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Class Information
Number: 257/E23.109
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) > Laminates or multilayers, e.g., direct bond copper ceramic substrates (epo) > Metallic materials (epo)
Description: This subclass is indented under subclass E23.106. This subclass is substantially the same in scope as ECLA classification H01L23/373M.

Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8664759 Integrated circuit with heat conducting structures for localized thermal control Mar. 4, 2014
8564118 Power module substrate, power module, and method for manufacturing power module substrate Oct. 22, 2013
8441122 Semiconductor device having semiconductor chip and metal plate May. 14, 2013
8299604 Bonded metal and ceramic plates for thermal management of optical and electronic devices Oct. 30, 2012
8283773 Semiconductor device having anti-warping sheet Oct. 9, 2012
8159066 Semiconductor package having a heat dissipation member Apr. 17, 2012
8026596 Thermal designs of packaged gallium nitride material devices and methods of packaging Sep. 27, 2011
7999394 Void reduction in indium thermal interface material Aug. 16, 2011
7928553 Power electronic device Apr. 19, 2011
7834443 Semiconductor device with molten metal preventing member Nov. 16, 2010
7799614 Method of fabricating a power electronic device Sep. 21, 2010
7755184 Liquid metal thermal interface material system Jul. 13, 2010
7663227 Liquid metal thermal interface material system Feb. 16, 2010
7651938 Void reduction in indium thermal interface material Jan. 26, 2010
7554190 Liquid metal thermal interface material system Jun. 30, 2009
7528482 Embedded chip package with improved heat dissipation performance and method of making the same May. 5, 2009
7427807 Chip heat dissipation structure and manufacturing method Sep. 23, 2008
7388286 Semiconductor package having enhanced heat dissipation and method of fabricating the same Jun. 17, 2008
7378730 Thermal interconnect systems methods of production and uses thereof May. 27, 2008
7345364 Structure and method for improved heat conduction for semiconductor devices Mar. 18, 2008
RE39992 Morphing fillers and thermal interface materials Jan. 1, 2008
7183641 Integrated heat spreader with intermetallic layer and method for making Feb. 27, 2007
7169650 Semi-solid metal injection methods for electronic assembly thermal interface Jan. 30, 2007
7105922 Electrode-type heat sink Sep. 12, 2006
7041151 Electrochemical displacement-deposition method for making composite metal powders May. 9, 2006
7030485 Thermal interface structure with integrated liquid cooling and methods Apr. 18, 2006
7019975 Power module and power module with heat sink Mar. 28, 2006
6994917 Composite material and method for manufacturing the same Feb. 7, 2006
6984685 Thermal interface pad utilizing low melting metal with retention matrix Jan. 10, 2006
6927421 Heat sink material Aug. 9, 2005
6917638 Heat radiator for electronic device and method of making it Jul. 12, 2005
6898084 Thermal diffusion apparatus May. 24, 2005
6882043 Electronic assembly having an indium thermal couple Apr. 19, 2005
6815084 Discontinuous high-modulus fiber metal matrix composite for thermal management applications Nov. 9, 2004
6797758 Morphing fillers and thermal interface materials Sep. 28, 2004
6797085 Metallurgically enhanced heat sink Sep. 28, 2004
6776329 Method for producing a heat-conducting connection between two work pieces Aug. 17, 2004
6773963 Apparatus and method for containing excess thermal interface material Aug. 10, 2004
6763881 Thermally matched gradient heat sink Jul. 20, 2004
6737299 Thermally conductive adhesive tape for semiconductor devices and method for using the same May. 18, 2004
6667191 Chip scale integrated circuit package Dec. 23, 2003
6656770 Thermal enhancement approach using solder compositions in the liquid state Dec. 2, 2003
6641861 Heatsink and fabrication method thereof Nov. 4, 2003
6635099 Aqueous nonferrous feedstock material for injection molding Oct. 21, 2003
6624224 Method of preparing thermally conductive compounds by liquid metal bridged particle clusters Sep. 23, 2003
6614105 Chip-type semiconductor device Sep. 2, 2003
6596139 Discontinuous high-modulus fiber metal matrix composite for physical vapor deposition target backing plates and other thermal management applications Jul. 22, 2003
6589310 High conductivity copper/refractory metal composites and method for making same Jul. 8, 2003
6586279 Method of integrating a heat spreader and a semiconductor, and package formed thereby Jul. 1, 2003
6579623 Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material member Jun. 17, 2003

1 2 3 4

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