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Class Information
Number: 257/E23.111
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) > Cooling facilitated by selection of materials for device (or materials for thermal expansion adaptation, e.g., carbon) (epo) > Diamond (epo)
Description: This subclass is indented under subclass E23.11. This subclass is substantially the same in scope as ECLA classification H01L23/373D.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8592824 High efficiency indirect transition semiconductor ultraviolet light emitting device Nov. 26, 2013
8222732 Heat spreader having single layer of diamond particles and associated methods Jul. 17, 2012
8193634 Mounted semiconductor device and a method for making the same Jun. 5, 2012
8143654 Monolithic microwave integrated circuit with diamond layer Mar. 27, 2012
RE43215 ESD protection design with turn-on restraining method and structures Feb. 28, 2012
8101987 Semiconductor device and method of fabricating the same Jan. 24, 2012
8058724 Holistic thermal management system for a semiconductor chip Nov. 15, 2011
8008669 Programmable anti-fuse structure with DLC dielectric layer Aug. 30, 2011
7939367 Method for growing an adherent diamond layer atop an interlayer bonded to a compound semiconductor substrate May. 10, 2011
7888171 Fabricating a gallium nitride layer with diamond layers Feb. 15, 2011
7884373 Gallium nitride layer with diamond layers Feb. 8, 2011
7791188 Heat spreader having single layer of diamond particles and associated methods Sep. 7, 2010
7781256 Semiconductor-on-diamond devices and associated methods Aug. 24, 2010
7678614 Thermal interface material and method for making the same Mar. 16, 2010
7589025 Semiconductor processing Sep. 15, 2009
7432132 Integrated diamond carrier method for laser bar arrays Oct. 7, 2008
7432532 Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Oct. 7, 2008
7427807 Chip heat dissipation structure and manufacturing method Sep. 23, 2008
7391061 Light emitting diode with thermal spreading layer Jun. 24, 2008
7384821 Diamond composite heat spreader having thermal conductivity gradients and associated methods Jun. 10, 2008
7268011 Diamond composite heat spreader and associated methods Sep. 11, 2007
7193318 Multiple power density chip structure Mar. 20, 2007
7173334 Diamond composite heat spreader and associated methods Feb. 6, 2007
7067903 Heat spreader and semiconductor device and package using the same Jun. 27, 2006
7061073 Diamondoid-containing capacitors Jun. 13, 2006
7052937 Method and structure for providing improved thermal conduction for silicon semiconductor devices May. 30, 2006
6964880 Methods for the control of flatness and electron mobility of diamond coated silicon and structures formed thereby Nov. 15, 2005
6924170 Diamond-silicon hybrid integrated heat spreader Aug. 2, 2005
6921706 Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Jul. 26, 2005
6919525 Thermal management components Jul. 19, 2005
6913999 Semiconductor device with components embedded in backside diamond layer Jul. 5, 2005
6914025 Heat conductive material Jul. 5, 2005
6914330 Heat sink formed of diamond-containing composite material with a multilayer coating Jul. 5, 2005
6891724 Increasing thermal conductivity of thermal interface using carbon nanotubes and CVD May. 10, 2005
6882041 Thermally enhanced metal capped BGA package Apr. 19, 2005
6861745 Method and apparatus for conducting heat in a flip-chip assembly Mar. 1, 2005
6847110 Method and apparatus for conducting heat in a flip-chip assembly Jan. 25, 2005
6830780 Methods for preparing brazeable metallizations for diamond components Dec. 14, 2004
6770966 Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat Aug. 3, 2004
6758264 Heat sink and its manufacturing method Jul. 6, 2004
6738253 Electronic power module and a power component designed to equip such a module May. 18, 2004
6727117 Semiconductor substrate having copper/diamond composite material and method of making same Apr. 27, 2004
6723420 Thick film paste systems for circuits on diamond substrates Apr. 20, 2004
6706562 Electronic assembly with high capacity thermal spreader and methods of manufacture Mar. 16, 2004
6689471 Thermal management device and method of making such a device Feb. 10, 2004
6653730 Electronic assembly with high capacity thermal interface Nov. 25, 2003
6649937 Semiconductor device with components embedded in backside diamond layer Nov. 18, 2003
6641861 Heatsink and fabrication method thereof Nov. 4, 2003
6579743 Chip packaging system and method using deposited diamond film Jun. 17, 2003
6573565 Method and structure for providing improved thermal conduction for silicon semiconductor devices Jun. 3, 2003

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