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Class Information
Number: 257/E23.078
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Flexible arrangements, e.g., pressure contacts without soldering (epo)
Description: This subclass is indented under subclass E23.01. This subclass is substantially the same in scope as ECLA classification H01L23/48F.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7427809 |
Repairable three-dimensional semiconductor subsystem |
Sep. 23, 2008 |
| 7425760 |
Multi-chip module structure with power delivery using flexible cables |
Sep. 16, 2008 |
| 7414313 |
Polymeric conductor donor and transfer method |
Aug. 19, 2008 |
| 7378294 |
Wafer-level sealed microdevice having trench isolation and methods for making the same |
May. 27, 2008 |
| 7378734 |
Stacked contact bump |
May. 27, 2008 |
| 7378742 |
Compliant interconnects for semiconductors and micromachines |
May. 27, 2008 |
| 7335979 |
Device and method for tilted land grid array interconnects on a coreless substrate package |
Feb. 26, 2008 |
| 7335988 |
Use of palladium in IC manufacturing with conductive polymer bump |
Feb. 26, 2008 |
| 7325302 |
Method of forming an interconnection element |
Feb. 5, 2008 |
| 7312522 |
Mounting member of semiconductor device, mounting configuration of semiconductor device, and drive unit of semiconductor device |
Dec. 25, 2007 |
| 7288842 |
Power semiconductor module with auxiliary connection |
Oct. 30, 2007 |
| 7279788 |
Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
Oct. 9, 2007 |
| 7253514 |
Self-supporting connecting element for a semiconductor chip |
Aug. 7, 2007 |
| 7230328 |
Semiconductor package and laminated semiconductor package |
Jun. 12, 2007 |
| 7205673 |
Reduce or eliminate IMC cracking in post wire bonded dies by doping aluminum used in bond pads during Cu/Low-k BEOL processing |
Apr. 17, 2007 |
| 7192806 |
Method of establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
Mar. 20, 2007 |
| 7154171 |
Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor |
Dec. 26, 2006 |
| 7151313 |
Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment |
Dec. 19, 2006 |
| 7148082 |
Method of making a semiconductor chip assembly with a press-fit ground plane |
Dec. 12, 2006 |
| 7138299 |
Method of electrically connecting a microelectronic component |
Nov. 21, 2006 |
| 7119362 |
Method of manufacturing semiconductor apparatus |
Oct. 10, 2006 |
| 7070419 |
Land grid array connector including heterogeneous contact elements |
Jul. 4, 2006 |
| 7067742 |
Connection component with peelable leads |
Jun. 27, 2006 |
| 7064566 |
Probe card assembly and kit |
Jun. 20, 2006 |
| 7063541 |
Composite microelectronic spring structure and method for making same |
Jun. 20, 2006 |
| 7061257 |
Probe card assembly |
Jun. 13, 2006 |
| 7059047 |
Sockets for "springed" semiconductor devices |
Jun. 13, 2006 |
| 7049693 |
Electrical contact array for substrate assemblies |
May. 23, 2006 |
| 7048548 |
Interconnect for microelectronic structures with enhanced spring characteristics |
May. 23, 2006 |
| 7042080 |
Semiconductor interconnect having compliant conductive contacts |
May. 9, 2006 |
| 7040902 |
Electrical contact |
May. 9, 2006 |
| 7037804 |
Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration |
May. 2, 2006 |
| 7030491 |
Power semiconductor module with deflection-resistant base plate |
Apr. 18, 2006 |
| 7029289 |
Interconnection device and system |
Apr. 18, 2006 |
| 7029288 |
Electrical contact and connector and method of manufacture |
Apr. 18, 2006 |
| 7014479 |
Electrical contact and connector and method of manufacture |
Mar. 21, 2006 |
| 7009116 |
Contact device and a process to facilitate contact of power electronics components and an assembly that consists of one or several power electronics components |
Mar. 7, 2006 |
| 7005751 |
Layered microelectronic contact and method for fabricating same |
Feb. 28, 2006 |
| 6998703 |
Thin package for stacking integrated circuits |
Feb. 14, 2006 |
| 6995464 |
Pressure-contact type semiconductor device |
Feb. 7, 2006 |
| 6991969 |
Methods and apparatus for addition of electrical conductors to previously fabricated device |
Jan. 31, 2006 |
| 6979204 |
Pressure piece for use in a power semiconductor module |
Dec. 27, 2005 |
| 6975030 |
Silicon carbide contact for semiconductor components |
Dec. 13, 2005 |
| 6975016 |
Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof |
Dec. 13, 2005 |
| 6972496 |
Chip-scaled package having a sealed connection wire |
Dec. 6, 2005 |
| 6967357 |
Voltage-driven power semiconductor device |
Nov. 22, 2005 |
| 6965164 |
Electronic device and method of manufacturing the same |
Nov. 15, 2005 |
| 6957963 |
Compliant interconnect assembly |
Oct. 25, 2005 |
| 6958534 |
Power semiconductor module |
Oct. 25, 2005 |
| 6956174 |
Tip structures |
Oct. 18, 2005 |
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