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Class Information
Number: 257/E23.079
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > For integrated circuit devices, e.g., power bus, number of leads (epo)
Description: This subclass is indented under subclass E23.01. This subclass is substantially the same in scope as ECLA classification H01L23/50.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8704364 Reducing stress in multi-die integrated circuit structures Apr. 22, 2014
8692369 Semiconductor chip and solar system Apr. 8, 2014
8680690 Bond wire arrangement for efficient signal transmission Mar. 25, 2014
8674501 Semiconductor integrated circuit device Mar. 18, 2014
8659144 Power and ground planes in package substrate Feb. 25, 2014
8648477 Semiconductor chip, film substrate, and related semiconductor chip package Feb. 11, 2014
8643173 Cooling apparatuses and power electronics modules with single-phase and two-phase surface enhancement features Feb. 4, 2014
8637972 Two-sided substrate lead connection for minimizing kerf width on a semiconductor substrate panel Jan. 28, 2014
8633596 Semiconductor package with bonding wires of reduced loop inductance Jan. 21, 2014
8624379 Semiconductor device Jan. 7, 2014
8624332 Vertical conduction power electronic device and corresponding realization method Jan. 7, 2014
8592300 Interface structure for copper-copper peeling integrity Nov. 26, 2013
8575743 Printed board and semiconductor integrated circuit Nov. 5, 2013
8571229 Semiconductor device Oct. 29, 2013
8569884 Multiple die in a face down package Oct. 29, 2013
8546926 Power converter Oct. 1, 2013
8541262 Die edge contacts for semiconductor devices Sep. 24, 2013
8541819 Semiconductor device and structure Sep. 24, 2013
8519513 Semiconductor wafer plating bus Aug. 27, 2013
8497572 Semiconductor module and method of manufacturing the same Jul. 30, 2013
8487322 Luminous body with LED dies and production thereof Jul. 16, 2013
8470680 Substrate with embedded patterned capacitance Jun. 25, 2013
8471271 Light emitting diode package and method of manufacturing the same Jun. 25, 2013
8461675 Substrate panel with plating bar structured to allow minimum kerf width Jun. 11, 2013
8461697 Semiconductor integrated circuit device Jun. 11, 2013
8450731 Organic electronic circuit May. 28, 2013
8450843 Semiconductor device and method for designing the same May. 28, 2013
8435835 Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die May. 7, 2013
8432031 Semiconductor die including a current routing line having non-metallic slots Apr. 30, 2013
8426983 Semiconductor device Apr. 23, 2013
8427844 Widebody coil isolators Apr. 23, 2013
8421197 Integrated circuit package system with warp-free chip Apr. 16, 2013
8421203 Integrated circuit packaging system with foldable substrate and method of manufacture thereof Apr. 16, 2013
8415800 Top layers of metal for high performance IC's Apr. 9, 2013
8415793 Wafer and substructure for use in manufacturing electronic component packages Apr. 9, 2013
8415730 Selective coupling of voltage feeds for body bias voltage in an integrated circuit device Apr. 9, 2013
8410536 Substrate with embedded patterned capacitance Apr. 2, 2013
8362614 Fine pitch grid array type semiconductor device Jan. 29, 2013
8350376 Bondwireless power module with three-dimensional current routing Jan. 8, 2013
8350379 Package with power and ground through via Jan. 8, 2013
8344506 Interface structure for copper-copper peeling integrity Jan. 1, 2013
8309957 Replacement of scribeline padframe with saw-friendly design Nov. 13, 2012
8310061 Stacked die parallel plate capacitor Nov. 13, 2012
8304885 Semiconductor device and electronic apparatus equipped with the semiconductor device Nov. 6, 2012
8299620 Semiconductor device with welded leads and method of manufacturing the same Oct. 30, 2012
8294220 Method for forming silicide contacts Oct. 23, 2012
8269334 Multichip package leadframe including electrical bussing Sep. 18, 2012
8258606 High frequency flip chip package structure of polymer substrate Sep. 4, 2012
8253235 Semiconductor packaging substrate improving capability of electrostatic dissipation Aug. 28, 2012
8241963 Recessed pillar structure Aug. 14, 2012

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