 |
|
 |
| |
 |
|
Class Information
Number: 257/E23.098
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Involving transfer of heat by flowing fluids (epo) > By flowing liquids (epo)
Description: This subclass is indented under subclass E23.097. This subclass is substantially the same in scope as ECLA classification H01L23/473.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner |
Nov. 3, 2009 |
| 7612447 |
Semiconductor devices with layers having extended perimeters for improved cooling and methods for cooling semiconductor devices |
Nov. 3, 2009 |
| 7608924 |
Liquid cooled power electronic circuit comprising stacked direct die cooled packages |
Oct. 27, 2009 |
| 7592695 |
Compound heat sink |
Sep. 22, 2009 |
| 7576432 |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
Aug. 18, 2009 |
| 7569426 |
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package |
Aug. 4, 2009 |
| 7557438 |
Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same |
Jul. 7, 2009 |
| 7538426 |
Cooling system of power semiconductor module |
May. 26, 2009 |
| 7538427 |
Microchannel structure and manufacturing method therefor, light source device, and projector |
May. 26, 2009 |
| 7534662 |
Methods for hermetic sealing of post media-filled MEMS package |
May. 19, 2009 |
| 7528483 |
Cooling system for a semiconductor device and method of fabricating same |
May. 5, 2009 |
| 7521789 |
Electrical assembly having heat sink protrusions |
Apr. 21, 2009 |
| 7466023 |
Semiconductor light emitting device and plant cultivating system |
Dec. 16, 2008 |
| 7446406 |
Circuit device and manufacturing method thereof |
Nov. 4, 2008 |
| 7432592 |
Integrated micro-channels for 3D through silicon architectures |
Oct. 7, 2008 |
| 7411290 |
Integrated circuit chip and method for cooling an integrated circuit chip |
Aug. 12, 2008 |
| 7388285 |
Hermetically sealed package for optical, electronic, opto-electronic and other devices |
Jun. 17, 2008 |
| 7355277 |
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package |
Apr. 8, 2008 |
| 7348665 |
Liquid metal thermal interface for an integrated circuit device |
Mar. 25, 2008 |
| 7342306 |
High performance reworkable heatsink and packaging structure with solder release layer |
Mar. 11, 2008 |
| 7335983 |
Carbon nanotube micro-chimney and thermo siphon die-level cooling |
Feb. 26, 2008 |
| 7335984 |
Microfluidics chips and methods of using same |
Feb. 26, 2008 |
| 7336487 |
Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant |
Feb. 26, 2008 |
| 7309453 |
Coolant capable of enhancing corrosion inhibition, system containing same, and method of manufacturing same |
Dec. 18, 2007 |
| 7304380 |
Integrated circuit cooling and insulating device and method |
Dec. 4, 2007 |
| 7295436 |
Cooling system for computer components |
Nov. 13, 2007 |
| 7274106 |
Packaged electroosmotic pumps using porous frits for cooling integrated circuits |
Sep. 25, 2007 |
| 7230315 |
Integrated chemical microreactor with large area channels and manufacturing process thereof |
Jun. 12, 2007 |
| 7218000 |
Liquid solder thermal interface material contained within a cold-formed barrier and methods of making same |
May. 15, 2007 |
| 7205653 |
Fluid cooled encapsulated microelectronic package |
Apr. 17, 2007 |
| 7105382 |
Self-aligned electrodes contained within the trenches of an electroosmotic pump |
Sep. 12, 2006 |
| 7091604 |
Three dimensional integrated circuits |
Aug. 15, 2006 |
| 7078803 |
Integrated circuit heat dissipation system |
Jul. 18, 2006 |
| 7073410 |
Hydraulic motor vehicle gearbox control device with a plastic hydraulic distribution plate and conductors integrated therein |
Jul. 11, 2006 |
| 7071553 |
Package structure compatible with cooling system |
Jul. 4, 2006 |
| 7069737 |
Water-cooling heat dissipation system |
Jul. 4, 2006 |
| 7059390 |
Cooling element |
Jun. 13, 2006 |
| 7059389 |
Integrated cooling unit |
Jun. 13, 2006 |
| 7055468 |
Drive arrangement for a motor vehicle |
Jun. 6, 2006 |
| 7056765 |
Semiconductor device package and method of manufacture |
Jun. 6, 2006 |
| 7057275 |
Device with power semiconductor components for controlling the power of high currents and use of said device |
Jun. 6, 2006 |
| 7044198 |
Electronic apparatus |
May. 16, 2006 |
| 7044199 |
Porous media cold plate |
May. 16, 2006 |
| 7042723 |
Cooling arrangement for an integrated circuit |
May. 9, 2006 |
| 7042725 |
Power switching module and inverter equipped therewith |
May. 9, 2006 |
| 7032392 |
Method and apparatus for cooling an integrated circuit package using a cooling fluid |
Apr. 25, 2006 |
| 7035104 |
Apparatus for heat transfer and critical heat flux enhancement |
Apr. 25, 2006 |
| 7028761 |
Integrated liquid cooling system for electrical components |
Apr. 18, 2006 |
| 7027302 |
Coolant cooled type semiconductor device |
Apr. 11, 2006 |
| 7021367 |
Liquid cooling jacket |
Apr. 4, 2006 |
|
|
|
 |
|
 |
|
| |
Randomly Featured Patents |
|
