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Class Information
Number: 257/E23.087
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling (epo)
Description: This subclass is indented under subclass E23.08. This subclass is substantially the same in scope as ECLA classification H01L23/42.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.09 Auxiliary members in containers characterized by their shape, e.g., pistons (epo) 266
257/E23.088 Cooling by change of state, e.g., use of heat pipes (epo) 654


Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8686558 Thermally and electrically enhanced ball grid array package Apr. 1, 2014
8592971 Direct semiconductor contact ebullient cooling package Nov. 26, 2013
8581375 Leadframe-based mold array package heat spreader and fabrication method therefor Nov. 12, 2013
8581392 Silicon based microchannel cooling and electrical package Nov. 12, 2013
8564119 Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system Oct. 22, 2013
8546930 3-D ICs equipped with double sided power, coolant, and data features Oct. 1, 2013
8421220 Silicon based microchannel cooling and electrical package Apr. 16, 2013
8324719 Electronic package system Dec. 4, 2012
8247891 Chip package structure including heat dissipation device and an insulation sheet Aug. 21, 2012
8138597 Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layer Mar. 20, 2012
8110415 Silicon based microchannel cooling and electrical package Feb. 7, 2012
8084778 Light emitting diode package Dec. 27, 2011
8063482 Heat spreader as mechanical reinforcement for ultra-thin die Nov. 22, 2011
7944045 Semiconductor module molded by resin with heat radiation plate opened outside from mold May. 17, 2011
7923846 Integrated circuit package-in-package system with wire-in-film encapsulant Apr. 12, 2011
7906794 Light emitting device package with frame and optically transmissive element Mar. 15, 2011
7843008 Semiconductor device Nov. 30, 2010
7838985 Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers Nov. 23, 2010
7830000 Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system Nov. 9, 2010
7768107 Semiconductor component including semiconductor chip and method for producing the same Aug. 3, 2010
7737548 Semiconductor die package including heat sinks Jun. 15, 2010
7679175 Semiconductor device including substrate and upper plate having reduced warpage Mar. 16, 2010
7656025 Direct semiconductor contact ebullient cooling package Feb. 2, 2010
7645641 Cooling device with a preformed compliant interface Jan. 12, 2010
7633151 Integrated circuit package lid with a wetting film Dec. 15, 2009
7622803 Heat sink assembly and related methods for semiconductor vacuum processing systems Nov. 24, 2009
7544542 Reduction of damage to thermal interface material due to asymmetrical load Jun. 9, 2009
7388285 Hermetically sealed package for optical, electronic, opto-electronic and other devices Jun. 17, 2008
7381346 Thermal interface material Jun. 3, 2008
7378731 Heat spreader and package structure utilizing the same May. 27, 2008
7345364 Structure and method for improved heat conduction for semiconductor devices Mar. 18, 2008
7342306 High performance reworkable heatsink and packaging structure with solder release layer Mar. 11, 2008
7329948 Microelectronic devices and methods Feb. 12, 2008
7250674 Coolant cooled type semiconductor device Jul. 31, 2007
7193316 Integrated circuit coolant microchannel with movable portion Mar. 20, 2007
7088586 Techniques for cooling a circuit board component within an environment with little or no forced convection airflow Aug. 8, 2006
7068514 Protection structure for thermal conducting medium of heat dissipation device Jun. 27, 2006
7068512 Heat dissipation device incorporating with protective cover Jun. 27, 2006
7064014 Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices Jun. 20, 2006
7057891 Heat dissipation structure Jun. 6, 2006
7051790 Protect cover for a radiator May. 30, 2006
7041535 Power module and method of manufacturing the same May. 9, 2006
7042729 Thermal interface apparatus, systems, and fabrication methods May. 9, 2006
7042727 Heat sink mounting and interface mechanism and method of assembling same May. 9, 2006
7037753 Non-planar surface for semiconductor chips May. 2, 2006
7031162 Method and structure for cooling a dual chip module with one high power chip Apr. 18, 2006
7019977 Method of attaching non-adhesive thermal interface materials Mar. 28, 2006
7016196 Radiating structural body of electronic part and radiating sheet used for the radiating structural body Mar. 21, 2006
7013965 Organic matrices containing nanomaterials to enhance bulk thermal conductivity Mar. 21, 2006
7009291 Semiconductor module and semiconductor device Mar. 7, 2006

1 2 3 4 5










 
 
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