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Class Information
Number: 257/E23.077
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Characterized by materials (epo) > Materials of insulating layers or coatings (epo)
Description: This subclass is indented under subclass E23.072. This subclass is substantially the same in scope as ECLA classification H01L23/498M8.

Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
8344393 Light receiving and emitting device Jan. 1, 2013
8242004 Semiconductor device and method of fabricating the same Aug. 14, 2012
8053887 Semiconductor assembly Nov. 8, 2011
8040148 System in package with built-in test-facilitating circuit Oct. 18, 2011
8034638 Treatment of low K films with a silylating agent for damage repair Oct. 11, 2011
7999387 Semiconductor element connected to printed circuit board Aug. 16, 2011
7888741 Structures with improved interfacial strength of SiCOH dielectrics and method for preparing the same Feb. 15, 2011
7834467 Layer between interfaces of different components in semiconductor devices Nov. 16, 2010
7825507 Semiconductor assembly and method for forming seal ring Nov. 2, 2010
7800241 Semiconductor device with semiconductor device components embedded in a plastics composition Sep. 21, 2010
7732935 Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board Jun. 8, 2010
7709960 Dual liner capping layer interconnect structure May. 4, 2010
7696617 Package for semiconductor devices Apr. 13, 2010
7671382 Semiconductor device with thermoplastic resin to reduce warpage Mar. 2, 2010
7671453 Semiconductor device and method for producing the same Mar. 2, 2010
7641811 Enhanced thermal conducting formulations Jan. 5, 2010
7633142 Flexible core for enhancement of package interconnect reliability Dec. 15, 2009
7571536 Method of making capacitive/resistive devices Aug. 11, 2009
7566584 Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method Jul. 28, 2009
7550365 Bonding structure and method of making Jun. 23, 2009
7547645 Method for coating a structure comprising semiconductor chips Jun. 16, 2009
7541200 Treatment of low k films with a silylating agent for damage repair Jun. 2, 2009
7462294 Enhanced thermal conducting formulations Dec. 9, 2008
7442653 Inter-metal dielectric of semiconductor device and manufacturing method thereof including plasma treating a plasma enhanced fluorosilicate glass Oct. 28, 2008
7416938 Inkjet patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same Aug. 26, 2008
7384880 Method for making a semiconductor device having a high-k gate dielectric Jun. 10, 2008
7352060 Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate Apr. 1, 2008
7352061 Flexible core for enhancement of package interconnect reliability Apr. 1, 2008
7352065 Semiconductor devices having amorphous silicon-carbon dielectric and conducting layers Apr. 1, 2008
7323423 Forming high-k dielectric layers on smooth substrates Jan. 29, 2008
7323424 Semiconductor constructions comprising cerium oxide and titanium oxide Jan. 29, 2008
7287320 Method for programming a routing layout design through one via layer Oct. 30, 2007
7268035 Methods of forming semiconductor constructions comprising cerium oxide and titanium oxide Sep. 11, 2007
7256139 Methods and apparatus for e-beam treatment used to fabricate integrated circuit devices Aug. 14, 2007
7240429 Manufacturing method for a printed circuit board Jul. 10, 2007
7230332 Chip package with embedded component Jun. 12, 2007
7227240 Semiconductor device with wire bond inductor and method Jun. 5, 2007
7164191 Low relative permittivity SiO.sub.x film including a porous material for use with a semiconductor device Jan. 16, 2007
7063762 Circuitized substrate and method of making same Jun. 20, 2006
7048993 Process for the constrained sintering of asymmetrically configured dielectric layers May. 23, 2006
7018494 Method of producing a composite sheet and method of producing a laminate by using the composite sheet Mar. 28, 2006
6998308 Substrate for carrying a semiconductor chip and a manufacturing method thereof Feb. 14, 2006
6995037 Structure and method of high performance two layer ball grid array substrate Feb. 7, 2006
6969674 Structure and method for fine pitch flip chip substrate Nov. 29, 2005
6960494 Semiconductor package and method of manufacturing the same Nov. 1, 2005
6960822 Solder mask and structure of a substrate Nov. 1, 2005
6956100 Polyamide resin-containing varnish and its use Oct. 18, 2005
6953712 Circuit device manufacturing method Oct. 11, 2005
6946415 Composition for insulating ceramics and insulating ceramics using the same Sep. 20, 2005
6933050 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board Aug. 23, 2005

1 2 3 4 5 6 7 8 9

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