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Class Information
Number: 257/E23.107
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) > Laminates or multilayers, e.g., direct bond copper ceramic substrates (epo) > Organic materials with or without thermo-conductive filler (epo)
Description: This subclass is indented under subclass E23.106. This subclass is substantially the same in scope as ECLA classification H01L23/373P.










Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8159066 Semiconductor package having a heat dissipation member Apr. 17, 2012
8048690 Pressure-sensitive adhesive sheet and process for producing semiconductor device having same Nov. 1, 2011
7893529 Thermoelectric 3D cooling Feb. 22, 2011
7888183 Thinned die integrated circuit package Feb. 15, 2011
7728440 Warp-suppressed semiconductor device Jun. 1, 2010
7678614 Thermal interface material and method for making the same Mar. 16, 2010
7641811 Enhanced thermal conducting formulations Jan. 5, 2010
7462294 Enhanced thermal conducting formulations Dec. 9, 2008
7446412 Heat sink design using clad metal Nov. 4, 2008
7420273 Thinned die integrated circuit package Sep. 2, 2008
7397139 Epoxy resin molding material for sealing use and semiconductor device Jul. 8, 2008
7347955 Heat conducting polymer mold products Mar. 25, 2008
7344919 Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener Mar. 18, 2008
7342306 High performance reworkable heatsink and packaging structure with solder release layer Mar. 11, 2008
7332807 Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same Feb. 19, 2008
RE39992 Morphing fillers and thermal interface materials Jan. 1, 2008
7301232 Integrated circuit package with carbon nanotube array heat conductor Nov. 27, 2007
7189778 Thermally conductive polymer molded article and method for producing the same Mar. 13, 2007
7090482 Semiconductor device package manufacturing method and semiconductor device package manufactured by the method Aug. 15, 2006
7074490 Thermally conductive phase change materials Jul. 11, 2006
7075201 Multi-phase alternating-current rotational electric machine Jul. 11, 2006
7071030 Method of making a flexible substrate with a filler material Jul. 4, 2006
7071078 Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials Jul. 4, 2006
7060747 Chain extension for thermal materials Jun. 13, 2006
7059042 Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink Jun. 13, 2006
7057896 Power module and production method thereof Jun. 6, 2006
7041535 Power module and method of manufacturing the same May. 9, 2006
7036573 Polymer with solder pre-coated fillers for thermal interface materials May. 2, 2006
7027304 Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials Apr. 11, 2006
7025129 Adhesive to attach a cooling device to a thermal interface Apr. 11, 2006
7018701 Thermally conductive sheet and method for manufacturing the same Mar. 28, 2006
7013555 Method of applying phase change thermal interface materials Mar. 21, 2006
7013965 Organic matrices containing nanomaterials to enhance bulk thermal conductivity Mar. 21, 2006
6984685 Thermal interface pad utilizing low melting metal with retention matrix Jan. 10, 2006
6974723 Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials Dec. 13, 2005
6975026 Package for mounting semiconductor device Dec. 13, 2005
6967179 Process for manufacturing boron nitride fibers from borylborazines Nov. 22, 2005
6965513 Carbon nanotube thermal interface structures Nov. 15, 2005
6962753 Highly heat-conductive composite magnetic material Nov. 8, 2005
6958535 Thermal conductive substrate and semiconductor module using the same Oct. 25, 2005
6949822 Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance Sep. 27, 2005
6947285 Thermal interface material Sep. 20, 2005
6945312 Thermal interface material and methods for assembling and operating devices using such material Sep. 20, 2005
6919628 Stack chip package structure Jul. 19, 2005
6918438 Finned heat sink Jul. 19, 2005
6913827 Nanocoated primary particles and method for their manufacture Jul. 5, 2005
6900163 Dry thermal interface material May. 31, 2005
6898084 Thermal diffusion apparatus May. 24, 2005
6893591 Thermoplastic adhesive preform for heat sink attachment May. 17, 2005
6892453 Method for forming an encapsulation device May. 17, 2005

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