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Class Information
Number: 257/E23.088
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling (epo) > Cooling by change of state, e.g., use of heat pipes (epo)
Description: This subclass is indented under subclass E23.087. This subclass is substantially the same in scope as ECLA classification H01L23/427.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7372148 |
Semiconductor chip having coolant path, semiconductor package and package cooling system using the same |
May. 13, 2008 |
| 7348604 |
Light-emitting module |
Mar. 25, 2008 |
| 7323776 |
Elevated heat dissipating device |
Jan. 29, 2008 |
| 7304379 |
Semiconductor device with pipe for passing refrigerant liquid |
Dec. 4, 2007 |
| 7304380 |
Integrated circuit cooling and insulating device and method |
Dec. 4, 2007 |
| 7298044 |
Electronic device with heat dissipation module |
Nov. 20, 2007 |
| 7250674 |
Coolant cooled type semiconductor device |
Jul. 31, 2007 |
| 7193316 |
Integrated circuit coolant microchannel with movable portion |
Mar. 20, 2007 |
| 7073568 |
Heat dissipation device |
Jul. 11, 2006 |
| 7072181 |
Heat dissipating device and electronic apparatus including the same |
Jul. 4, 2006 |
| 7068510 |
Dissipating heat reliably in computer systems |
Jun. 27, 2006 |
| 7066240 |
Integrated circuit heat pipe heat spreader with through mounting holes |
Jun. 27, 2006 |
| 7063129 |
Heat transport device and electronic apparatus |
Jun. 20, 2006 |
| 7059391 |
Multiple evaporator heat pipe assisted heat sink |
Jun. 13, 2006 |
| 7057895 |
Thermal standoff for close proximity thermal management |
Jun. 6, 2006 |
| 7055341 |
High efficiency cooling system and heat absorbing unit |
Jun. 6, 2006 |
| 7051792 |
Heat dissipation device |
May. 30, 2006 |
| 7051793 |
Cooler for electrical components |
May. 30, 2006 |
| 7047640 |
Method of manufacturing a heat dissipating device |
May. 23, 2006 |
| 7048039 |
CTE-matched heat pipe |
May. 23, 2006 |
| 7044201 |
Flat heat transferring device and method of fabricating the same |
May. 16, 2006 |
| 7042728 |
Clamping structure and heat dissipating module using same |
May. 9, 2006 |
| 7040389 |
Integrated heat dissipation apparatus |
May. 9, 2006 |
| 7032652 |
Structure of heat conductive plate |
Apr. 25, 2006 |
| 7031159 |
Parallel heat exchanger for a component in a mobile system |
Apr. 18, 2006 |
| 7028760 |
Integrated circuit heat pipe heat spreader with through mounting holes |
Apr. 18, 2006 |
| 7028757 |
Twin fin arrayed cooling device with liquid chamber |
Apr. 18, 2006 |
| 7027304 |
Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials |
Apr. 11, 2006 |
| 7025124 |
Supporting structure for planar heat pipe |
Apr. 11, 2006 |
| 7021367 |
Liquid cooling jacket |
Apr. 4, 2006 |
| 7021368 |
Heat dissipating device with uniform heat points |
Apr. 4, 2006 |
| 7013960 |
Heat dissipation device |
Mar. 21, 2006 |
| 7011146 |
Microchannel heat pipe with parallel grooves for recycling coolant |
Mar. 14, 2006 |
| 7011145 |
Method for enhancing mobility of working fluid in liquid/gas phase heat dissipating device |
Mar. 14, 2006 |
| 7007506 |
Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator |
Mar. 7, 2006 |
| 7007746 |
Circulative cooling apparatus |
Mar. 7, 2006 |
| 7004239 |
Cooling apparatus boiling and condensing refrigerant |
Feb. 28, 2006 |
| 7006354 |
Heat radiating structure for electronic device |
Feb. 28, 2006 |
| 7005738 |
Semiconductor package with lid heat spreader |
Feb. 28, 2006 |
| 7002247 |
Thermal interposer for thermal management of semiconductor devices |
Feb. 21, 2006 |
| 7000686 |
Heat transport device and electronic device |
Feb. 21, 2006 |
| 7000687 |
Heat dissipating device |
Feb. 21, 2006 |
| 7002804 |
Heat dissipating apparatus |
Feb. 21, 2006 |
| 7002801 |
Method of cooling semiconductor die using microchannel thermosyphon |
Feb. 21, 2006 |
| 7002800 |
Integrated power and cooling architecture |
Feb. 21, 2006 |
| 6999314 |
Cooling device, electronic equipment device, and method of manufacturing cooling device |
Feb. 14, 2006 |
| 6994151 |
Vapor escape microchannel heat exchanger |
Feb. 7, 2006 |
| 6992891 |
Metal ball attachment of heat dissipation devices |
Jan. 31, 2006 |
| 6988315 |
Cooling apparatus having low profile extrusion and method of manufacture therefor |
Jan. 24, 2006 |
| 6988531 |
Micro-chimney and thermosiphon die-level cooling |
Jan. 24, 2006 |
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