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Class Information
Number: 257/E23.088
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling (epo) > Cooling by change of state, e.g., use of heat pipes (epo)
Description: This subclass is indented under subclass E23.087. This subclass is substantially the same in scope as ECLA classification H01L23/427.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.089 By melting or evaporation of solids (epo) 71


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14

Patent Number Title Of Patent Date Issued
8704344 Ultra-small chip package and method for manufacturing the same Apr. 22, 2014
8648462 Semiconductor power module Feb. 11, 2014
8598702 Semiconductor package Dec. 3, 2013
8564120 Heat dissipation in temperature critical device areas of semiconductor devices by heat pipes connecting to the substrate backside Oct. 22, 2013
8471380 Fluid cooled encapsulated microelectronic package Jun. 25, 2013
8405992 Power-electronic arrangement Mar. 26, 2013
8395255 Semiconductor device having a cooling function component Mar. 12, 2013
8286694 Chemically compatible, lightweight heat pipe Oct. 16, 2012
8283773 Semiconductor device having anti-warping sheet Oct. 9, 2012
8248785 Electronic device with thermal insulation member for heat sink Aug. 21, 2012
8243449 Heat-transporting device and electronic apparatus Aug. 14, 2012
8044506 Thermal-emitting memory module, thermal-emitting module socket, and computer system Oct. 25, 2011
7990712 Heat sink used in interface card Aug. 2, 2011
7990714 Heat dissipation device and fasteners thereof Aug. 2, 2011
7974096 Three-dimensional thermal spreading in an air-cooled thermal device Jul. 5, 2011
7944688 Heat dissipating structure including a position-adjusting unit May. 17, 2011
7859103 Semiconductor module and inverter device Dec. 28, 2010
7851815 Light-emitting element having at least one light-emitting chip crystal Dec. 14, 2010
7843008 Semiconductor device Nov. 30, 2010
7785931 Chip-based thermo-stack Aug. 31, 2010
7763970 Power module Jul. 27, 2010
7732300 Method of bonding aluminum electrodes of two semiconductor substrates Jun. 8, 2010
7709352 In-place bonding of microstructures May. 4, 2010
7696532 Power semiconductor module Apr. 13, 2010
7671466 Semiconductor package having heat dissipating device with cooling fluid Mar. 2, 2010
7656028 System for controlling the temperature of an associated electronic device using an enclosure having a working fluid arranged therein and a chemical compound in the working fluid that undergoes Feb. 2, 2010
7646064 Semiconductor die with aluminum-spiked heat pipes Jan. 12, 2010
7642644 Packaging for high power integrated circuits Jan. 5, 2010
7622804 Semiconductor device and method of manufacturing the same Nov. 24, 2009
7602610 Electronic device Oct. 13, 2009
7560813 Chip-based thermo-stack Jul. 14, 2009
7547966 Power semiconductor module Jun. 16, 2009
7521792 Semiconductor package with heat spreader Apr. 21, 2009
7493693 Method for fabricating multi-layer wick structure of heat pipe Feb. 24, 2009
7372148 Semiconductor chip having coolant path, semiconductor package and package cooling system using the same May. 13, 2008
7348604 Light-emitting module Mar. 25, 2008
7323776 Elevated heat dissipating device Jan. 29, 2008
7304380 Integrated circuit cooling and insulating device and method Dec. 4, 2007
7304379 Semiconductor device with pipe for passing refrigerant liquid Dec. 4, 2007
7298044 Electronic device with heat dissipation module Nov. 20, 2007
7250674 Coolant cooled type semiconductor device Jul. 31, 2007
7193316 Integrated circuit coolant microchannel with movable portion Mar. 20, 2007
7073568 Heat dissipation device Jul. 11, 2006
7072181 Heat dissipating device and electronic apparatus including the same Jul. 4, 2006
7066240 Integrated circuit heat pipe heat spreader with through mounting holes Jun. 27, 2006
7068510 Dissipating heat reliably in computer systems Jun. 27, 2006
7063129 Heat transport device and electronic apparatus Jun. 20, 2006
7059391 Multiple evaporator heat pipe assisted heat sink Jun. 13, 2006
7055341 High efficiency cooling system and heat absorbing unit Jun. 6, 2006
7057895 Thermal standoff for close proximity thermal management Jun. 6, 2006

1 2 3 4 5 6 7 8 9 10 11 12 13 14










 
 
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