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Class Information
Number: 257/E23.079
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > For integrated circuit devices, e.g., power bus, number of leads (epo)
Description: This subclass is indented under subclass E23.01. This subclass is substantially the same in scope as ECLA classification H01L23/50.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622804 |
Semiconductor device and method of manufacturing the same |
Nov. 24, 2009 |
| 7615845 |
Active shielding of conductors in MEMS devices |
Nov. 10, 2009 |
| 7602058 |
Flip-chip semiconductor device with improved power pad arrangement |
Oct. 13, 2009 |
| 7595559 |
Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip |
Sep. 29, 2009 |
| 7586186 |
Ball grid array |
Sep. 8, 2009 |
| 7582959 |
Driver module structure with flexible circuit board |
Sep. 1, 2009 |
| 7573126 |
Matching circuits on optoelectronic devices |
Aug. 11, 2009 |
| 7566960 |
Interposing structure |
Jul. 28, 2009 |
| 7560809 |
Semiconductor device |
Jul. 14, 2009 |
| 7560808 |
Chip scale power LDMOS device |
Jul. 14, 2009 |
| 7554186 |
Semiconductor device |
Jun. 30, 2009 |
| 7550833 |
Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof |
Jun. 23, 2009 |
| 7545033 |
Low cost power semiconductor module without substrate |
Jun. 9, 2009 |
| 7535076 |
Power semiconductor device |
May. 19, 2009 |
| 7528467 |
IC substrate with over voltage protection function |
May. 5, 2009 |
| 7514778 |
Power semiconductor device |
Apr. 7, 2009 |
| 7514796 |
Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips |
Apr. 7, 2009 |
| 7508061 |
Three-dimensional semiconductor module having multi-sided ground block |
Mar. 24, 2009 |
| 7504671 |
Semiconductor device |
Mar. 17, 2009 |
| 7495316 |
Methods of forming conductive vias and methods of forming multichip modules including such conductive vias |
Feb. 24, 2009 |
| 7485974 |
Chip structure with bevel pad row |
Feb. 3, 2009 |
| 7477520 |
Memory module |
Jan. 13, 2009 |
| 7468551 |
Multiple chips bonded to packaging structure with low noise and multiple selectable functions |
Dec. 23, 2008 |
| 7466013 |
Semiconductor die structure featuring a triple pad organization |
Dec. 16, 2008 |
| 7449778 |
Power semiconductor module as H-bridge circuit and method for producing the same |
Nov. 11, 2008 |
| 7449788 |
Chip structure with arrangement of side pads |
Nov. 11, 2008 |
| 7446389 |
Semiconductor die package with internal bypass capacitors |
Nov. 4, 2008 |
| 7429797 |
Electronic device and carrier substrate |
Sep. 30, 2008 |
| 7425760 |
Multi-chip module structure with power delivery using flexible cables |
Sep. 16, 2008 |
| 7411295 |
Circuit board, device mounting structure, device mounting method, and electronic apparatus |
Aug. 12, 2008 |
| 7405486 |
Circuit device |
Jul. 29, 2008 |
| 7391110 |
Apparatus for providing capacitive decoupling between on-die power and ground conductors |
Jun. 24, 2008 |
| 7391122 |
Techniques for flip chip package migration |
Jun. 24, 2008 |
| 7385281 |
Semiconductor integrated circuit device |
Jun. 10, 2008 |
| 7372139 |
Semiconductor chip package |
May. 13, 2008 |
| 7361984 |
Chip package structure |
Apr. 22, 2008 |
| 7358548 |
Semiconductor integrated circuit having layout in which buffers or protection circuits are arranged in concentrated manner |
Apr. 15, 2008 |
| 7353595 |
Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon |
Apr. 8, 2008 |
| 7355267 |
Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements |
Apr. 8, 2008 |
| 7355280 |
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
Apr. 8, 2008 |
| 7339260 |
Wiring board providing impedance matching |
Mar. 4, 2008 |
| 7335985 |
Method and system for electrically coupling a chip to chip package |
Feb. 26, 2008 |
| 7332763 |
Selective coupling of voltage feeds for body bias voltage in an integrated circuit device |
Feb. 19, 2008 |
| 7327024 |
Power module, and phase leg assembly |
Feb. 5, 2008 |
| 7319264 |
Semiconductor device |
Jan. 15, 2008 |
| 7304372 |
Semiconductor package |
Dec. 4, 2007 |
| 7294904 |
Integrated circuit package with improved return loss |
Nov. 13, 2007 |
| 7282795 |
Modifying a semiconductor device to provide electrical parameter monitoring |
Oct. 16, 2007 |
| 7282784 |
Methods of manufacture of a via structure comprising a plurality of conductive elements and methods of forming multichip modules including such via structures |
Oct. 16, 2007 |
| 7253516 |
Electronic device and carrier substrate for same |
Aug. 7, 2007 |
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