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Class Information
Number: 257/E23.093
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling (epo) > Auxiliary members in containers characterized by their shape, e.g., pistons (epo) > In combination with jet impingement (epo)
Description: This subclass is indented under subclass E23.09. This subclass is substantially the same in scope as ECLA classification H01L23/433J.










Patents under this class:

Patent Number Title Of Patent Date Issued
7932535 Synthetic jet cooling system for LED module Apr. 26, 2011
6889515 Spray cooling system May. 10, 2005
6708515 Passive spray coolant pump Mar. 23, 2004
6603662 Computer cooling system Aug. 5, 2003
6123145 Synthetic jet actuators for cooling heated bodies and environments Sep. 26, 2000
6064572 Thermosyphon-powered jet-impingement cooling device May. 16, 2000
5864466 Thermosyphon-powered jet-impingement cooling device Jan. 26, 1999
5705854 Cooling apparatus for electronic device Jan. 6, 1998
5522452 Liquid cooling system for LSI packages Jun. 4, 1996
5491363 Low boiling point liquid coolant cooling structure for electronic circuit package Feb. 13, 1996
5463528 Cooling structure for integrated circuits Oct. 31, 1995
5390076 Cooling structure for integrated circuits Feb. 14, 1995
5384687 Cooling structure for electronic circuit package Jan. 24, 1995
5360993 Cooling unit capable of speedily cooling an integrated circuit chip Nov. 1, 1994
5329419 Integrated circuit package having a cooling mechanism Jul. 12, 1994
5309319 Integral cooling system for electric components May. 3, 1994
5264984 Cooling system for a package with electronic circuit components Nov. 23, 1993
5241131 Erosion/corrosion resistant diaphragm Aug. 31, 1993
5228502 Cooling by use of multiple parallel convective surfaces Jul. 20, 1993
5177667 Thermal conduction module with integral impingement cooling Jan. 5, 1993
5168348 Impingment cooled compliant heat sink Dec. 1, 1992
5097385 Super-position cooling Mar. 17, 1992
5021924 Semiconductor cooling device Jun. 4, 1991
5016090 Cross-hatch flow distribution and applications thereof May. 14, 1991
4940085 Fluid heat exchanger for an electronic component Jul. 10, 1990
4928207 Circuit module with direct liquid cooling by a coolant flowing between a heat producing component and the face of a piston May. 22, 1990
4910642 Coolant activated contact compact high intensity cooler Mar. 20, 1990
4909315 Fluid heat exchanger for an electronic component Mar. 20, 1990
4750086 Apparatus for cooling integrated circuit chips with forced coolant jet Jun. 7, 1988
4740866 Sealed-type liquid cooling device with expandable bellow for semiconductor chips Apr. 26, 1988
4258383 Minimum pressure drop liquid cooled structure for a semiconductor device Mar. 24, 1981











 
 
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