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Class Information
Number: 257/E23.101
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo)
Description: This subclass is indented under subclass E23.08. This subclass is substantially the same in scope as ECLA classification H01L23/36.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.11 Cooling facilitated by selection of materials for device (or materials for thermal expansion adaptation, e.g., carbon) (epo) 93
257/E23.102 Cooling facilitated by shape of device (epo) 362
257/E23.106 Laminates or multilayers, e.g., direct bond copper ceramic substrates (epo) 389


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Patent Number Title Of Patent Date Issued
8703536 In-situ foam material as integrated heat spreader (IHS) sealant Apr. 22, 2014
8703540 Chip-scale semiconductor die packaging method Apr. 22, 2014
8679899 Multipath soldered thermal interface between a chip and its heat sink Mar. 25, 2014
8664758 Semiconductor package having reliable electrical connection and assembling method Mar. 4, 2014
8653652 Semiconductor device, power semiconductor module and power conversion device equipped with power semiconductor module Feb. 18, 2014
8648478 Flexible heat sink having ventilation ports and semiconductor package including the same Feb. 11, 2014
8633597 Thermal vias in an integrated circuit package with an embedded die Jan. 21, 2014
8618653 Integrated circuit package system with wafer scale heat slug Dec. 31, 2013
8618585 Semiconductor apparatus including cooling base with projections Dec. 31, 2013
8609506 On-chip heat spreader Dec. 17, 2013
8610263 Semiconductor device module Dec. 17, 2013
8604619 Through silicon via keep out zone formation along different crystal orientations Dec. 10, 2013
8598616 Light emitting device and light unit using the same Dec. 3, 2013
8592974 Package configurations for low EMI circuits Nov. 26, 2013
8586857 Combined diode, lead assembly incorporating an expansion joint Nov. 19, 2013
8587105 Semiconductor device Nov. 19, 2013
8564121 Semiconductor device and manufacturing method of semiconductor device Oct. 22, 2013
8564120 Heat dissipation in temperature critical device areas of semiconductor devices by heat pipes connecting to the substrate backside Oct. 22, 2013
8558373 Heatsink, heatsink assembly, semiconductor module, and semiconductor device with cooling device Oct. 15, 2013
8558361 Power semiconductor module Oct. 15, 2013
8557721 Rapid thermal processing using energy transfer layers Oct. 15, 2013
8535959 Method for producing large lighting with power LED Sep. 17, 2013
8536687 Semiconductor device having separated heatsink and chip mounting portion Sep. 17, 2013
8531019 Heat dissipation methods and structures for semiconductor device Sep. 10, 2013
8518749 Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die Aug. 27, 2013
8519532 Semiconductor device including cladded base plate Aug. 27, 2013
8513816 Film for flip chip type semiconductor back surface containing thermoconductive filler Aug. 20, 2013
8513796 Package structure, fabricating method thereof, and package-on-package device thereby Aug. 20, 2013
8508056 Heat releasing semiconductor package, method for manufacturing the same, and display apparatus including the same Aug. 13, 2013
8492911 Stacked interconnect heat sink Jul. 23, 2013
8476656 Light-emitting diode Jul. 2, 2013
8476116 Reduction of etch microloading for through silicon vias Jul. 2, 2013
8455931 Package configurations for low EMI circuits Jun. 4, 2013
8450845 Semiconductor device May. 28, 2013
8441128 Semiconductor arrangement May. 14, 2013
8426980 Chip-to-chip multi-signaling communication system with common conductive layer Apr. 23, 2013
8421217 Achieving mechanical and thermal stability in a multi-chip package Apr. 16, 2013
8415786 Thermally enhanced semiconductor package system Apr. 9, 2013
8409930 Semiconductor device manufacturing method Apr. 2, 2013
8405194 Semiconductor device including two heat sinks and method of manufacturing the same Mar. 26, 2013
8399985 Mold design and semiconductor package Mar. 19, 2013
8395254 Integrated circuit package system with heatspreader Mar. 12, 2013
8391011 Cooling device Mar. 5, 2013
8368208 Semiconductor cooling apparatus Feb. 5, 2013
8367469 Chip-scale semiconductor die packaging method Feb. 5, 2013
8350378 Press-fit power diode Jan. 8, 2013
8338943 Semiconductor package with thermal heat spreader Dec. 25, 2012
8330269 Semiconductor device and method Dec. 11, 2012
8324720 Power semiconductor module assembly with heat dissipating element Dec. 4, 2012
8324723 Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump Dec. 4, 2012

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