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Class Information
Number: 257/E23.103
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) > Cooling facilitated by shape of device (epo) > Foil-like cooling fins or heat sinks (epo)
Description: This subclass is indented under subclass E23.102. This subclass is substantially the same in scope as ECLA classification H01L23/367F.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8648462 Semiconductor power module Feb. 11, 2014
8618585 Semiconductor apparatus including cooling base with projections Dec. 31, 2013
8536687 Semiconductor device having separated heatsink and chip mounting portion Sep. 17, 2013
8405204 Semiconductor package with package main body cooling structure using coolant, and semiconductor package assembly with the semiconductor package and coolant circulating structure Mar. 26, 2013
8391011 Cooling device Mar. 5, 2013
8368205 Metallic thermal joint for high power density chips Feb. 5, 2013
8294272 Power module Oct. 23, 2012
8283775 Wiring board, semiconductor device and method for manufacturing the same Oct. 9, 2012
8283776 Microfabricated pillar fins for thermal management Oct. 9, 2012
8269248 Light emitting assemblies and portions thereof Sep. 18, 2012
8115303 Semiconductor package structures having liquid coolers integrated with first level chip package modules Feb. 14, 2012
8102046 Semiconductor device and method of manufacturing the same Jan. 24, 2012
8089085 Heat sink base for LEDS Jan. 3, 2012
8030755 Integrated circuit package system with a heat sink Oct. 4, 2011
8030758 Semiconductor module and method for fabricating semiconductor module Oct. 4, 2011
7964958 Heatsink structure for solid-state image sensor Jun. 21, 2011
7923826 Semiconductor device mounted on heat sink having protruded periphery Apr. 12, 2011
7919854 Semiconductor module with two cooling surfaces and method Apr. 5, 2011
7911051 Electronic circuit arrangement and method for producing an electronic circuit arrangement Mar. 22, 2011
7903417 Electrical circuit assembly for high-power electronics Mar. 8, 2011
7875911 Semiconductor device and oscillator Jan. 25, 2011
7868450 Semiconductor package Jan. 11, 2011
7864534 Apparatus for mounting a module and enabling heat conduction from the module to the mounting surface Jan. 4, 2011
7834433 Semiconductor power device Nov. 16, 2010
RE41869 Semiconductor device Oct. 26, 2010
7786565 Semiconductor apparatus including power semiconductor device constructed by using wide band gap semiconductor Aug. 31, 2010
RE41559 Semiconductor device package with improved cooling Aug. 24, 2010
7746653 Clamp for electrical devices Jun. 29, 2010
7692291 Circuit board having a heating means and a hermetically sealed multi-chip package Apr. 6, 2010
7658865 Conducting liquid crystal polymer matrix comprising carbon nanotubes, use thereof and method of fabrication Feb. 9, 2010
7646093 Thermal management of dies on a secondary side of a package Jan. 12, 2010
7632716 Package for high frequency usages and its manufacturing method Dec. 15, 2009
7632717 Plastic overmolded packages with mechancially decoupled lid attach attachment Dec. 15, 2009
7613004 Heat sink with heat dissipating fins and method of manufacturing heat sink Nov. 3, 2009
7592695 Compound heat sink Sep. 22, 2009
7586179 Wireless semiconductor package for efficient heat dissipation Sep. 8, 2009
7564124 Semiconductor die package including stacked dice and heat sink structures Jul. 21, 2009
7545033 Low cost power semiconductor module without substrate Jun. 9, 2009
7538423 Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device May. 26, 2009
7495280 MOS devices with corner spacers Feb. 24, 2009
7468554 Heat sink board and manufacturing method thereof Dec. 23, 2008
7446412 Heat sink design using clad metal Nov. 4, 2008
7423341 Plastic overmolded packages with mechanically decoupled lid attach attachment Sep. 9, 2008
7414311 Ball grid array housing having a cooling foil Aug. 19, 2008
7411290 Integrated circuit chip and method for cooling an integrated circuit chip Aug. 12, 2008
7372146 Semiconductor module May. 13, 2008
7365422 Package of leadframe with heatsinks Apr. 29, 2008
7358605 Heat dissipation structure for electronic device Apr. 15, 2008
7348604 Light-emitting module Mar. 25, 2008
7320177 Radiator and method of manufacturing the same Jan. 22, 2008

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