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Class Information
Number: 257/E23.081
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo) > Arrangements for heating (epo)
Description: This subclass is indented under subclass E23.08. This subclass is substantially the same in scope as ECLA classification H01L23/34H.

Patents under this class:
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Patent Number Title Of Patent Date Issued
8507909 Measuring apparatus that includes a chip with a through silicon via, a heater having plural switches, and a stress sensor Aug. 13, 2013
8502224 Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor Aug. 6, 2013
8497544 Repairing defects in a nonvolatile semiconductor memory module utilizing a heating element Jul. 30, 2013
8461589 Circuit having integrated heating structure for parametric trimming Jun. 11, 2013
8377683 Zinc oxide-based nanostructure modified QCM for dynamic monitoring of cell adhesion and proliferation Feb. 19, 2013
8378504 Microelectronic package with self-heating interconnect Feb. 19, 2013
8138105 Rapid thermal processing using energy transfer layers Mar. 20, 2012
7884455 Semiconductor device Feb. 8, 2011
7875502 Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners Jan. 25, 2011
7872338 Microelectromechanical device packages with integral heaters Jan. 18, 2011
RE41801 Thin-film thermoelectric device and fabrication method of same Oct. 5, 2010
7799612 Process applying die attach film to singulated die Sep. 21, 2010
7732932 Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners Jun. 8, 2010
7608915 Heat dissipation semiconductor package Oct. 27, 2009
7564138 Method for attaching chips in a flip-chip arrangement Jul. 21, 2009
7468554 Heat sink board and manufacturing method thereof Dec. 23, 2008
7301227 Package lid or heat spreader for microprocessor packages Nov. 27, 2007
7282393 Microelectromechanical device packages with integral heaters Oct. 16, 2007
7022553 Compact system module with built-in thermoelectric cooling Apr. 4, 2006
6976528 Spray cooling system for extreme environments Dec. 20, 2005
6969907 Cooling structure for multichip module Nov. 29, 2005
6958523 On chip heating for electrical trimming of polysilicon and polysilicon-silicon-germanium resistors and electrically programmable fuses for integrated circuits Oct. 25, 2005
6953987 Composite integrated circuit device having restricted heat conduction Oct. 11, 2005
6953706 Method of providing a semiconductor package having an internal heat-activated hydrogen source Oct. 11, 2005
6936527 Low voltage non-volatile memory cell Aug. 30, 2005
6911624 Component installation, removal, and replacement apparatus and method Jun. 28, 2005
6888232 Semiconductor package having a heat-activated source of releasable hydrogen May. 3, 2005
6882571 Low voltage non-volatile memory cell Apr. 19, 2005
6879488 Radio frequency module Apr. 12, 2005
6853071 Electronic device having dewing prevention structure and dewing prevention structure of electronic device Feb. 8, 2005
6847010 Methods and circuits for measuring the thermal resistance of a packaged IC Jan. 25, 2005
6815643 Semiconductor device with temperature regulation Nov. 9, 2004
6815965 Integrated circuit internal heating system and method therefor Nov. 9, 2004
6677557 Ceramic heater Jan. 13, 2004
6671205 Low voltage non-volatile memory cell Dec. 30, 2003
6618539 Heater module and optical waveguide module Sep. 9, 2003
6590280 Disk-like gettering unit, integrated circuit, encapsulated semiconductor device, and method for manufacturing the same Jul. 8, 2003
6586835 Compact system module with built-in thermoelectric cooling Jul. 1, 2003
6496416 Low voltage non-volatile memory cell Dec. 17, 2002
6492620 Equipotential fault tolerant integrated circuit heater Dec. 10, 2002
6452798 Electronic module including a cooling substrate having a fluid cooling circuit therein and related methods Sep. 17, 2002
6448575 Temperature control structure Sep. 10, 2002
6448662 Arrangement for accessing region of a flip chip die Sep. 10, 2002
6423939 Micro soldering method and apparatus Jul. 23, 2002
6423938 Method for the electrical and/or mechanical interconnection of components of a microelectronic system Jul. 23, 2002
6403934 Thermstrate reflow process Jun. 11, 2002
6329690 Method and apparatus to match semiconductor device performance Dec. 11, 2001
6253556 Electrical system with cooling or heating Jul. 3, 2001
6246581 Heated PCB interconnect for cooled IC chip modules Jun. 12, 2001
6184494 Printed circuit board having a heating element and heating method thereof Feb. 6, 2001

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