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Class Information
Number: 257/E23.092
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling (epo) > Auxiliary members in containers characterized by their shape, e.g., pistons (epo) > Auxiliary members in encapsulations (epo)
Description: This subclass is indented under subclass E23.09. This subclass is substantially the same in scope as ECLA classification H01L23/433E.

Patents under this class:
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Patent Number Title Of Patent Date Issued
8653626 Package structures including a capacitor and methods of forming the same Feb. 18, 2014
8581375 Leadframe-based mold array package heat spreader and fabrication method therefor Nov. 12, 2013
8575750 Semiconductor detector element configuration for very high efficiency gamma-ray detection Nov. 5, 2013
8508040 In-situ foam materials as integrated heat spreader (IHS) sealant Aug. 13, 2013
8497587 Thermally enhanced expanded wafer level package ball grid array structure and method of making the same Jul. 30, 2013
8482109 Integrated circuit packaging system with dual connection and method of manufacture thereof Jul. 9, 2013
8436462 Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structure May. 7, 2013
8400774 Packaging techniques and configurations Mar. 19, 2013
8384211 Semiconductor apparatus with improved efficiency of thermal radiation Feb. 26, 2013
8310042 Heatsink moldlocks Nov. 13, 2012
8288862 Multiple die stack package Oct. 16, 2012
8288863 Semiconductor package device with a heat dissipation structure and the packaging method thereof Oct. 16, 2012
8269326 Semiconductor device assemblies Sep. 18, 2012
8115285 Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof Feb. 14, 2012
8093699 Circuit device with circuit board and semiconductor chip mounted thereon Jan. 10, 2012
8067827 Stacked microelectronic device assemblies Nov. 29, 2011
8067824 Integrated circuit module package and assembly method thereof Nov. 29, 2011
8058736 Semiconductor device having heat spreader with center opening Nov. 15, 2011
8048690 Pressure-sensitive adhesive sheet and process for producing semiconductor device having same Nov. 1, 2011
8048714 Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities Nov. 1, 2011
8026618 Semiconductor device comprising a plastic housing, a semiconductor chip and an interposer including a convex or concave lens-shape top side fitting shape Sep. 27, 2011
8018072 Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate Sep. 13, 2011
7982307 Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate Jul. 19, 2011
7939921 Leadframe May. 10, 2011
7902648 Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods Mar. 8, 2011
7786591 Die down ball grid array package Aug. 31, 2010
7781900 Semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the same Aug. 24, 2010
7768107 Semiconductor component including semiconductor chip and method for producing the same Aug. 3, 2010
7763959 Heat slug for package structure Jul. 27, 2010
7745930 Semiconductor device packages with substrates for redistributing semiconductor device electrodes Jun. 29, 2010
7739791 Method of producing an overmolded electronic module with a flexible circuit pigtail Jun. 22, 2010
7701045 Point-to-point connection topology for stacked devices Apr. 20, 2010
7682878 Encapsulation circuitry on a substrate Mar. 23, 2010
7675170 Removable wafer expander for die bonding equipment Mar. 9, 2010
7633151 Integrated circuit package lid with a wetting film Dec. 15, 2009
7622804 Semiconductor device and method of manufacturing the same Nov. 24, 2009
7582964 Semiconductor package having non-ceramic based window frame Sep. 1, 2009
7544542 Reduction of damage to thermal interface material due to asymmetrical load Jun. 9, 2009
7521780 Integrated circuit package system with heat dissipation enclosure Apr. 21, 2009
7514774 Stacked multi-chip package with EMI shielding Apr. 7, 2009
7511365 Thermal enhanced low profile package structure Mar. 31, 2009
7489025 Device and method for fabricating double-sided SOI wafer scale package with optical through via connections Feb. 10, 2009
7482699 Semiconductor device Jan. 27, 2009
7397113 Semiconductor device Jul. 8, 2008
7361983 Semiconductor device and semiconductor assembly module with a gap-controlling lead structure Apr. 22, 2008
7323769 High performance chip scale leadframe package with thermal dissipating structure and annular element and method of manufacturing package Jan. 29, 2008
7319051 Thermally enhanced metal capped BGA package Jan. 15, 2008
7315077 Molded leadless package having a partially exposed lead frame pad Jan. 1, 2008
7298046 Semiconductor package having non-ceramic based window frame Nov. 20, 2007
7294530 Method for encapsulating multiple integrated circuits Nov. 13, 2007

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