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Class Information
Number: 257/E23.11
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) > Cooling facilitated by selection of materials for device (or materials for thermal expansion adaptation, e.g., carbon) (epo)
Description: This subclass is indented under subclass E23.101. This subclass is substantially the same in scope as ECLA classification H01L23/373.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.113 Ceramic materials or glass (epo) 92
257/E23.111 Diamond (epo) 188
257/E23.112 Having heterogeneous or anisotropic structure, e.g., powder or fibers in matrix, wire mesh, porous structures (epo) 295


Patents under this class:
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Patent Number Title Of Patent Date Issued
8703271 Thermal interface material Apr. 22, 2014
8704346 Semiconductor package and radiation lead frame Apr. 22, 2014
8664759 Integrated circuit with heat conducting structures for localized thermal control Mar. 4, 2014
8546935 Semiconductor packages Oct. 1, 2013
8546947 Chip structure and process for forming the same Oct. 1, 2013
8269339 Underfill film having thermally conductive sheet Sep. 18, 2012
8217518 Enhancing metal/low-K interconnect reliability using a protection layer Jul. 10, 2012
8164195 Pad structure of semiconductor integrated circuit apparatus Apr. 24, 2012
8159066 Semiconductor package having a heat dissipation member Apr. 17, 2012
8093713 Module with silicon-based layer Jan. 10, 2012
8084778 Light emitting diode package Dec. 27, 2011
8035237 Integrated circuit package system with heat slug Oct. 11, 2011
8030113 Thermoelectric 3D cooling Oct. 4, 2011
7952112 RGB thermal isolation substrate May. 31, 2011
7952192 Melting temperature adjustable metal thermal interface materials and packaged semiconductors including thereof May. 31, 2011
7919855 Topside thermal management of semiconductor devices using boron phosphide contacting a gate terminal Apr. 5, 2011
7886813 Thermal interface material with carbon nanotubes and particles Feb. 15, 2011
7851906 Flexible circuit electronic package with standoffs Dec. 14, 2010
7833827 Method of making a semiconductor chip assembly with a bumped terminal, a filler and an insulative base Nov. 16, 2010
7800194 Thin film photodetector, method and system Sep. 21, 2010
7786486 Double-sided package for power module Aug. 31, 2010
7786487 Semiconductor device and manufacturing method thereof Aug. 31, 2010
7786571 Heat-conductive package structure Aug. 31, 2010
7728440 Warp-suppressed semiconductor device Jun. 1, 2010
7700943 In-situ functionalization of carbon nanotubes Apr. 20, 2010
7692299 Semiconductor apparatus having improved thermal fatigue life Apr. 6, 2010
7679145 Transistor performance enhancement using engineered strains Mar. 16, 2010
7679175 Semiconductor device including substrate and upper plate having reduced warpage Mar. 16, 2010
7658865 Conducting liquid crystal polymer matrix comprising carbon nanotubes, use thereof and method of fabrication Feb. 9, 2010
7576428 Melting temperature adjustable metal thermal interface materials and application thereof Aug. 18, 2009
7557438 Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same Jul. 7, 2009
7470983 Semiconductor device reducing warping due to heat production Dec. 30, 2008
7466019 Rectangular semi-conducting support for microelectronics and method for making same Dec. 16, 2008
7417311 Semiconductor device and method of fabricating the same Aug. 26, 2008
7332807 Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same Feb. 19, 2008
7316789 Conducting liquid crystal polymer nature comprising carbon nanotubes, use thereof and method of fabrication Jan. 8, 2008
7301232 Integrated circuit package with carbon nanotube array heat conductor Nov. 27, 2007
7285856 Package for semiconductor devices Oct. 23, 2007
7285852 Semiconductor device capsule Oct. 23, 2007
7239016 Semiconductor device having heat radiation plate and bonding member Jul. 3, 2007
7224050 Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging May. 29, 2007
7119434 Efficiency CPU cooling arrangement Oct. 10, 2006
7064451 Area array semiconductor device and electronic circuit board utilizing the same Jun. 20, 2006
7006354 Heat radiating structure for electronic device Feb. 28, 2006
6987318 Diamond composite heat spreader having thermal conductivity gradients and associated methods Jan. 17, 2006
6987671 Composite thermal interface devices and methods for integrated circuit heat transfer Jan. 17, 2006
6986873 Method of producing a metal-containing single-phase composition Jan. 17, 2006
6984888 Carbonaceous composite heat spreader and associated methods Jan. 10, 2006
6982874 Thermal solution for electronic devices Jan. 3, 2006
6933531 Heat sink material and method of manufacturing the heat sink material Aug. 23, 2005

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