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Class Information
Number: 257/E23.083
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Mountings or securing means for detachable cooling or heating arrangements; fixed by friction, plugs or springs (epo)
Description: This subclass is indented under subclass E23.08. This subclass is substantially the same in scope as ECLA classification H01L23/40.










Sub-classes under this class:

Class Number Class Name Patents
257/E23.086 Snap-on arrangements, e.g., clips (epo) 738
257/E23.084 With bolts or screws (epo) 494


Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8680673 Integrated heat pillar for hot region cooling in an integrated circuit Mar. 25, 2014
8643170 Method of assembling semiconductor device including insulating substrate and heat sink Feb. 4, 2014
8597984 Modular low stress package technology Dec. 3, 2013
8519546 Stacked multi-die electronic device with interposed electrically conductive strap Aug. 27, 2013
8441128 Semiconductor arrangement May. 14, 2013
8310045 Semiconductor package with heat dissipation devices Nov. 13, 2012
8288845 Package including proximately-positioned lead frame Oct. 16, 2012
8283777 Compressive ring structure for flip chip packaging Oct. 9, 2012
8242595 Heatsink and semiconductor device with heatsink Aug. 14, 2012
8124983 Power transistor Feb. 28, 2012
8115303 Semiconductor package structures having liquid coolers integrated with first level chip package modules Feb. 14, 2012
8063481 High-speed memory package Nov. 22, 2011
7960829 Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates Jun. 14, 2011
7932598 Connection between a semiconductor housing and a base plate comprising a passage opening for fastening to a heat sink Apr. 26, 2011
7847395 Package and package assembly of power device Dec. 7, 2010
7843058 Flip chip packages with spacers separating heat sinks and substrates Nov. 30, 2010
7834446 Electronic device and method for coping with electrostatic discharge Nov. 16, 2010
7816698 Heat dissipation package for heat generation element Oct. 19, 2010
7760505 Power semiconductor module Jul. 20, 2010
7687920 Integrated circuit package-on-package system with central bond wires Mar. 30, 2010
7683479 Semiconductor package involving a rotary lock that connects a package substrate and a separate component Mar. 23, 2010
7666714 Assembly of thin die coreless package Feb. 23, 2010
7638814 Solderless integrated package connector and heat sink for LED Dec. 29, 2009
7485956 Microelectronic package optionally having differing cover and device thermal expansivities Feb. 3, 2009
7427809 Repairable three-dimensional semiconductor subsystem Sep. 23, 2008
7361985 Thermally enhanced molded package for semiconductors Apr. 22, 2008
7315446 Hard drive connecting device for notebook computer Jan. 1, 2008
7309918 Chip package structure Dec. 18, 2007
7304381 Package and method for attaching an integrated heat spreader Dec. 4, 2007
7285851 Liquid immersion cooled multichip module Oct. 23, 2007
7208342 Package warpage control Apr. 24, 2007
7122448 Annealing apparatus, annealing method, and manufacturing method of a semiconductor device Oct. 17, 2006
7034395 Power semiconductor module with cooling element and pressing apparatus Apr. 25, 2006
7030484 Lidless chip package effectively having co-planar frame and semiconductor die surfaces Apr. 18, 2006
7023700 Heat sink riveted to memory module with upper slots and open bottom edge for air flow Apr. 4, 2006
7002804 Heat dissipating apparatus Feb. 21, 2006
6992889 Retention module, heat sink and electronic device Jan. 31, 2006
6987672 Blindmate heat sink assembly Jan. 17, 2006
6969907 Cooling structure for multichip module Nov. 29, 2005
6939742 Thermal gap control Sep. 6, 2005
6921277 Processor and heat sink actuation system Jul. 26, 2005
6903271 Electronic assembly with thermally separated support Jun. 7, 2005
6829146 Blindmate heat sink assembly Dec. 7, 2004
6822867 Electronic assembly with solderable heat sink and methods of manufacture Nov. 23, 2004
6809929 Heat sink assembly with retaining device Oct. 26, 2004
6753603 Electronic equipment having insulating heat dissipation plate Jun. 22, 2004
6734043 Pressure-bonded heat sink method May. 11, 2004
6724628 Blindmate heat sink assembly Apr. 20, 2004
6705389 Reconfigurable system and method for cooling heat generating objects Mar. 16, 2004
6700195 Electronic assembly for removing heat from a flip chip Mar. 2, 2004

1 2 3










 
 
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