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Class Information
Number: 257/E23.104
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) > Cooling facilitated by shape of device (epo) > Characterized by shape of housing (epo)
Description: This subclass is indented under subclass E23.102. This subclass is substantially the same in scope as ECLA classification H01L23/367H.










Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
4396935 VLSI Packaging system Aug. 2, 1983
4246597 Air cooled multi-chip module having a heat conductive piston spring loaded against the chips Jan. 20, 1981
4147889 Chip carrier Apr. 3, 1979
4092697 Heat transfer mechanism for integrated circuit package May. 30, 1978
4000509 High density air cooled wafer package having improved thermal dissipation Dec. 28, 1976

1 2 3 4 5 6 7










 
 
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