jan. 7, 2014
8618593 Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor Dec. 31, 2013
8614120 Semiconductor chip package and method of making same Dec. 24, 2013
8610266 Semiconductor device for radio frequency applications and method for making the same Dec. 17, 2013
8592975 Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure Nov. 26, 2013
8592958 Chip package and manufacturing method thereof Nov. 26, 2013
8587096 Semiconductor device including shielding layer and fabrication method thereof Nov. 19, 2013
8581419 Multi-chip stack structure Nov. 12, 2013
8581370 Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die Nov. 12, 2013
8575730 Semiconductor device Nov. 5, 2013
8564092 Power convertor device and construction methods Oct. 22, 2013
8564079 STT MRAM magnetic tunnel junction architecture and integration Oct. 22, 2013
8552539 Shielded package having shield lid Oct. 8, 2013
8536711 Chip-stacked semiconductor and manufacturing method thereof Sep. 17, 2013
8513782 Shielding device Aug. 20, 2013
8513823 Semiconductor package having main stamp and sub-stamp Aug. 20, 2013
8508023 System and method for lowering contact resistance of the radio frequency (RF) shield to ground Aug. 13, 2013
8492881 Magnetic storage device Jul. 23, 2013
8466539 MRAM device and method of assembling same Jun. 18, 2013
8461668 Power management integrated circuit Jun. 11, 2013
8445996 Semiconductor package May. 21, 2013
8446007 Non-uniform alignment of wafer bumps with substrate solders May. 21, 2013
8421183 Structure of very high insertion loss of the substrate noise decoupling Apr. 16, 2013
8415774 Screened electrical device and a process for manufacturing the same Apr. 9, 2013
8415775 Magnetic shielding for multi-chip module packaging Apr. 9, 2013
8399964 Multilayer structures for magnetic shielding Mar. 19, 2013
8384199 Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system Feb. 26, 2013
8373264 Semiconductor package with integrated interference shielding and method of manufacture thereof Feb. 12, 2013
8368186 Device and methods for electrostatic discharge protection Feb. 5, 2013
8362597 Shielded package having shield lid Jan. 29, 2013
8362608 Ultra wideband hermetically sealed surface mount technology for microwave monolithic integrated circuit package Jan. 29, 2013
8350368 Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure Jan. 8, 2013
8350367 Semiconductor device packages with electromagnetic interference shielding Jan. 8, 2013
8349710 Shielding techniques for an integrated circuit Jan. 8, 2013
8344490 Semiconductor device having a high frequency electrode positioned with a via hole Jan. 1, 2013
8338921 Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same Dec. 25, 2012
8334171 Package system with a shielded inverted internal stacking module and method of manufacture thereof Dec. 18, 2012
8324020 Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system Dec. 4, 2012
8319277 Semiconductor device, method of manufacturing same, and apparatus for designing same Nov. 27, 2012
8310062 Stacked semiconductor package Nov. 13, 2012
8309454 Structure for electrostatic discharge in embedded wafer level packages Nov. 13, 2012
8310036 Chips having rear contacts connected by through vias to front contacts Nov. 13, 2012

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17










 
 
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