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Class Information
Number: 257/E23.089
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling (epo) > Cooling by change of state, e.g., use of heat pipes (epo) > By melting or evaporation of solids (epo)
Description: This subclass is indented under subclass E23.088. This subclass is substantially the same in scope as ECLA classification H01L23/427S.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8609464 Method for shielding semiconductor device Dec. 17, 2013
7781900 Semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the same Aug. 24, 2010
7727815 Reactive gettering in phase change solders to inhibit oxidation at contact surfaces Jun. 1, 2010
7521799 Semiconductor device and method of manufacturing the same Apr. 21, 2009
7476982 Fabricated adhesive microstructures for making an electrical connection Jan. 13, 2009
7132746 Electronic assembly with solder-bonded heat sink Nov. 7, 2006
7074490 Thermally conductive phase change materials Jul. 11, 2006
7069975 Method and apparatus for cooling with a phase change material and heat pipes Jul. 4, 2006
7056566 Preappliable phase change thermal interface pad Jun. 6, 2006
7042727 Heat sink mounting and interface mechanism and method of assembling same May. 9, 2006
7013555 Method of applying phase change thermal interface materials Mar. 21, 2006
7004244 Thermal interface wafer and method of making and using the same Feb. 28, 2006
6994151 Vapor escape microchannel heat exchanger Feb. 7, 2006
6971443 Thermal module with temporary heat storage Dec. 6, 2005
6963131 Integrated circuit system with a latent heat storage module Nov. 8, 2005
6959753 Construction of phase change material embedded electronic circuit boards and electronic circuit board assemblies using porous and fibrous media Nov. 1, 2005
6956739 High temperature stable thermal interface material Oct. 18, 2005
6946190 Thermal management materials Sep. 20, 2005
6940721 Thermal interface structure for placement between a microelectronic component package and heat sink Sep. 6, 2005
6913075 Dendritic fiber material Jul. 5, 2005
6908669 Thermal interface materials Jun. 21, 2005
6901997 Thermal interface wafer and method of making and using the same Jun. 7, 2005
6889755 Heat pipe having a wick structure containing phase change materials May. 10, 2005
6888722 Thermal design for minimizing interface in a multi-site thermal contact condition May. 3, 2005
6869642 Phase change thermal interface composition having induced bonding property Mar. 22, 2005
6856037 Method and apparatus for converting dissipated heat to work energy Feb. 15, 2005
6849941 Heat sink and heat spreader assembly Feb. 1, 2005
6847113 Electronic apparatus with plate-like member having plural recesses containing heat accumulating material Jan. 25, 2005
6835453 Clean release, phase change thermal interface Dec. 28, 2004
6797382 Thermal interface materials Sep. 28, 2004
6764759 Method of forming a phase change thermal interface Jul. 20, 2004
6761928 Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink Jul. 13, 2004
6752204 Iodine-containing thermal interface material Jun. 22, 2004
6703128 Thermally-capacitive phase change encapsulant for electronic devices Mar. 9, 2004
6672370 Apparatus and method for passive phase change thermal management Jan. 6, 2004
6672378 Thermal interface wafer and method of making and using the same Jan. 6, 2004
6673434 Thermal interface materials Jan. 6, 2004
6656770 Thermal enhancement approach using solder compositions in the liquid state Dec. 2, 2003
6651331 Method of establishing a thermal joint on a heat sink Nov. 25, 2003
6652705 Graphitic allotrope interface composition and method of fabricating the same Nov. 25, 2003
6631755 Thermal module with temporary heat storage Oct. 14, 2003
6620515 Thermally conductive phase change materials Sep. 16, 2003
6621702 Method and apparatus for absorbing thermal energy Sep. 16, 2003
6616999 Preapplicable phase change thermal interface pad Sep. 9, 2003
6617517 Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink Sep. 9, 2003
6570362 Portable electronic device with enhanced battery life and cooling May. 27, 2003
6451422 Thermal interface materials Sep. 17, 2002
6399209 Integrated release films for phase-change interfaces Jun. 4, 2002
6400565 Thermally conductive interface member Jun. 4, 2002
6372997 Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink Apr. 16, 2002

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