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Class Information
Number: 257/E23.112
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) > Cooling facilitated by selection of materials for device (or materials for thermal expansion adaptation, e.g., carbon) (epo) > Having heterogeneous or anisotropic structure, e.g., powder or fibers in matrix, wire mesh, porous structures (epo)
Description: This subclass is indented under subclass E23.11. This subclass is substantially the same in scope as ECLA classification H01L23/373H.










Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8703271 Thermal interface material Apr. 22, 2014
8344383 Active matrix substrate, display device, and television apparatus Jan. 1, 2013
8283774 Chip on film type semiconductor package Oct. 9, 2012
8049255 Display device and method of manufacturing the same Nov. 1, 2011
8040148 System in package with built-in test-facilitating circuit Oct. 18, 2011
7838881 Active matrix substrate, display device, television apparatus, manufacturing method of an active matrix substrate, and manufacturing method of a display device Nov. 23, 2010
7830001 Cu-Mo substrate and method for producing same Nov. 9, 2010
7812463 Packaging integrated circuits for high stress environments Oct. 12, 2010
7786486 Double-sided package for power module Aug. 31, 2010
7728339 Boundary isolation for microelectromechanical devices Jun. 1, 2010
7545030 Article having metal impregnated within carbon nanotube array Jun. 9, 2009
7538432 Temporary structure to reduce stress and warpage in a flip chip organic package May. 26, 2009
7535099 Sintered metallic thermal interface materials for microelectronic cooling assemblies May. 19, 2009
7525156 Shallow trench isolation fill by liquid phase deposition of SiO.sub.2 Apr. 28, 2009
7476982 Fabricated adhesive microstructures for making an electrical connection Jan. 13, 2009
7473618 Temporary structure to reduce stress and warpage in a flip chip organic package Jan. 6, 2009
7411275 Semiconductor device comprising an inorganic insulating film and method of manufacturing the same Aug. 12, 2008
7399919 Flexible heat sink Jul. 15, 2008
7393771 Method for mounting an electronic part on a substrate using a liquid containing metal particles Jul. 1, 2008
7315068 Interface layer for the fabrication of electronic devices Jan. 1, 2008
7282798 Spontaneous emission enhanced heat transport method and structures for cooling, sensing, and power generation Oct. 16, 2007
7044199 Porous media cold plate May. 16, 2006
7030483 Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application Apr. 18, 2006
7014093 Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same Mar. 21, 2006
7002800 Integrated power and cooling architecture Feb. 21, 2006
6994917 Composite material and method for manufacturing the same Feb. 7, 2006
6987318 Diamond composite heat spreader having thermal conductivity gradients and associated methods Jan. 17, 2006
6984685 Thermal interface pad utilizing low melting metal with retention matrix Jan. 10, 2006
6984888 Carbonaceous composite heat spreader and associated methods Jan. 10, 2006
6979901 Semiconductor heat-dissipating substrate, and manufacturing method and package therefor Dec. 27, 2005
6962753 Highly heat-conductive composite magnetic material Nov. 8, 2005
6959753 Construction of phase change material embedded electronic circuit boards and electronic circuit board assemblies using porous and fibrous media Nov. 1, 2005
6938815 Heat-resistant electronic systems and circuit boards Sep. 6, 2005
6933531 Heat sink material and method of manufacturing the heat sink material Aug. 23, 2005
6926861 Semiconductor package and method for producing heat-radiating substrate for it Aug. 9, 2005
6921971 Heat releasing member, package for accommodating semiconductor element and semiconductor device Jul. 26, 2005
6919504 Flexible heat sink Jul. 19, 2005
6917638 Heat radiator for electronic device and method of making it Jul. 12, 2005
6913075 Dendritic fiber material Jul. 5, 2005
6909185 Composite material including copper and cuprous oxide and application thereof Jun. 21, 2005
6888720 Distributed graphitic foam heat exchanger system May. 3, 2005
6884522 Metal matrix composite structure and method Apr. 26, 2005
6867978 Integrated heat spreader package for heat transfer and for bond line thickness control and process of making Mar. 15, 2005
6864120 Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion Mar. 8, 2005
6846987 Power electronics component Jan. 25, 2005
6840307 High performance heat exchange assembly Jan. 11, 2005
6841250 Thermal management system Jan. 11, 2005
6837306 Carbon-carbon and/or metal-carbon fiber composite heat spreaders Jan. 4, 2005
6835889 Passive element component and substrate with built-in passive element Dec. 28, 2004
6833617 Composite material including copper and cuprous oxide and application thereof Dec. 21, 2004

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