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Class Information
Number: 257/E23.104
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) > Cooling facilitated by shape of device (epo) > Characterized by shape of housing (epo)
Description: This subclass is indented under subclass E23.102. This subclass is substantially the same in scope as ECLA classification H01L23/367H.










Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
6281573 Thermal enhancement approach using solder compositions in the liquid state Aug. 28, 2001
6282092 Electronic circuit device and method of fabricating the same Aug. 28, 2001
6282095 Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures Aug. 28, 2001
6271058 Method of manufacturing semiconductor device in which semiconductor chip is mounted facedown on board Aug. 7, 2001
6265769 Double-sided chip mount package Jul. 24, 2001
6256875 Method for manufacturing semiconductor device Jul. 10, 2001
6252776 Heat radiating member for heat generating device Jun. 26, 2001
6252774 Multi-device heat sink assembly Jun. 26, 2001
6246583 Method and apparatus for removing heat from a semiconductor device Jun. 12, 2001
6239486 Semiconductor device having cap May. 29, 2001
6239381 Circuit board for a semiconductor device and method of making the same May. 29, 2001
6229702 Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capability May. 8, 2001
6219246 Heat sink apparatus Apr. 17, 2001
6215180 Dual-sided heat dissipating structure for integrated circuit package Apr. 10, 2001
6191944 Heat sink for electric and/or electronic devices Feb. 20, 2001
6188575 Heat exchanging chassis and method Feb. 13, 2001
6180436 Method for removing heat from a flip chip semiconductor device Jan. 30, 2001
6172415 Thin plate member for semiconductor package and manufacturing method therefor Jan. 9, 2001
6167949 Low EMI emissions heat sink device Jan. 2, 2001
6166435 Flip-chip ball grid array package with a heat slug Dec. 26, 2000
6156165 Method of forming a metallization feature on an edge of an IC chip Dec. 5, 2000
6151217 Apparatus and method for enabling hot plugging of an integrated circuit Nov. 21, 2000
6143590 Multi-chip semiconductor device and method of producing the same Nov. 7, 2000
6134111 Vertical surface mount apparatus with thermal carrier Oct. 17, 2000
6128189 Device for withdrawal of thermal power loss of electronic or electrical components Oct. 3, 2000
6115254 Vertical surface mount apparatus with thermal carrier Sep. 5, 2000
6109343 Low EMI emissions heat sink device Aug. 29, 2000
6089315 Composite heat sink Jul. 18, 2000
6075700 Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures Jun. 13, 2000
6068051 Channeled heat sink May. 30, 2000
6061235 Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management May. 9, 2000
6059939 Method for high density edge mounting of chips May. 9, 2000
6051888 Semiconductor package and method for increased thermal dissipation of flip-chip semiconductor package Apr. 18, 2000
6044899 Low EMI emissions heat sink device Apr. 4, 2000
6029740 Protective cap for heat conducting medium Feb. 29, 2000
6028355 Method and apparatus for dissipating heat from an enclosed printed wiring board Feb. 22, 2000
6022225 Electrical assembly Feb. 8, 2000
6011696 Cartridge and an enclosure for a semiconductor package Jan. 4, 2000
6011304 Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid Jan. 4, 2000
6008536 Grid array device package including advanced heat transfer mechanisms Dec. 28, 1999
6005289 Package for semiconductor device laminated printed circuit boards Dec. 21, 1999
6000125 Method of heat dissipation from two surfaces of a microprocessor Dec. 14, 1999
6002171 Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package Dec. 14, 1999
5998859 Packaging and interconnect system for integrated circuits Dec. 7, 1999
5986888 Heat sink for auxiliary circuit board Nov. 16, 1999
5986340 Ball grid array package with enhanced thermal and electrical characteristics and electronic device incorporating same Nov. 16, 1999
5963427 Multi-chip module with flexible circuit board Oct. 5, 1999
5950072 Low-profile removable ball-grid-array integrated circuit package Sep. 7, 1999
5946544 Circuit board-mounted IC package cooling and method Aug. 31, 1999
5923538 Support member for mounting a microelectronic circuit package Jul. 13, 1999

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