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Class Information
Number: 257/E23.097
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Involving transfer of heat by flowing fluids (epo)
Description: This subclass is indented under subclass E23.08. This subclass is substantially the same in scope as ECLA classification H01L23/46.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.099 By flowing gases, e.g., air (epo) 772
257/E23.098 By flowing liquids (epo) 623


Patents under this class:

Patent Number Title Of Patent Date Issued
8604608 Semiconductor module Dec. 10, 2013
8563365 Air-gap C4 fluidic I/O interconnects and methods of fabricating same Oct. 22, 2013
8558394 Chip stack structure and manufacturing method thereof Oct. 15, 2013
8486765 Structure and process for electrical interconnect and thermal management Jul. 16, 2013
8471380 Fluid cooled encapsulated microelectronic package Jun. 25, 2013
8358016 Semiconductor package having an internal cooling system Jan. 22, 2013
8237263 Method and apparatus for cooling an integrated circuit Aug. 7, 2012
8159065 Semiconductor package having an internal cooling system Apr. 17, 2012
8125075 Carbon nanotube micro-chimney and thermo siphon die-level cooling Feb. 28, 2012
8058724 Holistic thermal management system for a semiconductor chip Nov. 15, 2011
8058722 Power semiconductor module and method of manufacturing the same Nov. 15, 2011
8044506 Thermal-emitting memory module, thermal-emitting module socket, and computer system Oct. 25, 2011
8035223 Structure and process for electrical interconnect and thermal management Oct. 11, 2011
8030754 Chip cooling channels formed in wafer bonding gap Oct. 4, 2011
8026597 Fluid cooled encapsulated microelectronic package Sep. 27, 2011
8022535 Systems, devices, and methods for semiconductor device temperature management Sep. 20, 2011
7973433 Power electronics devices with integrated gate drive circuitry Jul. 5, 2011
7834448 Fluid cooled semiconductor power module having double-sided cooling Nov. 16, 2010
7763973 Integrated heat sink for a microchip Jul. 27, 2010
7732918 Vapor chamber heat sink having a carbon nanotube fluid interface Jun. 8, 2010
7723845 System and method of a heat transfer system with an evaporator and a condenser May. 25, 2010
7687901 Heat dissipating fins opposite semiconductor elements Mar. 30, 2010
7679184 Semiconductor device having high cooling efficiency and method for manufacturing the same Mar. 16, 2010
7671466 Semiconductor package having heat dissipating device with cooling fluid Mar. 2, 2010
7656028 System for controlling the temperature of an associated electronic device using an enclosure having a working fluid arranged therein and a chemical compound in the working fluid that undergoes Feb. 2, 2010
7642644 Packaging for high power integrated circuits Jan. 5, 2010
7626260 Stack-type semiconductor device having cooling path on its bottom surface Dec. 1, 2009
7612447 Semiconductor devices with layers having extended perimeters for improved cooling and methods for cooling semiconductor devices Nov. 3, 2009
7592697 Microelectronic package and method of cooling same Sep. 22, 2009
7586126 Light emitting diode lighting module with improved heat dissipation structure Sep. 8, 2009
7586189 Heat dissipation structure accommodated in electronic control device Sep. 8, 2009
7528483 Cooling system for a semiconductor device and method of fabricating same May. 5, 2009
7492042 Integrated circuit cooling and insulating device and method Feb. 17, 2009
7485957 Fluid cooled encapsulated microelectronic package Feb. 3, 2009
7391100 Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area Jun. 24, 2008
7352060 Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate Apr. 1, 2008
7348665 Liquid metal thermal interface for an integrated circuit device Mar. 25, 2008
7335983 Carbon nanotube micro-chimney and thermo siphon die-level cooling Feb. 26, 2008
7285851 Liquid immersion cooled multichip module Oct. 23, 2007
7250674 Coolant cooled type semiconductor device Jul. 31, 2007
7218000 Liquid solder thermal interface material contained within a cold-formed barrier and methods of making same May. 15, 2007
7091604 Three dimensional integrated circuits Aug. 15, 2006
6213195 Modular coolant manifold for use with power electronics devices having integrated coolers Apr. 10, 2001











 
 
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