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Class Information
Number: 257/E23.105
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) > Cooling facilitated by shape of device (epo) > Wire-like or pin-like cooling fins or heat sinks (epo)
Description: This subclass is indented under subclass E23.102. This subclass is substantially the same in scope as ECLA classification H01L23/367W.

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8618585 Semiconductor apparatus including cooling base with projections Dec. 31, 2013
8541875 Integrated three-dimensional module heat exchanger for power electronics cooling Sep. 24, 2013
8536687 Semiconductor device having separated heatsink and chip mounting portion Sep. 17, 2013
8415786 Thermally enhanced semiconductor package system Apr. 9, 2013
8269326 Semiconductor device assemblies Sep. 18, 2012
8269248 Light emitting assemblies and portions thereof Sep. 18, 2012
8232634 Semiconductor device having a pin mounted heat sink Jul. 31, 2012
8222723 Electric module having a conductive pattern layer Jul. 17, 2012
8188594 Input/output package architectures May. 29, 2012
8129834 Integral metal structure with conductive post portions Mar. 6, 2012
RE43215 ESD protection design with turn-on restraining method and structures Feb. 28, 2012
8102046 Semiconductor device and method of manufacturing the same Jan. 24, 2012
8093715 Enhancement of thermal interface conductivities with carbon nanotube arrays Jan. 10, 2012
8089085 Heat sink base for LEDS Jan. 3, 2012
8080871 Carbon nanotube-based structures and methods for removing heat from solid-state devices Dec. 20, 2011
8021976 Method of wire bonding over active area of a semiconductor circuit Sep. 20, 2011
8022532 Interposer and semiconductor device Sep. 20, 2011
7982307 Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate Jul. 19, 2011
7956458 Metal clad fiber optics for enhanced heat dissipation Jun. 7, 2011
7923834 Interposer and semiconductor device Apr. 12, 2011
7923826 Semiconductor device mounted on heat sink having protruded periphery Apr. 12, 2011
7919854 Semiconductor module with two cooling surfaces and method Apr. 5, 2011
7902648 Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods Mar. 8, 2011
7839643 Heat spreader for memory modules Nov. 23, 2010
7839908 Mode control waveguide laser device Nov. 23, 2010
7820488 Microelectronic devices and methods Oct. 26, 2010
7714423 Mid-plane arrangement for components in a computer system May. 11, 2010
7709296 Coupling metal clad fiber optics for enhanced heat dissipation May. 4, 2010
7705447 Input/output package architectures, and methods of using same Apr. 27, 2010
7705449 Cooling apparatus for memory module Apr. 27, 2010
7704791 Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface Apr. 27, 2010
7696614 Driver module structure Apr. 13, 2010
7678614 Thermal interface material and method for making the same Mar. 16, 2010
7663215 Electronic module with a conductive-pattern layer and a method of manufacturing same Feb. 16, 2010
7646064 Semiconductor die with aluminum-spiked heat pipes Jan. 12, 2010
7612448 Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner Nov. 3, 2009
7586179 Wireless semiconductor package for efficient heat dissipation Sep. 8, 2009
7582959 Driver module structure with flexible circuit board Sep. 1, 2009
7566652 Electrically inactive via for electromigration reliability improvement Jul. 28, 2009
7564129 Power semiconductor module, and power semiconductor device having the module mounted therein Jul. 21, 2009
7564124 Semiconductor die package including stacked dice and heat sink structures Jul. 21, 2009
7557438 Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same Jul. 7, 2009
7547966 Power semiconductor module Jun. 16, 2009
7538422 Integrated circuit micro-cooler having multi-layers of tubes of a CNT array May. 26, 2009
7528491 Semiconductor components and assemblies including vias of varying lateral dimensions May. 5, 2009
7514768 Package structure for a semiconductor device incorporating enhanced solder bump structure Apr. 7, 2009
7508061 Three-dimensional semiconductor module having multi-sided ground block Mar. 24, 2009
7417299 Direct connection multi-chip semiconductor element structure Aug. 26, 2008
7399919 Flexible heat sink Jul. 15, 2008
7372146 Semiconductor module May. 13, 2008

1 2 3 4 5 6 7 8 9 10 11

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