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Class Information
Number: 257/E23.113
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) > Cooling facilitated by selection of materials for device (or materials for thermal expansion adaptation, e.g., carbon) (epo) > Ceramic materials or glass (epo)
Description: This subclass is indented under subclass E23.11. This subclass is substantially the same in scope as ECLA classification H01L23/373C.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8704361 Sealing glass for semiconductor device, sealing material, sealing material paste, and semiconductor device and its production process Apr. 22, 2014
8283773 Semiconductor device having anti-warping sheet Oct. 9, 2012
8049316 Semiconductor package Nov. 1, 2011
7855449 Cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device Dec. 21, 2010
7808073 Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both Oct. 5, 2010
7598535 Light-emitting diode assembly and method of fabrication Oct. 6, 2009
7582511 Method for wafer level chip scale packaging with passive components integrated into packaging structure Sep. 1, 2009
7521779 Roughened printed circuit board Apr. 21, 2009
7514782 Semiconductor device Apr. 7, 2009
7239016 Semiconductor device having heat radiation plate and bonding member Jul. 3, 2007
7031166 Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate Apr. 18, 2006
6972955 Electro-fluidic device and interconnect and related methods Dec. 6, 2005
6938815 Heat-resistant electronic systems and circuit boards Sep. 6, 2005
6846765 Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate Jan. 25, 2005
6818574 Jointed body of glass-ceramic and aluminum nitride sintered compact and method for producing the same Nov. 16, 2004
6799628 Heat exchanger having silicon nitride substrate for mounting high power electronic components Oct. 5, 2004
6784538 Heat transfer structure for a semiconductor device utilizing a bismuth glass layer Aug. 31, 2004
6768193 Heat transfer structure for a semiconductor device utilizing a bismuth glass layer Jul. 27, 2004
6758264 Heat sink and its manufacturing method Jul. 6, 2004
6705388 Non-electrically conductive thermal dissipator for electronic components Mar. 16, 2004
6705393 Ceramic heat sink with micro-pores structure Mar. 16, 2004
6690583 Carrier for electronic components Feb. 10, 2004
6597070 Semiconductor device and method of manufacturing the same Jul. 22, 2003
6558821 Ceramic sinter, and wear resistant member and electronic component member using thereof May. 6, 2003
6414847 Integral dielectric heatspreader Jul. 2, 2002
6384342 Heat-resistant electronic systems and circuit boards with heat resistant reinforcement dispersed in liquid metal May. 7, 2002
6292367 Thermally efficient semiconductor chip Sep. 18, 2001
6286206 Heat-resistant electronic systems and circuit boards Sep. 11, 2001
5937514 Method of making a heat-resistant system Aug. 17, 1999
5932348 Composite with non-segregating reinforcing elements Aug. 3, 1999
5869890 Insulation substrate for a semiconductor device Feb. 9, 1999
5821612 Heat radiative electronic component Oct. 13, 1998
5821617 Surface mount package with low coefficient of thermal expansion Oct. 13, 1998
5786097 Assembly substrate and method of making Jul. 28, 1998
RE35845 RF transistor package and mounting pad Jul. 14, 1998
5767028 Aluminum nitride sintered body and method for manufacturing the same Jun. 16, 1998
5763093 Aluminum nitride body having graded metallurgy Jun. 9, 1998
5751552 Semiconductor device balancing thermal expansion coefficient mismatch May. 12, 1998
5744411 Aluminum nitride sintered body with high thermal conductivity and its preparation Apr. 28, 1998
5736787 Transistor package structured to provide heat dissipation enabling use of silicon carbide transistors and other high power semiconductor devices Apr. 7, 1998
5714246 Conductive silver low temperature cofired metallic green tape Feb. 3, 1998
5703397 Semiconductor package having an aluminum nitride substrate Dec. 30, 1997
5698896 High thermal conductive silicon nitride structural member, semiconductor package, heater and thermal head Dec. 16, 1997
5682589 Aluminum nitride body having graded metallurgy Oct. 28, 1997
5655213 Co-sintered surface metallization for pin-join, wire-bond and chip attach Aug. 5, 1997
5649593 Radiator member Jul. 22, 1997
5639562 Co-sintered surface metallization for pin-join, wire-bond and chip attach Jun. 17, 1997
5613181 Co-sintered surface metallization for pin-join, wire-bond and chip attach Mar. 18, 1997
5552107 Aluminum nitride body having graded metallurgy Sep. 3, 1996
5552232 Aluminum nitride body having graded metallurgy Sep. 3, 1996

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