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Class Information
Number: 257/E23.095
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Complete device being wholly immersed in fluid other than air (epo)
Description: This subclass is indented under subclass E23.08. This subclass is substantially the same in scope as ECLA classification H01L23/44.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.096 Fluid being liquefied gas, e.g., in cryogenic vessel (epo) 56

Patents under this class:

Patent Number Title Of Patent Date Issued
8592971 Direct semiconductor contact ebullient cooling package Nov. 26, 2013
8569113 Method for producing a microfluid component, as well as microfluid component Oct. 29, 2013
7656025 Direct semiconductor contact ebullient cooling package Feb. 2, 2010
7538425 Power semiconductor package having integral fluid cooling May. 26, 2009
7489034 Integrated circuit cooling system and method Feb. 10, 2009
7465600 Package for a micro-electro mechanical device Dec. 16, 2008
7443017 Package having bond-sealed underbump Oct. 28, 2008
7419887 Laser assisted nano deposition Sep. 2, 2008
7285851 Liquid immersion cooled multichip module Oct. 23, 2007
7276398 System and method for hermetically sealing a package Oct. 2, 2007
7192890 Depositing an oxide Mar. 20, 2007
6930385 Cascaded die mountings with spring-loaded contact-bond options Aug. 16, 2005
6772603 Methods and apparatus for thermal management of vehicle systems and components Aug. 10, 2004
6744136 Sealed liquid cooled electronic device Jun. 1, 2004
6601753 Void-free die attachment method with low melting metal Aug. 5, 2003
6524524 Method for making a heat dissipating tube Feb. 25, 2003
6073683 Cooling apparatus using boiling and condensing refrigerant and method for manufacturing the same Jun. 13, 2000
6019167 Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments Feb. 1, 2000
5305184 Method and apparatus for immersion cooling or an electronic board Apr. 19, 1994
5270571 Three-dimensional package for semiconductor devices Dec. 14, 1993
5262675 Laser diode package Nov. 16, 1993
5180001 Heat transfer member Jan. 19, 1993
4741385 Gas jet impingement means and method May. 3, 1988
4668037 Hermetic passage for an enclosure, especially a housing for semiconductors May. 26, 1987
4449580 Vertical wall elevated pressure heat dissipation system May. 22, 1984
4399501 Set of power semiconductors equipped with firing transformers and with protection circuits Aug. 16, 1983
4301465 Cover mounted multi-columnar semiconductor assembly Nov. 17, 1981
4138692 Gas encapsulated cooling module Feb. 6, 1979
4080645 Converter valve comprised of a plurality of modular elements Mar. 21, 1978
4077057 Gas-insulated thyristor arrangement comprising a pressure encapsulation formed in the manner of a tank Feb. 28, 1978
4075682 Gas-insulated thyristor assembly Feb. 21, 1978
3993123 Gas encapsulated cooling module Nov. 23, 1976

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