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Class Information
Number: 257/E23.106
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) > Laminates or multilayers, e.g., direct bond copper ceramic substrates (epo)
Description: This subclass is indented under subclass E23.101. This subclass is substantially the same in scope as ECLA classification H01L23/373L.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.109 Metallic materials (epo) 166
257/E23.107 Organic materials with or without thermo-conductive filler (epo) 292
257/E23.108 Semiconductor materials (epo) 31


Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8604610 Flexible power module semiconductor packages Dec. 10, 2013
8592947 Thermally controlled refractory metal resistor Nov. 26, 2013
RE44438 Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate Aug. 13, 2013
8471385 Method for the connection of two wafers, and a wafer arrangement Jun. 25, 2013
8299604 Bonded metal and ceramic plates for thermal management of optical and electronic devices Oct. 30, 2012
8288862 Multiple die stack package Oct. 16, 2012
8283773 Semiconductor device having anti-warping sheet Oct. 9, 2012
8273610 Method of constructing a semiconductor device and structure Sep. 25, 2012
8183650 MEMS device and MEMS spring element May. 22, 2012
8164177 Electronic component module and method for production thereof Apr. 24, 2012
8154114 Power semiconductor module Apr. 10, 2012
8148207 Method of making a semiconductor chip assembly with a post/base/cap heat spreader Apr. 3, 2012
8143108 Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate Mar. 27, 2012
8089147 IMS formed as can for semiconductor housing Jan. 3, 2012
8008132 Etched surface mount islands in a leadframe package Aug. 30, 2011
7910952 Power semiconductor arrangement Mar. 22, 2011
7906845 Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor Mar. 15, 2011
7898079 Nanotube materials for thermal management of electronic components Mar. 1, 2011
7880283 High reliability power module Feb. 1, 2011
7875934 Semiconductor substrate with islands of diamond and resulting devices Jan. 25, 2011
7833839 Method for decreasing surface delamination of gel-type thermal interface material by management of the material cure temperature Nov. 16, 2010
7772024 Method of manufacturing a micro-mechanical element Aug. 10, 2010
7759697 Semiconductor device Jul. 20, 2010
7754534 Semiconductor device and manufacturing method thereof Jul. 13, 2010
7750461 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate Jul. 6, 2010
7745928 Heat dissipation plate and semiconductor device Jun. 29, 2010
7638877 Alternative to desmear for build-up roughening and copper adhesion promotion Dec. 29, 2009
7629684 Adjustable thickness thermal interposer and electronic package utilizing same Dec. 8, 2009
7525182 Multi-package module and electronic device using the same Apr. 28, 2009
7449361 Semiconductor substrate with islands of diamond and resulting devices Nov. 11, 2008
7439614 Circuit device with dummy elements Oct. 21, 2008
7429502 Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink Sep. 30, 2008
7416923 Underfill film having thermally conductive sheet Aug. 26, 2008
7414313 Polymeric conductor donor and transfer method Aug. 19, 2008
7400489 System and a method of driving a parallel-plate variable micro-electromechanical capacitor Jul. 15, 2008
7399919 Flexible heat sink Jul. 15, 2008
7340828 Method for producing metal/ceramic bonding circuit board Mar. 11, 2008
7327028 Embedded heat spreader for folded stacked chip-scale package Feb. 5, 2008
7327029 Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink Feb. 5, 2008
RE39992 Morphing fillers and thermal interface materials Jan. 1, 2008
7297610 Method of segmenting a wafer Nov. 20, 2007
7279407 Selective nickel plating of aluminum, copper, and tungsten structures Oct. 9, 2007
7230332 Chip package with embedded component Jun. 12, 2007
7148136 Method of producing ceramic multi-layer substrate Dec. 12, 2006
7132746 Electronic assembly with solder-bonded heat sink Nov. 7, 2006
7115996 Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped Oct. 3, 2006
7073703 Aluminum/ceramic bonding substrate and method for producing same Jul. 11, 2006
7059049 Electronic package with optimized lamination process Jun. 13, 2006
7048866 Metal/ceramic bonding article and method for producing same May. 23, 2006
7047637 Method of manufacture of ceramic composite wiring structures for semiconductor devices May. 23, 2006

1 2 3 4 5 6 7 8










 
 
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