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Class Information
Number: 257/E23.078
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Flexible arrangements, e.g., pressure contacts without soldering (epo)
Description: This subclass is indented under subclass E23.01. This subclass is substantially the same in scope as ECLA classification H01L23/48F.

Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
8569850 Ultra low pressure sensor Oct. 29, 2013
8564117 Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing Oct. 22, 2013
8531042 Technique for fabricating microsprings on non-planar surfaces Sep. 10, 2013
8519534 Microsprings partially embedded in a laminate structure and methods for producing same Aug. 27, 2013
8466551 Semiconductor device Jun. 18, 2013
8441128 Semiconductor arrangement May. 14, 2013
8441117 Semiconductor device May. 14, 2013
8405198 Stress-engineered interconnect packages with activator-assisted molds Mar. 26, 2013
8368207 Pressure-contact power semiconductor module and method for producing the same Feb. 5, 2013
8350345 Three-dimensional input control device Jan. 8, 2013
8324725 Stacked die module Dec. 4, 2012
8319335 Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly Nov. 27, 2012
8269343 Semiconductor device including a pressure-contact section Sep. 18, 2012
8238107 Cap for MEMS package Aug. 7, 2012
8207604 Microelectronic package comprising offset conductive posts on compliant layer Jun. 26, 2012
8193645 Wafer-level, polymer-based encapsulation for microstructure devices Jun. 5, 2012
8154119 Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing Apr. 10, 2012
8124449 Device including a semiconductor chip and metal foils Feb. 28, 2012
8106507 Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket Jan. 31, 2012
8102020 Equalization in proximity communication Jan. 24, 2012
8076769 Semiconductor device and manufacturing method of semiconductor device Dec. 13, 2011
8072084 Integrated circuit, circuit system, and method of manufacturing Dec. 6, 2011
8030766 Semiconductor device Oct. 4, 2011
7998797 Semiconductor device Aug. 16, 2011
7986046 Semiconductor module and method of producing the same Jul. 26, 2011
7960211 Semiconductor system-in-package and method for making the same Jun. 14, 2011
7952179 Semiconductor package having through holes for molding back side of package May. 31, 2011
7888784 Substrate package with through holes for high speed I/O flex cable Feb. 15, 2011
7888786 Electronic module comprising memory and integrated circuit processor chips formed on a microchannel cooling device Feb. 15, 2011
7880283 High reliability power module Feb. 1, 2011
7871530 Near-field optical probe based on SOI substrate and fabrication method thereof Jan. 18, 2011
7847389 Semiconductor package, electronic part and electronic device Dec. 7, 2010
7816778 Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same Oct. 19, 2010
7791208 Power semiconductor arrangement Sep. 7, 2010
7752738 Methods for fabricating thin complaint spring contacts Jul. 13, 2010
7705442 Contact device for use in a power semiconductor module or in a disc-type thyristor Apr. 27, 2010
7692280 Portable object connectable package Apr. 6, 2010
7675184 Semiconductor device Mar. 9, 2010
7659619 Structures for Z-aligned proximity communication Feb. 9, 2010
7645639 Packaging of integrated circuits to lead frames Jan. 12, 2010
7602071 Apparatus for dividing an adhesive film mounted on a wafer Oct. 13, 2009
7566973 Semiconductor device and method of manufacturing the same Jul. 28, 2009
7554186 Semiconductor device Jun. 30, 2009
7550311 Near-field optical probe based on SOI substrate and fabrication method thereof Jun. 23, 2009
7550855 Vertically spaced plural microsprings Jun. 23, 2009
7525187 Apparatus and method for connecting components Apr. 28, 2009
7514773 Systems and arrangements for interconnecting integrated circuit dies Apr. 7, 2009
7511375 Semiconductor device carrier unit and semiconductor socket provided therewith Mar. 31, 2009
7489041 Copper interconnect Feb. 10, 2009
7459795 Method to build a wirebond probe card in a many at a time fashion Dec. 2, 2008

1 2 3 4 5 6 7 8 9 10

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