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Class Information
Number: 257/E23.075
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Characterized by materials (epo) > Conductive materials containing organic materials or pastes, e.g., for thick films (epo)
Description: This subclass is indented under subclass E23.072. This subclass is substantially the same in scope as ECLA classification H01L23/498M4.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622803 |
Heat sink assembly and related methods for semiconductor vacuum processing systems |
Nov. 24, 2009 |
| 7571536 |
Method of making capacitive/resistive devices |
Aug. 11, 2009 |
| 7560371 |
Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum |
Jul. 14, 2009 |
| 7462294 |
Enhanced thermal conducting formulations |
Dec. 9, 2008 |
| 7443027 |
Electronic device having coalesced metal nanoparticles |
Oct. 28, 2008 |
| 7429778 |
Methods for forming wiring and electrode |
Sep. 30, 2008 |
| 7345331 |
Ferroelectric capacitor circuit for sensing hydrogen gas |
Mar. 18, 2008 |
| 7276787 |
Silicon chip carrier with conductive through-vias and method for fabricating same |
Oct. 2, 2007 |
| 7262498 |
Assembly with a ring and bonding pads formed of a same material on a substrate |
Aug. 28, 2007 |
| 7253523 |
Reworkable thermal interface material |
Aug. 7, 2007 |
| 7235871 |
Stacked microelectronic dies |
Jun. 26, 2007 |
| 7227240 |
Semiconductor device with wire bond inductor and method |
Jun. 5, 2007 |
| 7202154 |
Suspension for filling via holes in silicon and method for making the same |
Apr. 10, 2007 |
| 7148562 |
Power semiconductor device and power semiconductor module |
Dec. 12, 2006 |
| 7091603 |
Semiconductor device |
Aug. 15, 2006 |
| 7066976 |
Method for the production of electrocatalyst powders |
Jun. 27, 2006 |
| 7067070 |
Electroluminescent phosphor powders, methods for making phosphor powders, and devices incorporating same |
Jun. 27, 2006 |
| 7056414 |
Connecting method for metal material and electric conductive plastic material and product thereby |
Jun. 6, 2006 |
| 7037451 |
Chemical-mechanical planarization slurries and powders and methods for using same |
May. 2, 2006 |
| 7022261 |
Sulfur-containing phosphor powders, methods for making phosphor powders and devices incorporating same |
Apr. 4, 2006 |
| 7005085 |
Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same |
Feb. 28, 2006 |
| 7004994 |
Method for making a film from silver-containing particles |
Feb. 28, 2006 |
| 6994802 |
Cathodoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same |
Feb. 7, 2006 |
| 6991754 |
Method for making composite particles including a polymer phase |
Jan. 31, 2006 |
| 6953600 |
Conductive film forming composition, conductive film, and method for forming the same |
Oct. 11, 2005 |
| 6939431 |
Paste for circuit connection, anisotropic conductive paste and uses thereof |
Sep. 6, 2005 |
| 6911412 |
Composite particles for electrocatalytic applications |
Jun. 28, 2005 |
| 6881377 |
Methods for manufacturing capacitors and electrodes using ultrafine nickel powder |
Apr. 19, 2005 |
| 6875372 |
Cathodoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same |
Apr. 5, 2005 |
| 6855399 |
Copper paste and wiring board using the same |
Feb. 15, 2005 |
| 6830823 |
Gold powders, methods for producing powders and devices fabricated from same |
Dec. 14, 2004 |
| 6826031 |
Ceramic electronic component and production method therefor |
Nov. 30, 2004 |
| 6814893 |
Conductive adhesive agent, packaging structure, and method for manufacturing the same structure |
Nov. 9, 2004 |
| 6815073 |
Electronic component and method of manufacturing the same |
Nov. 9, 2004 |
| 6812570 |
Organic packages having low tin solder connections |
Nov. 2, 2004 |
| 6806028 |
Photosensitive conductive paste, method for forming conductive pattern using the same, and method for manufacturing ceramic multilayer element |
Oct. 19, 2004 |
| 6780898 |
Adhesive composition |
Aug. 24, 2004 |
| 6780350 |
Metal-carbon composite powders, methods for producing powders and devices fabricated from same |
Aug. 24, 2004 |
| 6762369 |
Multilayer ceramic substrate and method for manufacturing the same |
Jul. 13, 2004 |
| 6757178 |
Electronic circuit equipment using multilayer circuit board |
Jun. 29, 2004 |
| 6753108 |
Energy devices and methods for the fabrication of energy devices |
Jun. 22, 2004 |
| 6737108 |
Microcapsulating conductive metal particles with polymerized monomers |
May. 18, 2004 |
| 6733822 |
Process for producing sintered aluminum nitride furnished with via hole |
May. 11, 2004 |
| 6730245 |
Chemical-mechanical planarization slurries and powders and methods for using same |
May. 4, 2004 |
| 6699304 |
Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom |
Mar. 2, 2004 |
| 6689186 |
Silver-containing particles, method and apparatus of manufacture, silver-containing devices made therefrom |
Feb. 10, 2004 |
| 6679937 |
Copper powders methods for producing powders and devices fabricated from same |
Jan. 20, 2004 |
| 6669079 |
Conductive paste and semiconductor component having conductive bumps made from the conductive paste |
Dec. 30, 2003 |
| 6660680 |
Electrocatalyst powders, methods for producing powders and devices fabricated from same |
Dec. 9, 2003 |
| 6658733 |
Method of manufacturing via interconnection of glass-ceramic wiring board |
Dec. 9, 2003 |
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