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Class Information
Number: 257/E23.108
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) > Laminates or multilayers, e.g., direct bond copper ceramic substrates (epo) > Semiconductor materials (epo)
Description: This subclass is indented under subclass E23.106. This subclass is substantially the same in scope as ECLA classification H01L23/ 373S.










Patents under this class:

Patent Number Title Of Patent Date Issued
8080870 Die-warpage compensation structures for thinned-die devices, and methods of assembling same Dec. 20, 2011
7893529 Thermoelectric 3D cooling Feb. 22, 2011
7345364 Structure and method for improved heat conduction for semiconductor devices Mar. 18, 2008
7287320 Method for programming a routing layout design through one via layer Oct. 30, 2007
7273812 Microprobe tips and methods for making Sep. 25, 2007
6916430 Superconducting heat transfer medium Jul. 12, 2005
6886249 Method for making finned heat sink assemblies May. 3, 2005
6489005 Method of making silicon article having columns Dec. 3, 2002
6462405 Semiconductor package Oct. 8, 2002
6452265 Multi-chip module utilizing a nonconductive material surrounding the chips that has a similar coefficient of thermal expansion Sep. 17, 2002
6343647 Thermal joint and method of use Feb. 5, 2002
6251706 Method for cooling the backside of a semiconductor device using an infrared transparent heat slug Jun. 26, 2001
6191944 Heat sink for electric and/or electronic devices Feb. 20, 2001
6187412 Silicon article having columns and method of making Feb. 13, 2001
5948689 Integrated thermal coupling for heat generating device Sep. 7, 1999
5895972 Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug Apr. 20, 1999
5838065 Integrated thermal coupling for heat generating device Nov. 17, 1998
5757081 Surface mount and flip chip technology for total integrated circuit isolation May. 26, 1998
5753529 Surface mount and flip chip technology for total integrated circuit isolation May. 19, 1998
5402004 Heat transfer module for ultra high density and silicon on silicon packaging applications Mar. 28, 1995
5339216 Device and method for reducing thermal cycling in a semiconductor package Aug. 16, 1994
5332695 Method of manufacturing semi conductor device mounted on a heat sink Jul. 26, 1994
5304846 Narrow channel finned heat sinking for cooling high power electronic components Apr. 19, 1994
5247203 Semiconductor device mounted on a heat sink with an intervening amorphous semiconductor material Sep. 21, 1993
5206713 Mounting silicon chips Apr. 27, 1993
5173764 Semiconductor device having a particular lid means and encapsulant to reduce die stress Dec. 22, 1992
5164884 Device for cooling a power transistor Nov. 17, 1992
5051814 Method of providing stress-free thermally-conducting attachment of two bodies Sep. 24, 1991
5016083 Submount for semiconductor laser device May. 14, 1991
4698662 Multichip thin film module Oct. 6, 1987
4567505 Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like Jan. 28, 1986











 
 
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