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Class Information
Number: 257/E23.076
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Characterized by materials (epo) > Conductive materials containing superconducting material (epo)
Description: This subclass is indented under subclass E23.072. This subclass is substantially the same in scope as ECLA classification H01L23/498M6.










Patents under this class:

Patent Number Title Of Patent Date Issued
7705410 Circuitry and method Apr. 27, 2010
6638894 Devices and systems based on novel superconducting material Oct. 28, 2003
6635603 Devices and systems based on novel superconducting material Oct. 21, 2003
6630425 Devices and systems based on novel superconducting material Oct. 7, 2003
6096565 Multi-layer glass ceramic module with superconductor wiring Aug. 1, 2000
6002951 Multi-layer ceramic substrate having high TC superconductor circuitry Dec. 14, 1999
5849396 Multilayer electronic structure and its preparation Dec. 15, 1998
5834405 Superconducting multilayer ceramic substrate Nov. 10, 1998
5811375 Superconducting multilayer interconnection formed of oxide superconductor material and method for manufacturing the same Sep. 22, 1998
5780314 Method of forming a high performance low thermal loss bi-temperature superconductive device Jul. 14, 1998
5773875 High performance, low thermal loss, bi-temperature superconductive device Jun. 30, 1998
5760463 Superconducting layer in contact with group III-V semiconductor layer for wiring structure Jun. 2, 1998
5747873 Technique for fabricating hybrid high-temperature superconductor-semiconductor circuits May. 5, 1998
5672569 Process for fabricating a superconducting circuit Sep. 30, 1997
5648320 Method of manufacturing ceramic superconductor circuit board Jul. 15, 1997
5567330 Electrical interconnect structures and processes Oct. 22, 1996
5476719 Superconducting multi-layer microstrip structure for multi-chip modules and microwave circuits Dec. 19, 1995
5474834 Superconducting circuit sub-assembly having an oxygen shielding barrier layer Dec. 12, 1995
5430012 Superconducting multilayer interconnection formed of a-axis and c-axis oriented oxide superconductor materials Jul. 4, 1995
5420101 Structures super conductor tracks and process for making them May. 30, 1995
5286713 Method for manufacturing an oxide superconducting circuit board by printing Feb. 15, 1994
5274268 Electric circuit having superconducting layered structure Dec. 28, 1993
5212626 Electronic packaging and cooling system using superconductors for power distribution May. 18, 1993
5124311 Structure of ceramic superconductive wiring and process of fabrication thereof Jun. 23, 1992
5081070 Superconducting circuit board and paste adopted therefor Jan. 14, 1992
5075200 Process of forming superconductive wiring strip Dec. 24, 1991
5057877 Superconductor interconnection apparatus Oct. 15, 1991
5019554 Structure of superconductive wiring having SiAlON buffer layer thereunder May. 28, 1991
4960751 Electric circuit having superconducting multilayered structure and manufacturing method for same Oct. 2, 1990
4958200 Overcurrent protection circuit for semiconductor device Sep. 18, 1990
4954480 Multi-layer superconducting circuit substrate and process for manufacturing same Sep. 4, 1990
4837609 Semiconductor devices having superconducting interconnects Jun. 6, 1989











 
 
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