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Class Information
Number: 257/E23.073
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Packaging, interconnects, and markings for semiconductor or other solid-state devices (epo) > Arrangements for conducting electric current to or from solid-state body in operation, e.g., leads, terminal arrangements (epo) > Consisting of soldered or bonded constructions (epo) > Leads, i.e., metallizations or lead frames on insulating substrates, e.g., chip carriers (epo) > Characterized by materials (epo) > Conductive materials containing semiconductor material (epo)
Description: This subclass is indented under subclass E23.072. This subclass is substantially the same in scope as ECLA classification H01L23/498M2.

Patents under this class:

Patent Number Title Of Patent Date Issued
8704369 Flip chip bump structure and fabrication method Apr. 22, 2014
8076779 Reduction of macro level stresses in copper/low-K wafers Dec. 13, 2011
7932170 Flip chip bump structure and fabrication method Apr. 26, 2011
6924173 Semiconductor device and method for the fabrication thereof Aug. 2, 2005
6731513 Shielded multi-conductor interconnect bus for MEMS May. 4, 2004
6670634 Silicon carbide interconnect for semiconductor components Dec. 30, 2003
6620650 Chip package and method for manufacturing the same Sep. 16, 2003
6563215 Silicon carbide interconnect for semiconductor components and method of fabrication May. 13, 2003
6559528 Semiconductor device and method for the fabrication thereof May. 6, 2003
6506321 Silicon based conductive material and process for production thereof Jan. 14, 2003
6249053 Chip package and method for manufacturing the same Jun. 19, 2001
6236061 Semiconductor crystallization on composite polymer substrates May. 22, 2001
6002578 Ceramic substrate, circuit substrate and electronic circuit substrate by use thereof and method for preparing ceramic substrate Dec. 14, 1999
5955179 Coating for the structured production of conductors on the surface of electrically insulating substrates Sep. 21, 1999
5855993 Electronic devices having metallurgies containing copper-semiconductor compounds Jan. 5, 1999
5049978 Conductively enclosed hybrid integrated circuit assembly using a silicon substrate Sep. 17, 1991
4589008 Apparatus for electrically joining the ends of substantially parallel semiconductor lines May. 13, 1986

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