Resources Contact Us Home
Browse by Category: Main > Physics
Class Information
Number: 257/E23.085
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Mountings or securing means for detachable cooling or heating arrangements; fixed by friction, plugs or springs (epo) > With bolts or screws (epo) > For stacked arrangements of plurality of semiconductor devices (epo)
Description: This subclass is indented under subclass E23.084. This subclass is substantially the same in scope as ECLA classification H01L23/40B8.

Patents under this class:
1 2 3 4 5 6

Patent Number Title Of Patent Date Issued
8710642 Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus Apr. 29, 2014
8710675 Integrated circuit package system with bonding lands Apr. 29, 2014
8704384 Stacked die assembly Apr. 22, 2014
8680667 Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements Mar. 25, 2014
8664772 Interface substrate with interposer Mar. 4, 2014
8653642 Method for creating and packaging three dimensional stacks of biochips containing microelectro-mechanical systems Feb. 18, 2014
8643163 Integrated circuit package-on-package stacking system and method of manufacture thereof Feb. 4, 2014
8643193 Semiconductor packages and electronic systems including the same Feb. 4, 2014
8629001 Semiconductor device and method of manufacturing semiconductor device Jan. 14, 2014
8587132 Semiconductor package including an organic substrate and interposer having through-semiconductor vias Nov. 19, 2013
8581417 Semiconductor device stack with bonding layer and wire retaining member Nov. 12, 2013
8569885 Stacked semiconductor packages and related methods Oct. 29, 2013
8563365 Air-gap C4 fluidic I/O interconnects and methods of fabricating same Oct. 22, 2013
8558365 Package in package device for RF transceiver module Oct. 15, 2013
8558395 Organic interface substrate having interposer with through-semiconductor vias Oct. 15, 2013
8551816 Direct edge connection for multi-chip integrated circuits Oct. 8, 2013
8546932 Thin substrate PoP structure Oct. 1, 2013
8536713 System in package with heat sink Sep. 17, 2013
8531020 Stacked packaging improvements Sep. 10, 2013
8513792 Package-on-package interconnect stiffener Aug. 20, 2013
8502370 Stack package structure and fabrication method thereof Aug. 6, 2013
8502368 Multi-chip package with offset die stacking Aug. 6, 2013
8492889 Semiconductor package Jul. 23, 2013
8487421 Microelectronic package with stacked microelectronic elements and method for manufacture thereof Jul. 16, 2013
8487422 Chip stack with conductive column through electrically insulated semiconductor region Jul. 16, 2013
8482129 Wafer-level stack package and method of fabricating the same Jul. 9, 2013
8482957 Three dimensionally stacked non volatile memory units Jul. 9, 2013
8471377 Semiconductor device and semiconductor circuit substrate Jun. 25, 2013
8461689 Packaging structure having embedded semiconductor element Jun. 11, 2013
8450839 Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices May. 28, 2013
8446018 Package on package May. 21, 2013
8426946 Laminated semiconductor substrate, laminated chip package and method of manufacturing the same Apr. 23, 2013
8426958 Stacked chip package with redistribution lines Apr. 23, 2013
8415783 Apparatus and methodology for testing stacked die Apr. 9, 2013
8405221 Semiconductor device and multilayer semiconductor device Mar. 26, 2013
8399974 Methods of dicing stacked shingled strip constructions to form stacked die packages Mar. 19, 2013
8390114 Semiconductor package Mar. 5, 2013
8378478 Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts Feb. 19, 2013
8357999 Assembly having stacked die mounted on substrate Jan. 22, 2013
8350373 Chip stacked structure and method of fabricating the same Jan. 8, 2013
8344519 Stacked-die package for battery power management Jan. 1, 2013
8344491 Multi-die building block for stacked-die package Jan. 1, 2013
8338962 Semiconductor package substrate and semiconductor package having the same Dec. 25, 2012
8319326 Stacked die with vertically-aligned conductors and methods for making the same Nov. 27, 2012
8319329 Stacked integrated circuit package having recessed sidewalls Nov. 27, 2012
8310045 Semiconductor package with heat dissipation devices Nov. 13, 2012
8309397 Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof Nov. 13, 2012
8304898 Integrated circuit package system with overhang film Nov. 6, 2012
8304918 Method for manufacturing electronic device and electronic device Nov. 6, 2012
8299585 Power semiconductor device Oct. 30, 2012

1 2 3 4 5 6

  Recently Added Patents
Secure data entry device
Comparison of visual information
Method of modified facies proportions upon history matching of a geological model
Insulated container sleeve
Method of measuring specific absorption rate of electromagnetic waves
Managing deduplication density
Lead with lead stiffener for implantable electrical stimulation systems and methods of making and using
  Randomly Featured Patents
Apparatus for and method of manufacturing sheets
Readout circuit for a charge detector
Low swage load fastening system and method
Reflow apparatus, reflow method, and package apparatus
Rear mount bicycle carrier rack for motor vehicles
Rising stem soft seat plug valve
Hydraulic control system
Assembly for placing a prosthetic valve in a duct in the body
Gravity habitat module for space vehicle
Fuel injection pump