Resources Contact Us Home
Browse by Category: Main > Physics
Class Information
Number: 257/E23.09
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling (epo) > Auxiliary members in containers characterized by their shape, e.g., pistons (epo)
Description: This subclass is indented under subclass E23.087. This subclass is substantially the same in scope as ECLA classification H01L23/433.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.092 Auxiliary members in encapsulations (epo) 850
257/E23.091 Bellows (epo) 40
257/E23.093 In combination with jet impingement (epo) 31
257/E23.094 Pistons, e.g., spring-loaded members (epo) 115

Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8592971 Direct semiconductor contact ebullient cooling package Nov. 26, 2013
8546935 Semiconductor packages Oct. 1, 2013
7728440 Warp-suppressed semiconductor device Jun. 1, 2010
7700943 In-situ functionalization of carbon nanotubes Apr. 20, 2010
7687901 Heat dissipating fins opposite semiconductor elements Mar. 30, 2010
7656025 Direct semiconductor contact ebullient cooling package Feb. 2, 2010
7633151 Integrated circuit package lid with a wetting film Dec. 15, 2009
7622314 Carbon nanotube structures and methods of manufacture and use Nov. 24, 2009
7608917 Power semiconductor module Oct. 27, 2009
7581583 Heat dissipating device with adjusting member Sep. 1, 2009
7544542 Reduction of damage to thermal interface material due to asymmetrical load Jun. 9, 2009
7488532 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same Feb. 10, 2009
7473607 Method of manufacturing a multi-workfunction gates for a CMOS circuit Jan. 6, 2009
7170165 Circuit board assembly with a brace surrounding a ball-grid array device Jan. 30, 2007
7066244 Temperature-homogenizing device Jun. 27, 2006
7063127 Method and apparatus for chip-cooling Jun. 20, 2006
7042729 Thermal interface apparatus, systems, and fabrication methods May. 9, 2006
7031162 Method and structure for cooling a dual chip module with one high power chip Apr. 18, 2006
7025129 Adhesive to attach a cooling device to a thermal interface Apr. 11, 2006
7014093 Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same Mar. 21, 2006
7016196 Radiating structural body of electronic part and radiating sheet used for the radiating structural body Mar. 21, 2006
7007741 Conformal heat spreader Mar. 7, 2006
7006354 Heat radiating structure for electronic device Feb. 28, 2006
6998706 Relaxed tolerance flip chip assembly Feb. 14, 2006
6987032 Ball grid array package and process for manufacturing same Jan. 17, 2006
6987671 Composite thermal interface devices and methods for integrated circuit heat transfer Jan. 17, 2006
6982877 Heat sink having compliant interface to span multiple components Jan. 3, 2006
6977818 Heat dissipating device for an integrated circuit chip Dec. 20, 2005
6970358 Stack up assembly Nov. 29, 2005
6965513 Carbon nanotube thermal interface structures Nov. 15, 2005
6952050 Semiconductor package Oct. 4, 2005
6947293 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management Sep. 20, 2005
6947286 Stack up assembly Sep. 20, 2005
6933176 Ball grid array package and process for manufacturing same Aug. 23, 2005
6924559 Electronic device with heat conductive encasing device Aug. 2, 2005
6922340 Stack up assembly Jul. 26, 2005
6921973 Electronic module having compliant spacer Jul. 26, 2005
6908669 Thermal interface materials Jun. 21, 2005
6906259 High frequency module Jun. 14, 2005
6900987 Stack up assembly May. 31, 2005
6888722 Thermal design for minimizing interface in a multi-site thermal contact condition May. 3, 2005
6882043 Electronic assembly having an indium thermal couple Apr. 19, 2005
6882536 Wrap-around cooling arrangement for printed circuit board Apr. 19, 2005
6873530 Stack up assembly Mar. 29, 2005
6873043 Electronic assembly having electrically-isolated heat-conductive structure Mar. 29, 2005
6868899 Variable height thermal interface Mar. 22, 2005
6867972 Power component assembly for mechatronic integration of power components Mar. 15, 2005
6867978 Integrated heat spreader package for heat transfer and for bond line thickness control and process of making Mar. 15, 2005
6862186 Stack up assembly Mar. 1, 2005
6856016 Method and apparatus using nanotubes for cooling and grounding die Feb. 15, 2005

1 2 3 4 5 6

  Recently Added Patents
Method for modeling and analyzing linear time invariant systems with time delays
Television with a stand
Vehicle detection apparatus and method using magnetic sensor
Identification wristband
Method and system of a sensor interface having dynamic automatic gain control
Light source lighting device including a constant-current supply that is connected to a light source and supplies a constant current of a substantially constant magnitude to the light source,
Apparatus for touch screen avionic device
  Randomly Featured Patents
Regulatory element for expressing genes in plants
Lawn rake having replacement tines secured to rake body by pegs
System and method for maintaining performance data in a data processing system
Self adjusting optimal waveforms
Method and system of harmonic regulation
Video game with switchable collision graphics
Ventilated head covering
Method and system for personalized venue marketing
System and method for bone fixation
Wall mountable shoe shining apparatus