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Class Information
Number: 257/E23.101
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo)
Description: This subclass is indented under subclass E23.08. This subclass is substantially the same in scope as ECLA classification H01L23/36.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7611923 |
Method and apparatus for forming stacked die and substrate structures for increased packing density |
Nov. 3, 2009 |
| 7612385 |
High power light-emitting diode package comprising substrate having beacon |
Nov. 3, 2009 |
| 7608915 |
Heat dissipation semiconductor package |
Oct. 27, 2009 |
| 7608917 |
Power semiconductor module |
Oct. 27, 2009 |
| 7608923 |
Electronic device with flexible heat spreader |
Oct. 27, 2009 |
| 7602060 |
Heat spreader in a flip chip package |
Oct. 13, 2009 |
| 7592695 |
Compound heat sink |
Sep. 22, 2009 |
| 7586179 |
Wireless semiconductor package for efficient heat dissipation |
Sep. 8, 2009 |
| 7586191 |
Integrated circuit apparatus with heat spreader |
Sep. 8, 2009 |
| 7579686 |
Thermal interface material with hotspot heat remover |
Aug. 25, 2009 |
| 7579675 |
Semiconductor device having surface mountable external contact areas and method for producing the same |
Aug. 25, 2009 |
| 7579217 |
Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader |
Aug. 25, 2009 |
| 7573131 |
Die-up integrated circuit package with grounded stiffener |
Aug. 11, 2009 |
| 7569928 |
Assembly structure of electronic element and heat sink |
Aug. 4, 2009 |
| 7564128 |
Fully testable surface mount die package configured for two-sided cooling |
Jul. 21, 2009 |
| 7560812 |
Cooling module against ESD and electronic package, assembly and system using the same |
Jul. 14, 2009 |
| 7557438 |
Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same |
Jul. 7, 2009 |
| 7554190 |
Liquid metal thermal interface material system |
Jun. 30, 2009 |
| 7554194 |
Thermally enhanced semiconductor package |
Jun. 30, 2009 |
| 7554191 |
Semiconductor device having a heatsink plate with bored portions |
Jun. 30, 2009 |
| 7550830 |
Stacked semiconductor package having fan-out structure through wire bonding |
Jun. 23, 2009 |
| 7550839 |
Integrated circuit package and system interface |
Jun. 23, 2009 |
| 7545036 |
Semiconductor device that suppresses variations in high frequency characteristics of circuit elements |
Jun. 9, 2009 |
| 7538422 |
Integrated circuit micro-cooler having multi-layers of tubes of a CNT array |
May. 26, 2009 |
| 7521799 |
Semiconductor device and method of manufacturing the same |
Apr. 21, 2009 |
| 7521794 |
Intrinsic thermal enhancement for FBGA package |
Apr. 21, 2009 |
| 7521792 |
Semiconductor package with heat spreader |
Apr. 21, 2009 |
| 7514768 |
Package structure for a semiconductor device incorporating enhanced solder bump structure |
Apr. 7, 2009 |
| 7508067 |
Semiconductor insulation structure |
Mar. 24, 2009 |
| 7501314 |
Heat sink and method for fabricating the same |
Mar. 10, 2009 |
| 7498673 |
Heatplates for heatsink attachment for semiconductor chips |
Mar. 3, 2009 |
| 7498672 |
Micropin heat exchanger |
Mar. 3, 2009 |
| 7482204 |
Chip packaging process |
Jan. 27, 2009 |
| 7476982 |
Fabricated adhesive microstructures for making an electrical connection |
Jan. 13, 2009 |
| 7468554 |
Heat sink board and manufacturing method thereof |
Dec. 23, 2008 |
| 7462933 |
Ball grid array package enhanced with a thermal and electrical connector |
Dec. 9, 2008 |
| 7459784 |
High capacity thin module system |
Dec. 2, 2008 |
| 7456498 |
Integrated circuit package and system interface |
Nov. 25, 2008 |
| 7457491 |
System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards |
Nov. 25, 2008 |
| 7449775 |
Integrated thermal solution for electronic packages with materials having mismatched coefficient of thermal expansion |
Nov. 11, 2008 |
| 7446409 |
Cavity-down multiple-chip package |
Nov. 4, 2008 |
| 7445957 |
Method for fabricating wafer level semiconductor package with build-up layer |
Nov. 4, 2008 |
| 7439614 |
Circuit device with dummy elements |
Oct. 21, 2008 |
| 7436060 |
Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly |
Oct. 14, 2008 |
| 7429502 |
Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink |
Sep. 30, 2008 |
| 7420273 |
Thinned die integrated circuit package |
Sep. 2, 2008 |
| 7400035 |
Semiconductor device having multilayer printed wiring board |
Jul. 15, 2008 |
| 7397119 |
Wafer-level diamond spreader |
Jul. 8, 2008 |
| 7388286 |
Semiconductor package having enhanced heat dissipation and method of fabricating the same |
Jun. 17, 2008 |
| 7387915 |
Method for manufacturing heat sink of semiconductor device |
Jun. 17, 2008 |
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