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Class Information
Number: 257/E23.104
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) > Cooling facilitated by shape of device (epo) > Characterized by shape of housing (epo)
Description: This subclass is indented under subclass E23.102. This subclass is substantially the same in scope as ECLA classification H01L23/367H.

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
5521124 Method of fabricating plastic transfer molded semiconductor silicone bridge rectifiers with radial terminals May. 28, 1996
5510956 Electronic part unit or assembly having a plurality of electronic parts enclosed within a metal enclosure member mounted on a wiring layer Apr. 23, 1996
5491362 Package structure having accessible chip Feb. 13, 1996
5475565 Power distribution lid for IC package Dec. 12, 1995
5471027 Method for forming chip carrier with a single protective encapsulant Nov. 28, 1995
5461766 Method for integrally packaging an integrated circuit with a heat transfer apparatus Oct. 31, 1995
5463529 High power dissipating packages with matched heatspreader heatsink assemblies Oct. 31, 1995
5458716 Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid Oct. 17, 1995
5455386 Chamfered electronic package component Oct. 3, 1995
5444304 Semiconductor device having a radiating part Aug. 22, 1995
5422514 Packaging and interconnect system for integrated circuits Jun. 6, 1995
5404273 Semiconductor-device package and semiconductor device Apr. 4, 1995
5371404 Thermally conductive integrated circuit package with radio frequency shielding Dec. 6, 1994
5367193 Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die Nov. 22, 1994
5352991 Power amplifier assembly Oct. 4, 1994
5353193 High power dissipating packages with matched heatspreader heatsink assemblies Oct. 4, 1994
5350713 Design and sealing method for semiconductor packages Sep. 27, 1994
5334874 Electronic device package Aug. 2, 1994
5323292 Integrated multi-chip module having a conformal chip/heat exchanger interface Jun. 21, 1994
5319242 Semiconductor package having an exposed die surface Jun. 7, 1994
5297001 High power semiconductor assembly Mar. 22, 1994
5257162 Bellows lid for c4 flip-chip package Oct. 26, 1993
5254500 Method for making an integrally molded semiconductor device heat sink Oct. 19, 1993
5218215 Semiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation path Jun. 8, 1993
5194935 Plastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structure Mar. 16, 1993
5182632 High density multichip package with interconnect structure and heatsink Jan. 26, 1993
5177669 Molded ring integrated circuit package Jan. 5, 1993
5175613 Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips Dec. 29, 1992
5169805 Method of resiliently mounting an integrated circuit chip to enable conformal heat dissipation Dec. 8, 1992
5155579 Molded heat sink for integrated circuit package Oct. 13, 1992
5073521 Method for housing a tape-bonded electronic device and the package employed Dec. 17, 1991
5065223 Packaged semiconductor device Nov. 12, 1991
5057909 Electronic device and heat sink assembly Oct. 15, 1991
4987478 Micro individual integrated circuit package Jan. 22, 1991
4962416 Electronic package with a device positioned above a substrate by suction force between the device and heat sink Oct. 9, 1990
4922376 Spring grid array interconnection for active microelectronic elements May. 1, 1990
4918571 Chip carrier with energy storage means Apr. 17, 1990
4914812 Method of self-packaging an IC chip Apr. 10, 1990
4914551 Electronic package with heat spreader member Apr. 3, 1990
4908736 Self packaging chip mount Mar. 13, 1990
4888449 Semiconductor package Dec. 19, 1989
4849856 Electronic package with improved heat sink Jul. 18, 1989
4803546 Heatsink package for flip-chip IC Feb. 7, 1989
4796156 Self packaging chip mount Jan. 3, 1989
4742024 Semiconductor device and method of producing semiconductor device May. 3, 1988
4715430 Environmentally secure and thermally efficient heat sink assembly Dec. 29, 1987
4711023 Process for making single-in-line integrated electronic component Dec. 8, 1987
4698663 Heatsink package for flip-chip IC Oct. 6, 1987
4649460 Single-in-line integrated electronic component Mar. 10, 1987
4646131 Rectifier device Feb. 24, 1987

1 2 3 4 5 6 7

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