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Class Information
Number: 257/E23.105
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) > Cooling facilitated by shape of device (epo) > Wire-like or pin-like cooling fins or heat sinks (epo)
Description: This subclass is indented under subclass E23.102. This subclass is substantially the same in scope as ECLA classification H01L23/367W.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner |
Nov. 3, 2009 |
| 7586179 |
Wireless semiconductor package for efficient heat dissipation |
Sep. 8, 2009 |
| 7582959 |
Driver module structure with flexible circuit board |
Sep. 1, 2009 |
| 7566652 |
Electrically inactive via for electromigration reliability improvement |
Jul. 28, 2009 |
| 7564129 |
Power semiconductor module, and power semiconductor device having the module mounted therein |
Jul. 21, 2009 |
| 7564124 |
Semiconductor die package including stacked dice and heat sink structures |
Jul. 21, 2009 |
| 7557438 |
Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same |
Jul. 7, 2009 |
| 7547966 |
Power semiconductor module |
Jun. 16, 2009 |
| 7538422 |
Integrated circuit micro-cooler having multi-layers of tubes of a CNT array |
May. 26, 2009 |
| 7528491 |
Semiconductor components and assemblies including vias of varying lateral dimensions |
May. 5, 2009 |
| 7514768 |
Package structure for a semiconductor device incorporating enhanced solder bump structure |
Apr. 7, 2009 |
| 7508061 |
Three-dimensional semiconductor module having multi-sided ground block |
Mar. 24, 2009 |
| 7417299 |
Direct connection multi-chip semiconductor element structure |
Aug. 26, 2008 |
| 7399919 |
Flexible heat sink |
Jul. 15, 2008 |
| 7372146 |
Semiconductor module |
May. 13, 2008 |
| 7365422 |
Package of leadframe with heatsinks |
Apr. 29, 2008 |
| 7342305 |
Thermally enhanced cavity-down integrated circuit package |
Mar. 11, 2008 |
| 7304372 |
Semiconductor package |
Dec. 4, 2007 |
| 7253520 |
CSP semiconductor device having signal and radiation bump groups |
Aug. 7, 2007 |
| 7235889 |
Integrated heatspreader for use in wire bonded ball grid array semiconductor packages |
Jun. 26, 2007 |
| 7199466 |
Package design using thermal linkage from die to printed circuit board |
Apr. 3, 2007 |
| 7170183 |
Wafer level stacked package |
Jan. 30, 2007 |
| 7109581 |
System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler |
Sep. 19, 2006 |
| 7084496 |
Method and apparatus for providing optoelectronic communication with an electronic device |
Aug. 1, 2006 |
| 7070084 |
Electrical circuit apparatus and methods for assembling same |
Jul. 4, 2006 |
| 7067406 |
Thermal conducting trench in a semiconductor structure and method for forming the same |
Jun. 27, 2006 |
| 7064014 |
Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices |
Jun. 20, 2006 |
| 7061111 |
Interconnect structure for use in an integrated circuit |
Jun. 13, 2006 |
| 7057891 |
Heat dissipation structure |
Jun. 6, 2006 |
| 7054159 |
Printed wiring board having heat radiating means and method of manufacturing the same |
May. 30, 2006 |
| 7052937 |
Method and structure for providing improved thermal conduction for silicon semiconductor devices |
May. 30, 2006 |
| 7047637 |
Method of manufacture of ceramic composite wiring structures for semiconductor devices |
May. 23, 2006 |
| 7049696 |
IC package with electrically conductive heat-radiating mechanism, connection structure and electronic device |
May. 23, 2006 |
| 7044212 |
Refrigeration device and a method for producing the same |
May. 16, 2006 |
| 7040388 |
Heat sink, method of manufacturing the same and cooling apparatus using the same |
May. 9, 2006 |
| 7042053 |
Semiconductor device with polymer insulation of some electrodes |
May. 9, 2006 |
| 7042081 |
Semiconductor device having heat dissipation layer |
May. 9, 2006 |
| 7038311 |
Thermally enhanced semiconductor package |
May. 2, 2006 |
| 7033927 |
Apparatus and method for thermal isolation, circuit cooling and electromagnetic shielding of a wafer |
Apr. 25, 2006 |
| 7031164 |
Electronic circuit device including heat-generating element mounted on circuit board |
Apr. 18, 2006 |
| 7026664 |
DC-DC converter implemented in a land grid array package |
Apr. 11, 2006 |
| 7009277 |
Semiconductor device with improved radiation property |
Mar. 7, 2006 |
| 7000683 |
Heatsink device |
Feb. 21, 2006 |
| 6998708 |
Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set |
Feb. 14, 2006 |
| 6999317 |
Thermally enhanced electronic module with self-aligning heat sink |
Feb. 14, 2006 |
| 6989293 |
Thermally enhanced packaging structure and fabrication method thereof |
Jan. 24, 2006 |
| 6977428 |
Semiconductor device adapted to remove noise from a signal |
Dec. 20, 2005 |
| 6977346 |
Vented circuit board for cooling power components |
Dec. 20, 2005 |
| 6972483 |
Semiconductor package with improved thermal emission property |
Dec. 6, 2005 |
| 6966363 |
Heat collector with mounting plate |
Nov. 22, 2005 |
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