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Class Information
Number: 257/E23.091
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling (epo) > Auxiliary members in containers characterized by their shape, e.g., pistons (epo) > Bellows (epo)
Description: This subclass is indented under subclass E23.09. This subclass is substantially the same in scope as ECLA classification H01L23/433B.










Patents under this class:

Patent Number Title Of Patent Date Issued
8592971 Direct semiconductor contact ebullient cooling package Nov. 26, 2013
7656025 Direct semiconductor contact ebullient cooling package Feb. 2, 2010
6953227 High-power multi-device liquid cooling Oct. 11, 2005
6816374 High efficiency heat sink/air cooler system for heat-generating components Nov. 9, 2004
RE38588 Lead material for electronic part, lead and semiconductor device using the same Sep. 14, 2004
6173760 Co-axial bellows liquid heatsink for high power module test Jan. 16, 2001
5847366 Apparatus and method for controlling the temperature of an integrated circuit under test Dec. 8, 1998
5640046 Cooling structure for integrated circuit element modules, electronic device and heat sink block Jun. 17, 1997
5491363 Low boiling point liquid coolant cooling structure for electronic circuit package Feb. 13, 1996
5206791 Bellows heat pipe apparatus for cooling systems Apr. 27, 1993
5195020 Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer Mar. 16, 1993
5166863 Liquid-cooled assembly of heat-generating devices and method for assembling and disassembling Nov. 24, 1992
5145001 High heat flux compact heat exchanger having a permeable heat transfer element Sep. 8, 1992
5126919 Cooling system for an electronic circuit device Jun. 30, 1992
5050037 Liquid-cooling module system for electronic circuit components Sep. 17, 1991
5029638 High heat flux compact heat exchanger having a permeable heat transfer element Jul. 9, 1991
4996589 Semiconductor module and cooling device of the same Feb. 26, 1991
4977443 Semiconductor module and an electronic computer using the semiconductor module Dec. 11, 1990
4949219 Module sealing structure Aug. 14, 1990
4920574 Cooling system for an electronic circuit device Apr. 24, 1990
4910642 Coolant activated contact compact high intensity cooler Mar. 20, 1990
4879632 Cooling system for an electronic circuit device Nov. 7, 1989
4879629 Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation Nov. 7, 1989
4870477 Integrated circuit chips cooling module having coolant leakage prevention device Sep. 26, 1989
4858077 Condenser-containing, ceramic multi-layer circuit board and semiconductor module and computer having the circuit board Aug. 15, 1989
4825284 Semiconductor resin package structure Apr. 25, 1989
4819857 Method for fabricating composite structure Apr. 11, 1989
4809134 Low stress liquid cooling assembly Feb. 28, 1989
4783721 Cooling system for an electronic circuit device Nov. 8, 1988
4759403 Hydraulic manifold for water cooling of multi-chip electric modules Jul. 26, 1988
4750086 Apparatus for cooling integrated circuit chips with forced coolant jet Jun. 7, 1988
4740866 Sealed-type liquid cooling device with expandable bellow for semiconductor chips Apr. 26, 1988
4729060 Cooling system for electronic circuit device Mar. 1, 1988
4712158 Cooling system for electronic circuit components Dec. 8, 1987
4688147 Cooling device attached to each surface of electronic parts on a printed-wiring board Aug. 18, 1987
4686606 Device for cooling integrated circuit chip Aug. 11, 1987
4644385 Cooling module for integrated circuit chips Feb. 17, 1987
4558395 Cooling module for integrated circuit chips Dec. 10, 1985
4450505 Apparatus for cooling integrated circuit chips May. 22, 1984
4138692 Gas encapsulated cooling module Feb. 6, 1979











 
 
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