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Class Information
Number: 257/E23.098
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Involving transfer of heat by flowing fluids (epo) > By flowing liquids (epo)
Description: This subclass is indented under subclass E23.097. This subclass is substantially the same in scope as ECLA classification H01L23/473.

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13

Patent Number Title Of Patent Date Issued
8704352 Semiconductor device having a liquid cooling module Apr. 22, 2014
8598702 Semiconductor package Dec. 3, 2013
8581392 Silicon based microchannel cooling and electrical package Nov. 12, 2013
8563365 Air-gap C4 fluidic I/O interconnects and methods of fabricating same Oct. 22, 2013
8546930 3-D ICs equipped with double sided power, coolant, and data features Oct. 1, 2013
8486765 Structure and process for electrical interconnect and thermal management Jul. 16, 2013
8421220 Silicon based microchannel cooling and electrical package Apr. 16, 2013
8405204 Semiconductor package with package main body cooling structure using coolant, and semiconductor package assembly with the semiconductor package and coolant circulating structure Mar. 26, 2013
8391008 Power electronics modules and power electronics module assemblies Mar. 5, 2013
8358016 Semiconductor package having an internal cooling system Jan. 22, 2013
8304897 Thermal interface material design for enhanced thermal performance and improved package structural integrity Nov. 6, 2012
8299604 Bonded metal and ceramic plates for thermal management of optical and electronic devices Oct. 30, 2012
8269341 Cooling structures and methods Sep. 18, 2012
8242595 Heatsink and semiconductor device with heatsink Aug. 14, 2012
8217506 Semiconductor packaging structure having conductive gel to package semiconductor device Jul. 10, 2012
8159065 Semiconductor package having an internal cooling system Apr. 17, 2012
8125075 Carbon nanotube micro-chimney and thermo siphon die-level cooling Feb. 28, 2012
8115302 Electronic module with carrier substrates, multiple integrated circuit (IC) chips and microchannel cooling device Feb. 14, 2012
8110415 Silicon based microchannel cooling and electrical package Feb. 7, 2012
8093715 Enhancement of thermal interface conductivities with carbon nanotube arrays Jan. 10, 2012
8044506 Thermal-emitting memory module, thermal-emitting module socket, and computer system Oct. 25, 2011
8022535 Systems, devices, and methods for semiconductor device temperature management Sep. 20, 2011
8012808 Integrated micro-channels for 3D through silicon architectures Sep. 6, 2011
7973433 Power electronics devices with integrated gate drive circuitry Jul. 5, 2011
7973434 Power supply system employing conductive fluid Jul. 5, 2011
7960247 Die thinning processes and structures Jun. 14, 2011
7956456 Thermal interface material design for enhanced thermal performance and improved package structural integrity Jun. 7, 2011
7948077 Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangement May. 24, 2011
7888786 Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling device Feb. 15, 2011
7884468 Cooling systems for power semiconductor devices Feb. 8, 2011
7855397 Electronic assemblies providing active side heat pumping Dec. 21, 2010
7836597 Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system Nov. 23, 2010
7834448 Fluid cooled semiconductor power module having double-sided cooling Nov. 16, 2010
7816793 Apparatus for facilitating proximity communication between chips Oct. 19, 2010
7795726 Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips Sep. 14, 2010
7763973 Integrated heat sink for a microchip Jul. 27, 2010
7738249 Circuitized substrate with internal cooling structure and electrical assembly utilizing same Jun. 15, 2010
7729117 Housing for cooling electronic control units in motor vehicles Jun. 1, 2010
7723208 Integrated re-combiner for electroosmotic pumps using porous frits May. 25, 2010
7714428 High power semiconductor package and method of making the same May. 11, 2010
7705448 Semiconductor device for pipe for passing refrigerant liquid Apr. 27, 2010
7696015 Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips Apr. 13, 2010
7652372 Microfluidic cooling of integrated circuits Jan. 26, 2010
7612448 Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner Nov. 3, 2009
7612447 Semiconductor devices with layers having extended perimeters for improved cooling and methods for cooling semiconductor devices Nov. 3, 2009
7608924 Liquid cooled power electronic circuit comprising stacked direct die cooled packages Oct. 27, 2009
7592695 Compound heat sink Sep. 22, 2009
7576432 Using external radiators with electroosmotic pumps for cooling integrated circuits Aug. 18, 2009
7569426 Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package Aug. 4, 2009
7557438 Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same Jul. 7, 2009

1 2 3 4 5 6 7 8 9 10 11 12 13

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