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Class Information
Number: 257/E23.094
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling (epo) > Auxiliary members in containers characterized by their shape, e.g., pistons (epo) > Pistons, e.g., spring-loaded members (epo)
Description: This subclass is indented under subclass E23.09. This subclass is substantially the same in scope as ECLA classification H01L23/433P.

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8030755 Integrated circuit package system with a heat sink Oct. 4, 2011
7936063 Carrier assembly for an integrated circuit May. 3, 2011
7745930 Semiconductor device packages with substrates for redistributing semiconductor device electrodes Jun. 29, 2010
7569411 Metal MEMS devices and methods of making same Aug. 4, 2009
7339266 Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof Mar. 4, 2008
7023701 Device for cooling memory modules Apr. 4, 2006
7019395 Double-sided cooling type semiconductor module Mar. 28, 2006
7009284 Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element Mar. 7, 2006
6985359 Variable-wedge thermal-interface device Jan. 10, 2006
6940712 Electronic device substrate assembly with multilayer impermeable barrier and method of making Sep. 6, 2005
6892801 Thermal control apparatus for electronic systems May. 17, 2005
6870246 Method and apparatus for providing an integrated circuit cover Mar. 22, 2005
6868899 Variable height thermal interface Mar. 22, 2005
6819562 Cooling apparatus for stacked components Nov. 16, 2004
6804966 Thermal dissipation assembly employing thermoelectric module with multiple arrays of thermoelectric elements of different densities Oct. 19, 2004
6798663 Heat sink hold-down with fan-module attach location Sep. 28, 2004
6778393 Cooling device with multiple compliant elements Aug. 17, 2004
6771507 Power module for multi-chip printed circuit boards Aug. 3, 2004
6695042 Adjustable pedestal thermal interface Feb. 24, 2004
6665188 Snapping device for CPU cooler Dec. 16, 2003
6549407 Heat exchanger retention mechanism Apr. 15, 2003
6538308 Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element Mar. 25, 2003
6496375 Cooling arrangement for high density packaging of electronic components Dec. 17, 2002
6441480 Microelectronic circuit package Aug. 27, 2002
6404638 Small gaps cooling technology Jun. 11, 2002
6251709 Method of manufacturing a cooling structure of a multichip module Jun. 26, 2001
6214647 Method for bonding heatsink to multiple-height chip Apr. 10, 2001
6046498 Device having a heat sink for cooling an integrated circuit Apr. 4, 2000
5999407 Electronic module with conductively heat-sunk components Dec. 7, 1999
5949647 Heat pipe to baseplate attachment method Sep. 7, 1999
5862038 Cooling device for mounting module Jan. 19, 1999
5844311 Multichip module with heat sink and attachment means Dec. 1, 1998
5774334 Low thermal resistant, fluid-cooled semiconductor module Jun. 30, 1998
5751062 Cooling device of multi-chip module May. 12, 1998
RE35721 Cooling device of semiconductor chips Feb. 3, 1998
5705850 Semiconductor module Jan. 6, 1998
5699227 Heat pipe to baseplate attachment method Dec. 16, 1997
5615086 Apparatus for cooling a plurality of electrical components mounted on a printed circuit board Mar. 25, 1997
5595240 Cooling apparatus of electronic devices Jan. 21, 1997
5549835 Apparatus equipped with a cooling block unit having sliding parts and a compound used to the same Aug. 27, 1996
5525548 Process of fixing a heat sink to a semiconductor chip and package cap Jun. 11, 1996
5525835 Semiconductor chip module having an electrically insulative thermally conductive thermal dissipator directly in contact with the semiconductor element Jun. 11, 1996
5515912 Cooling apparatus of electronic devices May. 14, 1996
5463528 Cooling structure for integrated circuits Oct. 31, 1995
5447750 Heat sink method of manufacturing the same and device of manufacturing the same Sep. 5, 1995
5403400 Heat sink method of manufacturing the same and device of manufacturing the same Apr. 4, 1995
5394299 Topology matched conduction cooling module Feb. 28, 1995
5390076 Cooling structure for integrated circuits Feb. 14, 1995
5387815 Semiconductor chip module Feb. 7, 1995
5360993 Cooling unit capable of speedily cooling an integrated circuit chip Nov. 1, 1994

1 2 3

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