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Class Information
Number: 257/E23.075
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Characterized by materials (epo) > Conductive materials containing organic materials or pastes, e.g., for thick films (epo)
Description: This subclass is indented under subclass E23.072. This subclass is substantially the same in scope as ECLA classification H01L23/498M4.

Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8456017 Filled through-silicon via with conductive composite material Jun. 4, 2013
8343386 Electrostatic dissipative adhesive Jan. 1, 2013
8288792 Semiconductor chip assembly with post/base/post heat spreader Oct. 16, 2012
8241957 Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging Aug. 14, 2012
RE43444 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes Jun. 5, 2012
8178893 Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate May. 15, 2012
8067827 Stacked microelectronic device assemblies Nov. 29, 2011
7893532 External contact material for external contacts of a semiconductor device and method of making the same Feb. 22, 2011
7847397 Nanoparticles with covalently bonded stabilizer Dec. 7, 2010
RE41721 Semiconductor device having an improved connected arrangement between a semiconductor pellet and base substrate electrodes Sep. 21, 2010
RE41559 Semiconductor device package with improved cooling Aug. 24, 2010
7641811 Enhanced thermal conducting formulations Jan. 5, 2010
7622803 Heat sink assembly and related methods for semiconductor vacuum processing systems Nov. 24, 2009
7571536 Method of making capacitive/resistive devices Aug. 11, 2009
7560371 Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum Jul. 14, 2009
7462294 Enhanced thermal conducting formulations Dec. 9, 2008
7443027 Electronic device having coalesced metal nanoparticles Oct. 28, 2008
7429778 Methods for forming wiring and electrode Sep. 30, 2008
7345331 Ferroelectric capacitor circuit for sensing hydrogen gas Mar. 18, 2008
7276787 Silicon chip carrier with conductive through-vias and method for fabricating same Oct. 2, 2007
7262498 Assembly with a ring and bonding pads formed of a same material on a substrate Aug. 28, 2007
7253523 Reworkable thermal interface material Aug. 7, 2007
7235871 Stacked microelectronic dies Jun. 26, 2007
7227240 Semiconductor device with wire bond inductor and method Jun. 5, 2007
7202154 Suspension for filling via holes in silicon and method for making the same Apr. 10, 2007
7148562 Power semiconductor device and power semiconductor module Dec. 12, 2006
7091603 Semiconductor device Aug. 15, 2006
7066976 Method for the production of electrocatalyst powders Jun. 27, 2006
7067070 Electroluminescent phosphor powders, methods for making phosphor powders, and devices incorporating same Jun. 27, 2006
7056414 Connecting method for metal material and electric conductive plastic material and product thereby Jun. 6, 2006
7037451 Chemical-mechanical planarization slurries and powders and methods for using same May. 2, 2006
7022261 Sulfur-containing phosphor powders, methods for making phosphor powders and devices incorporating same Apr. 4, 2006
7005085 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same Feb. 28, 2006
7004994 Method for making a film from silver-containing particles Feb. 28, 2006
6994802 Cathodoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same Feb. 7, 2006
6991754 Method for making composite particles including a polymer phase Jan. 31, 2006
6953600 Conductive film forming composition, conductive film, and method for forming the same Oct. 11, 2005
6939431 Paste for circuit connection, anisotropic conductive paste and uses thereof Sep. 6, 2005
6911412 Composite particles for electrocatalytic applications Jun. 28, 2005
6881377 Methods for manufacturing capacitors and electrodes using ultrafine nickel powder Apr. 19, 2005
6875372 Cathodoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same Apr. 5, 2005
6855399 Copper paste and wiring board using the same Feb. 15, 2005
6830823 Gold powders, methods for producing powders and devices fabricated from same Dec. 14, 2004
6826031 Ceramic electronic component and production method therefor Nov. 30, 2004
6815073 Electronic component and method of manufacturing the same Nov. 9, 2004
6814893 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure Nov. 9, 2004
6812570 Organic packages having low tin solder connections Nov. 2, 2004
6806028 Photosensitive conductive paste, method for forming conductive pattern using the same, and method for manufacturing ceramic multilayer element Oct. 19, 2004
6780350 Metal-carbon composite powders, methods for producing powders and devices fabricated from same Aug. 24, 2004
6780898 Adhesive composition Aug. 24, 2004

1 2 3 4 5 6 7

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