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Class Information
Number: 257/E23.102
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) > Cooling facilitated by shape of device (epo)
Description: This subclass is indented under subclass E23.101. This subclass is substantially the same in scope as ECLA classification H01L23/367.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.104 Characterized by shape of housing (epo) 305
257/E23.103 Foil-like cooling fins or heat sinks (epo) 495
257/E23.105 Wire-like or pin-like cooling fins or heat sinks (epo) 530

Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8664758 Semiconductor package having reliable electrical connection and assembling method Mar. 4, 2014
8536687 Semiconductor device having separated heatsink and chip mounting portion Sep. 17, 2013
8531024 Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace Sep. 10, 2013
8446003 Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate May. 21, 2013
8299608 Enhanced thermal management of 3-D stacked die packaging Oct. 30, 2012
8288792 Semiconductor chip assembly with post/base/post heat spreader Oct. 16, 2012
8269336 Semiconductor chip assembly with post/base heat spreader and signal post Sep. 18, 2012
8236618 Method of making a semiconductor chip assembly with a post/base/post heat spreader Aug. 7, 2012
8207019 Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts Jun. 26, 2012
8163603 Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding Apr. 24, 2012
8153477 Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader Apr. 10, 2012
8129742 Semiconductor chip assembly with post/base heat spreader and plated through-hole Mar. 6, 2012
8115301 Methods for manufacturing thermally enhanced flip-chip ball grid arrays Feb. 14, 2012
8089085 Heat sink base for LEDS Jan. 3, 2012
8022532 Interposer and semiconductor device Sep. 20, 2011
7989947 Semiconductor device and method of manufacturing the same Aug. 2, 2011
7936045 Integrated circuit with multi-stage matching circuit May. 3, 2011
7923834 Interposer and semiconductor device Apr. 12, 2011
7855397 Electronic assemblies providing active side heat pumping Dec. 21, 2010
7851815 Light-emitting element having at least one light-emitting chip crystal Dec. 14, 2010
7834433 Semiconductor power device Nov. 16, 2010
7834444 Heatplates for heatsink attachment for semiconductor chips Nov. 16, 2010
7816698 Heat dissipation package for heat generation element Oct. 19, 2010
7763959 Heat slug for package structure Jul. 27, 2010
7755184 Liquid metal thermal interface material system Jul. 13, 2010
7741159 Semiconductor device having channel with cooling fluid and manufacturing method thereof Jun. 22, 2010
7728440 Warp-suppressed semiconductor device Jun. 1, 2010
7728426 Semiconductor device Jun. 1, 2010
7723843 Multi-package module and electronic device using the same May. 25, 2010
7692290 Heat slug and semiconductor package Apr. 6, 2010
7683469 Package-on-package system with heat spreader Mar. 23, 2010
7635916 Integrated circuit package with top-side conduction cooling Dec. 22, 2009
7626261 Wafer stacked package having vertical heat emission path and method of fabricating the same Dec. 1, 2009
7612385 High power light-emitting diode package comprising substrate having beacon Nov. 3, 2009
7608923 Electronic device with flexible heat spreader Oct. 27, 2009
7579675 Semiconductor device having surface mountable external contact areas and method for producing the same Aug. 25, 2009
7554190 Liquid metal thermal interface material system Jun. 30, 2009
7521792 Semiconductor package with heat spreader Apr. 21, 2009
7508066 Heat dissipating semiconductor package and fabrication method thereof Mar. 24, 2009
7498673 Heatplates for heatsink attachment for semiconductor chips Mar. 3, 2009
7468554 Heat sink board and manufacturing method thereof Dec. 23, 2008
7468548 Thermal enhanced upper and dual heat sink exposed molded leadless package Dec. 23, 2008
7446412 Heat sink design using clad metal Nov. 4, 2008
7365422 Package of leadframe with heatsinks Apr. 29, 2008
7358606 Apparatus to compensate for stress between heat spreader and thermal interface material Apr. 15, 2008
7345364 Structure and method for improved heat conduction for semiconductor devices Mar. 18, 2008
7288840 Structure for cooling a surface Oct. 30, 2007
7268427 Semiconductor package, printed board mounted with the same, and electronic apparatus having the printed board Sep. 11, 2007
7259458 Integrated circuit with increased heat transfer Aug. 21, 2007
7205651 Thermally enhanced stacked die package and fabrication method Apr. 17, 2007

1 2 3 4 5 6 7 8

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