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Class Information
Number: 257/E23.104
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) > Cooling facilitated by shape of device (epo) > Characterized by shape of housing (epo)
Description: This subclass is indented under subclass E23.102. This subclass is substantially the same in scope as ECLA classification H01L23/367H.










Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8679900 Integrated circuit packaging system with heat conduction and method of manufacture thereof Mar. 25, 2014
8669657 Stackable semiconductor assemblies and methods of manufacturing such assemblies Mar. 11, 2014
8648469 Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate Feb. 11, 2014
8618573 Layered substrate, light-emitting diode including the layered substrate and lighting device using the light-emitting diode Dec. 31, 2013
8598616 Light emitting device and light unit using the same Dec. 3, 2013
8536697 Packaged die for heat dissipation and method therefor Sep. 17, 2013
8536687 Semiconductor device having separated heatsink and chip mounting portion Sep. 17, 2013
8531024 Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace Sep. 10, 2013
8531034 Semiconductor package and package on package having the same Sep. 10, 2013
8436455 Stacked structure of semiconductor packages including through-silicon via and inter-package connector, and method of fabricating the same May. 7, 2013
8298868 Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole Oct. 30, 2012
8283211 Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump Oct. 9, 2012
8236618 Method of making a semiconductor chip assembly with a post/base/post heat spreader Aug. 7, 2012
8207019 Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts Jun. 26, 2012
8198712 Hermetically sealed semiconductor device module Jun. 12, 2012
8163603 Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding Apr. 24, 2012
8153477 Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader Apr. 10, 2012
8089085 Heat sink base for LEDS Jan. 3, 2012
8067834 Semiconductor component Nov. 29, 2011
8058667 Leadframe package for light emitting diode device Nov. 15, 2011
8053877 Semiconductor package Nov. 8, 2011
8021927 Die down ball grid array packages and method for making same Sep. 20, 2011
8018033 Semiconductor device and manufacturing method of the same Sep. 13, 2011
8008131 Semiconductor chip package assembly method and apparatus for countering leadfinger deformation Aug. 30, 2011
7944046 Heat spreader for a multi-chip package May. 17, 2011
7880299 Semiconductor device Feb. 1, 2011
7833839 Method for decreasing surface delamination of gel-type thermal interface material by management of the material cure temperature Nov. 16, 2010
7834448 Fluid cooled semiconductor power module having double-sided cooling Nov. 16, 2010
7834447 Compliant thermal contactor Nov. 16, 2010
7816698 Heat dissipation package for heat generation element Oct. 19, 2010
7812433 Package structure and electronic device using the same Oct. 12, 2010
7812443 Power semiconductor module for inverter circuit system Oct. 12, 2010
7803664 Apparatus and methods for cooling semiconductor integrated circuit package structures Sep. 28, 2010
7745925 Multi-functional metal shield case and method for making the same Jun. 29, 2010
7728426 Semiconductor device Jun. 1, 2010
7696003 Microelectronic component assemblies with recessed wire bonds and methods of making same Apr. 13, 2010
7683460 Module with a shielding and/or heat dissipating element Mar. 23, 2010
7663212 Electronic component having exposed surfaces Feb. 16, 2010
7652358 Semiconductor device including main substrate and sub substrates Jan. 26, 2010
7633151 Integrated circuit package lid with a wetting film Dec. 15, 2009
7615862 Heat dissipating package structure and method for fabricating the same Nov. 10, 2009
7608923 Electronic device with flexible heat spreader Oct. 27, 2009
7582964 Semiconductor package having non-ceramic based window frame Sep. 1, 2009
7557442 Power semiconductor arrangement Jul. 7, 2009
7538343 Organic light emitting display (OLED) May. 26, 2009
7371615 Heat sink and method for its production May. 13, 2008
7332823 Providing a metal layer in a semiconductor package Feb. 19, 2008
7298046 Semiconductor package having non-ceramic based window frame Nov. 20, 2007
7245004 Semiconductor device Jul. 17, 2007
7202561 Semiconductor package with heat dissipating structure and method of manufacturing the same Apr. 10, 2007

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