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Class Information
Number: 257/E23.08
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for cooling, heating, ventilating or temperature compensation; temperature-sensing arrangements (epo)
Description: This subclass is indented under subclass E23.001. This subclass is substantially the same in scope as ECLA classification H01L23/34.

Sub-classes under this class:

Class Number Class Name Patents
257/E23.081 Arrangements for heating (epo) 81
257/E23.095 Complete device being wholly immersed in fluid other than air (epo) 32
257/E23.082 Cooling arrangements using peltier effect (epo) 156
257/E23.087 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling (epo) 218
257/E23.097 Involving transfer of heat by flowing fluids (epo) 43
257/E23.083 Mountings or securing means for detachable cooling or heating arrangements; fixed by friction, plugs or springs (epo) 106
257/E23.101 Selection of materials, or shaping, to facilitate cooling or heating, e.g., heat sinks (epo) 782

Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8704363 Interface plate between integrated circuits Apr. 22, 2014
8704362 Resin-diamagnetic material composite structure Apr. 22, 2014
8692349 Semiconductor devices and methods of controlling temperature thereof Apr. 8, 2014
8692365 Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof Apr. 8, 2014
8686558 Thermally and electrically enhanced ball grid array package Apr. 1, 2014
8674510 Three-dimensional integrated circuit structure having improved power and thermal management Mar. 18, 2014
8674497 Stacked half-bridge package with a current carrying layer Mar. 18, 2014
8664759 Integrated circuit with heat conducting structures for localized thermal control Mar. 4, 2014
8659903 Heat switch array for thermal hot spot cooling Feb. 25, 2014
8653651 Semiconductor apparatus and method for manufacturing the same Feb. 18, 2014
8648395 Integrated CMOS porous sensor Feb. 11, 2014
8648460 Thermal interface material with epoxidized nutshell oil Feb. 11, 2014
8637979 Semiconductor device Jan. 28, 2014
8633575 IC package with integrated electrostatic discharge protection Jan. 21, 2014
8623705 Nanotube based vapor chamber for die level cooling Jan. 7, 2014
8604603 Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers Dec. 10, 2013
8598701 Semiconductor device Dec. 3, 2013
8592971 Direct semiconductor contact ebullient cooling package Nov. 26, 2013
8587116 Semiconductor module comprising an insert Nov. 19, 2013
8586418 Method for the production of an electronic component and electronic component produced according to this method Nov. 19, 2013
8581385 Semiconductor chip to dissipate heat, semiconductor package including the same, and stack package using the same Nov. 12, 2013
8575664 Chemically-sensitive sensor array calibration circuitry Nov. 5, 2013
8564120 Heat dissipation in temperature critical device areas of semiconductor devices by heat pipes connecting to the substrate backside Oct. 22, 2013
8564124 Semiconductor package Oct. 22, 2013
8557639 Apparatus for thermally enhanced semiconductor package Oct. 15, 2013
8546937 Semiconductor device Oct. 1, 2013
8531026 Diamond particle mololayer heat spreaders and associated methods Sep. 10, 2013
8530941 Methods and apparatus for measuring analytes using large scale FET arrays Sep. 10, 2013
8525309 Flip-chip QFN structure using etched lead frame Sep. 3, 2013
8519448 Chemically-sensitive array with active and reference sensors Aug. 27, 2013
8519532 Semiconductor device including cladded base plate Aug. 27, 2013
8507954 Integrated CMOS porous sensor having sensor electrodes formed with the interconnect conductors of a MOS circuit Aug. 13, 2013
8507955 Sensor device having MOS circuits, a gas or humidity sensor and a temperature sensor Aug. 13, 2013
8508040 In-situ foam materials as integrated heat spreader (IHS) sealant Aug. 13, 2013
8502278 Chemically-sensitive sample and hold sensors Aug. 6, 2013
8502307 Vertical power semiconductor carrier having laterally isolated circuit areas Aug. 6, 2013
8497572 Semiconductor module and method of manufacturing the same Jul. 30, 2013
8497531 Integrated MOS gas or humidity sensor having a wireless transceiver Jul. 30, 2013
8492799 Methods and apparatus for detecting molecular interactions using FET arrays Jul. 23, 2013
8492800 Chemically sensitive sensors with sample and hold capacitors Jul. 23, 2013
8482120 Combined heat sink multi-configuration processor memory substrate device Jul. 9, 2013
8466563 Apparatus and methods for 3-D stacking of thinned die Jun. 18, 2013
8445945 Low noise chemically-sensitive field effect transistors May. 21, 2013
8441044 Methods for manufacturing low noise chemically-sensitive field effect transistors May. 14, 2013
8441092 Thermoelectric cooler system, method and device May. 14, 2013
8441121 Package carrier and manufacturing method thereof May. 14, 2013
8441115 Semiconductor device with exposed thermal conductivity part May. 14, 2013
8426962 Semiconductor device Apr. 23, 2013
8426898 Methods and apparatus for measuring analytes using large scale FET arrays Apr. 23, 2013
8426899 Methods and apparatus for measuring analytes using large scale FET arrays Apr. 23, 2013

1 2 3 4 5 6 7 8

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